Abstract: An RF sensor having a novel current sensing probe and a voltage sensing probe to measure voltage and current. The current sensor is disposed in a transmission line to link all of the flux generated by the flowing current in order to obtain an accurate measurement. The voltage sensor is a flat plate which operates as a capacitive plate to sense voltage on a center conductor of the transmission line, in which the measured voltage is obtained across a resistance leg of a R-C differentiator circuit formed by the characteristic impedance of a connecting transmission line and a capacitance of the plate, which is positioned proximal to the center conductor.

Abstract: A hybrid scanner for switching internal analog buses to system pin channels. Semiconductor switches switch most scanner buses to system pin channels, but mechanical relays perform switching for at least one bus used for high-current test signals. To perform low-impedance guarding and/or high-current backdriving, the low impedance, high current bus is typically connectable to one or more overdriver circuits and a guard voltage potential through mechanical relays. The scanner is capable of supporting in-circuit tests covering the most significant regions of the fault spectrum can be made more reliable and much smaller and less costly than the scanners conventionally used in traditional broad spectrum testers. It turns out that this test-supporting capability can be achieved by adding only a few mechanical relays to an otherwise semiconductor-switch-based scanner. Only those necessary to support low-impedance and high-current test operations.

Abstract: A probe assembly provides the capability to test integrated circuit (IC) packages mounted onto ball grid arrays. The probe assembly comprises a ball grid probe having connectors mounted onto opposite sides of a circuit board. A first BGA header is mounted to one side of the probe while a first BGA socket is mounted to the other side of the probe. The socket is adapted to receive an integrated circuit which is mounted onto a second BGA header. A second BGA socket is mounted to a printed circuit board and is adapted to receive the ball grid probe via the first BGA header. An interconnection device is provided to electrically couple the ball grid probe to a number of test instruments.

Abstract: A sensor for the measurement of moisture in a flow of material, especially loose material such as meal material, grains, granulates and similar materials which are to be pressed to form feed pills in presses. The sensor comprises a tube piece of an electrically conductive material with circular cross-section, and an elongated pole which is of circular cross-section and is disposed with its longitudinal axis concentrically and electrically insulated in the tube piece, and which consists of an electrically conductive material. When the moist material flows between the inside surface of the tube piece and the outer side of the pole, the sensor works with the moist material's conductivity as a condenser for the capacitive detection of the moistness, which can be determined on the basis of the detection.

Abstract: A probe apparatus for the electrical inspection of a printed circuit board (PCB) assembly includes a probe assembly for inspecting the electrical circuitry of a PCB having electronic components mounted thereon. A first driving mechanism is provided for moving the probe assembly rectilinearly, and a guide is provided for guiding the rectilinear movement of the probe assembly. The probe assembly includes a probe tip for making contact with a solder joint on the PCB to detect a signal for the electrical inspection, a force sensor combined with the rear portion of the probe tip for measuring a contact force applied to the probe tip when the probe tip makes contact with the solder joint, a location sensor for measuring the location of the probe tip when in contact with the solder joint, and a device for controlling the location of the probe tip, according to the measured contact force and location thereof.

Abstract: Herein disclosed is a test device for testing an integrated circuit (IC) chip having side edge portions each provided with a set of lead pins. The test device comprises a socket base, contact units each including a contact support member and socket contact members, and anisotropic conductive sheet assemblies each including an elastic insulation sheet and conductive members. The anisotropic conductive sheet assemblies are arranged to hold each conductive member in contact with one of the socket contact members of the contact units. The test device further comprises a contact retainer detachably mounted on the socket base to bring the socket contact members into contact with the anisotropic conductive sheet assemblies to establish electrical communication between the socket contact members and the conductive members of the anisotropic conductive sheet assemblies.

Abstract: First and second bumps electrically connected at first and second positions along a conductive run borne by a flexible substrate are respectively oriented for contact with a pad of a die under test and a pad of a tester. A probe frame is bonded to the substrate between connector frames bonded at opposite ends of the substrate. Alternatively, a pair of bumps exposed on the same surface of a flexible substrate are electrically connected at different positions along a conductive run. One of the bumps is oriented for contact with a pad of a die under test, and the other is in contact with a pad on a surface of a printed circuit board directed away from the die. The pad of the printed circuit board is provided for electrical connection to a tester.

Abstract: An integrated circuit includes functional circuitry for performing normal operating functions of the integrated circuit, an output terminal which is accessible externally of the integrated circuit, and an output drive circuit (OB,OA) for receiving an output signal from the functional circuitry and driving the output signal to the output terminal. A switch (TG1,S1) is provided for selectively isolating the output terminal from the functional circuitry, and the switch is connected between the functional circuitry and the output drive circuit.

Abstract: An ion-beam apparatus and method for analyzing and controlling integrated circuits. The ion-beam apparatus comprises a stage for holding one or more integrated circuits (ICs); a source means for producing a focused ion beam; and a beam-directing means for directing the focused ion beam to irradiate a predetermined portion of the IC for sufficient time to provide an ion-beam-generated electrical input signal to a predetermined element of the IC. The apparatus and method have applications to failure analysis and developmental analysis of ICs and permit an alteration, control, or programming of logic states or device parameters within the IC either separate from or in combination with applied electrical stimulus to the IC for analysis thereof.

Abstract: The invention describes a method and an apparatus for generating and receiving electromagnetic waves for test purposes and is applicable particularly for measurements, investigations and tests of electromagnetic compatibility. For testing the immunity, the test piece is acted upon with defined field parameters and, during the emission measurement, the electromagnetic radiation emitted by the test piece is measured. It is an important distinguishing feature of the invention that a cell, constructed as a TEM waveguide, is rotated about the test piece. The apparatus is characterized in that the lid and bottom of the pyramidal cell are constructed so as to be electrically conducting and in that two-dimensional septa, which consist of individual wires of equal length, are disposed in each case symmetrically at a small distance from the lid and the bottom.

Abstract: A carrier for testing a singularized semiconductor die prior to packaging the die utilizes a removable die supporting substrate. The die is placed in the carrier and is electrically connected to the substrate, thereby allowing for the packaging or other use of only known good die. A bridge clamp presses against a rigid cover which, in turn, bias the die against a plurality of die contacting members located on the die supporting substrate. The use of the removable die supporting substrate permits a single carrier design to accommodate different die types and further permits handling equipment to mechanically handle the one carrier design. This facilitates the handling of the carrier so that the carrier can be conveniently used during burn-in and test procedures.

Abstract: A system for detecting accretion of frazil ice on underwater gratings comses a pair of parallel electrically conductive bars mounted side-by-side, for disposition beneath a water surface and spaced from but proximate an underwater intake grating. The system further includes a coaxial transmission line connected at a first end to the pair of bars for extension from the bars upwardly above the water surface, and a time domain reflectometer disposed above the water surface for generating electromagnetic pulses and having a second end of the transmission line fixed thereto. The transmission line facilitates propagation of the pulses to the bars for further travel to distal ends of the bars, and back to the reflectometer. The reflectometer is adapted to compute pulse round trip travel time in the bars and to compute changes in the round trip travel time, from which can be determined absence, presence, and build-up of frazil ice on the bars, providing an indication of same on the grating.

Abstract: First and second bumps electrically connected at first and second positions along a conductive run borne by a flexible substrate are respectively oriented for contact with a pad of a die under test and a pad of a tester structure. Second and third conductive regions are electrically connected respectively to the power and ground terminals of a power source and an electrical device. The second and third regions are spaced from a first conductive region to filter high-frequency noise components from power and ground potentials provided by the power source.

Abstract: A test apparatus and method for testing integrated circuit modules permitting visual observation of both top and bottom of the module under test. The test apparatus uses a first circuit board and a second circuit board interconnected by means of cables between cable sockets attached to each circuit board. The first circuit board has a display opening. An integrated circuit socket having a center opening is attached to the first circuit board so that the center opening of the integrated circuit socket is directly over the display opening of the first circuit board. Input connectors and jumper sockets attached to the second circuit board permit electrical signals to be connected to the integrated circuit socket contacts. Integrated circuit modules inserted into the integrated circuit socket can be visually observed directly or through the display opening in the first circuit board.

Abstract: Disclosed are a die carrier and associated method for conducting probe beam tests on chips designed to be packaged in flip-chip packages. The die carrier is a specially modified membrane type carrier that includes a probe access region, such as an opening, in the membrane. A die to be tested is mounted in the die carrier such that its I/O pads make electrical contact with corresponding bump contacts on the membrane. The die/carrier assembly is then mounted in a test socket provided on a chip testing apparatus such that electrical I/O signals can be provided to and from an external test circuit. While the die is being electrical tested, a probe beam is directed through the probe access region and onto the chip active surface. In this manner, the chip active surface is probed while exposed to electrical stimulus.

Abstract: Simple methods for magnetooptic current measurement and magnetooptic current-measuring devices are specified, which are independent of temperature influences on the measurement result and require no compensation device for the light intensity of light sources (LD1, LD2) employed. Light beams (1, 2) from the two laser light sources (LD1, LD2) are alternately polarized orthogonally relative to one another by means of a beam splitter (3), and are transmitted to light detectors (D.sub.A, D.sub.B) via collimators (4, 6), which are connected via a polarization-maintaining high-index birefringent HI fiber (5), through a magnetooptic current sensor (7), an analyzer (10), 2 collimators (11, 12) and multimode fibers (13) and (14). 1st and 2nd light output signals S.sub.A1 and S.sub.B1 as well as 3rd and 4th light output signals S.sub.A2 and S.sub.B2 are derived sequentially in time from the light detectors (D.sub.A, D.sub.B).

Abstract: An apparatus for demonstrating and testing the operation of an arcing fault detector. The apparatus comprises an electrical circuit including line and neutral conductors connected between a power source and a load. A selector switch is movable between a first position and a second position in order to selectively route load current across either an arcing fault detector or standard circuit breaker. A pair of electrodes is positioned between said selector switch and the load for producing an arcing condition on the line conductor.

Abstract: A wafer prober testing device uses a test head safety interlock system to prevent inadvertent movement of a test head which is locked to a head plate. The test head is movable between a raised position and a lowered position, and is mounted to the head plate when it is in the lowered position. A test head controller controls the movement of the test head between the raised position and the lowered position. A locking lever, which is mounted to the head plate, is movable between a lock position and an unlock position. The locking lever locks the test head to the head plate when the test head is in the lowered position, to ensure that the testing equipment is accurately aligned and that there are satisfactory electrical contacts, as even a minor misalignment of the testing equipment, or a slight vibration or discontinuity with the probe pads will lead to inaccurate test results.

Abstract: An improved isolated current sensing device. The invention consists of two magnetizable cores which surround the conductor carrying the current to be measured. The two cores are cyclically saturated in opposite directions by a high-frequency excitation current counter-wound around the two cores. The device then detects through an output winding the asymmetry in the core magnetic fluxes caused by the current-carrying conductor. The output signal is passed through a phase-sensitive detector tuned to twice the original excitation frequency. Negative feedback is used to stabilize the device.

Abstract: A phase meter and method of providing a voltage indicative of a phase difference between a reference signal and an input signal in which the amplitudes of the two signals are made approximately the same to cancel potential phase errors caused by different amplitudes, and the two signals are provided to two matched comparators, one receiving the input signal and the other receiving the reference signal. The two matched comparators are connected together so as to provide an output logic signal in accordance with a prescribed, unconventional, truth table. The output logic signal is a pulse whose duration is proportional to the phase difference. The output logic signal is converted to a voltage indicative of the phase difference between the reference signal and the input signal. The phase meter is relatively simple to make and a preferred embodiment measures phase shift directly with a 10 mV/degree output at up to 10 MHz.