Abstract: A method of enhancing the corrosion resistance of an austenitic steel includes removing material from at least a portion of a surface of the steel such that corrosion initiation sites are eliminated or are reduced in number relative to the number resulting from processing in a conventional manner. Material may be removed from the portion by any suitable method, including, for example, grit blasting, grinding and/or acid pickling under conditions more aggressive than those used in conventional processing of the same steel.

Abstract: A photoresist stripping apparatus and a corresponding method for removing photoresist layers after a patterned polyimide layer is developed. The photoresist-stripping apparatus includes a transporting unit, a stripping unit, a washing unit, a drying unit and a control unit. The transporting unit connects the stripping unit, the washing unit and the drying unit. The control unit is responsible for controlling the transport sequence and timing of the transporting unit. The method of stripping the photoresist layer off the OLED panel includes providing a stripping solution to the stripping unit to remove photoresist layers. The OLED panel is jet-cleaned with a washing solution in the washing unit so that any residual stripping agent is removed. Finally, the surface of the OLED panel is blown dry.

Abstract: A method of treating semiconductor wafers in a sealed container is provided and includes transferring and vertically placing a plurality of wafers in the container and sealing the container. An inert gas is fed into the sealed container and a quantity of warm pure water is fed into the sealed container sufficient to completely submerge the plurality of wafers and establish a level of the warm pure water in the sealed container. A vapor or fog of an organic solvent is fed into at least a space in the sealed container above the level of the warm pure water and is then terminated at a prescribed time. The plurality of wafers is dried by aspirating the warm pure water through an outlet in the bottom of the container wherein the pressure in the container is reduced during the aspiration. The inert gas is fed into the sealed container until at least the termination of the drying of the plurality of wafers.

Abstract: There is proposed an apparatus and method for cleaning a semiconductor substrate, which make it possible to minimize the adhesion of mist in a cleaning tank at the occasion of cleaning a semiconductor substrate, to realize a-high removal effect of residual polishing particles, and to enable to obtain a clean surface. In view of preventing a mist generated by the jet of high pressure water from re-adhering to the substrate during the cleaning of a semiconductor substrate, a cover member is disposed at a mist-generating region so as-to prevent the splash of the mist. Additionally, a cavity is caused to generate by contacting a high pressure water with a still water, and high-frequency generated by the generation of the cavity is utilized for removing the residual polishing particles. Alternatively, the ejection of high pressure water against the surface of the substrate is performed in a liquid phase such-as ultrapure water, thereby preventing the generation of mist.

Abstract: In order that sensitive structures of inkjet printing mechanisms be cleaned without damaging these structures, a cleaning sheet and a process of using the sheet has been created. Debris and dried ink is removed from print cartridges and their carriage using a cleaning sheet having two strips of material spaced with a napped surface disposed longitudinally between the side edges and spaced apart from each other. By controlling the distance the strips are spaced from the sheet feed edge of the cleaning sheet, the print cartridges can be placed adjacent the strips for scrubbing against the strips without resulting in a media jam in the printer due to the increased thickness of the cleaning sheet.

Abstract: A glass article comprising a glass body having a surface and a water-soluble surface-protection film formed on the surface. The water-soluble surface-protection film is made of hydroxy acid or salt thereof. The hydroxy acid or the salt thereof is one or more kinds selected from the group consisting of citric acid, tartaric acid, malic acid, gluconic acid and salts thereof. An example of the glass body is a funnel part having an anode button for a CRT.

Abstract: Workpieces requiring low levels of contamination, such as semiconductor wafers, are loaded into a rotor within a process chamber. The process chamber has a horizontal drain opening in its cylindrical wall. The chamber is closed via a door. A process or rinsing liquid is introduced into the chamber. The liquid rises to a level so that the workpieces are immersed in the liquid. The chamber slowly pivots or rotates to move the drain opening down to the level of the liquid. The liquid drains out through the drain opening. The drain opening is kept near the surface of the liquid to drain off liquid at a uniform rate. An organic solvent vapor is introduced above the liquid to help prevent droplets of liquid from remaining on the workpieces as the liquid drains off. The rotor spins the workpieces to help to remove any remaining droplets by centrifugal force.

Abstract: A cleaning system and a cleaning method is provided with a cleaning medium comprising a magnetic substance and a magnetic field generating device for applying a magnetic force to the magnetic substance in the cleaning medium so that the magnetic substance and the area to be cleaned are rubbed together. The area to be cleaned is cleaned by the rubbing action of the cleaning medium. The interior of the cleaned object not reachable by hands or instruments can be easily cleaned with this device. The cleaning medium, made of a magnetic substance, is guided into the interior of the cleaned object. The magnetic field generating device generates a magnetic field in the cleaning medium and thereby applies a force to the magnetic substance. By rubbing the magnetic substance on the inner wall surface of the area to be clean, the object can be cleaned efficiently.

Abstract: A device and method that cleans microwave ovens through a chemical action, specifically to an agent that is placed into the microwave oven, and then activated by operating the oven for a period of time. Different embodiments include a devise composed of an open cell container filled with solution; an open cell container with an attached sponge(s) and filled with solution; and a sponge that contains a cleaning solution in hydrant or dehydrated form. In some of the described embodiments, the devise has a tear off membrane seal to maintain the solution within the cell prior to use. Another embodiment described has a bottle hanger attached to a cell. All embodiments maintain a process to absorb excess microwave energy.

Abstract: A semiconductor wafer is cleaned while a sponge or brush is pressed against the wafer with a constant forced applied utilizing a bias in a constant force pencil. The wafer is cleaned in the state wherein a collapsing portion of the constant force pencil with respect to the cleaning sponge cloth is set in such a way that the cleaning pressure, which is applied from the cleaning sponge to the wafer, can be constant and is adjustable. A method for cleaning wafers using a constant force pencil is also described.

Abstract: Semiconductor wafer (11) are uniformly and thoroughly cleaned of particulate and organic contaminants by sweeping the wafer with a hydraulic broom that sprays cleaning solution onto the wafer. The broom contains an aspirating nozzle (3) for connection to a source of pressurized gas, such as nitrogen, and to a source of cleaning fluid, such as acetone, wherein cleaning fluid aspirated by the gas stream is expressed through the nozzle outlet to impact the surface of the wafer, dislodging particulate matter and dissolving organic contaminants. A programmed controller (9) controls movement of the hydraulic broom relative to the wafer to ensure that the entire surface is cleaned and permits a variety of sweeping patterns.

Abstract: A method of dry cleaning surfaces of a semiconductor wafer includes the steps of placing a processed wafer in a vacuum environment and positioning a pad near each of a front surface and a back surface of the wafer. Cleaning gas is injected into a small clearance formed between each pad and the front and rear surfaces to generate a high-speed gas flow along the surface of the wafer. Particles left at the surfaces of the processed wafer are physically cleaned and removed with the high-speed gas flow. In order to assist this physical cleaning action, it is also possible to apply either a chemical cleaning method or an electrical cleaning method under application of plasma.

Abstract: In a method and an apparatus for automatically cleaning at least the cooking chamber of a cooking device upon use of a fluid, the fluid is selected from a first fluid comprising cleaning agent, rinse agent, decalcification agent, water and/or the like, and/or from a second fluid that is acquired from the third fluid discharging from the cooking chamber during cleaning on the basis of at least partial cleaning thereof. At least one spray head is provided to which the first fluid from at least a first reservoir and/or the second fluid can be supplied via a line system from a processing unit connected to the discharge conduit of the cooking chamber. The processing unit has at least a second reservoir, a cleaning unit, and a pump unit.

Abstract: A method of reconditioning the reaction chamber of an etching reactor and controlling critical dimensions of an etch layer. After dry-cleaning or preventive maintenance, gaseous nitrogen and hydrogen are introduced into the reaction chamber and a dummy wafer is placed inside the reaction chamber. A radio frequency (RF) power source is switched on to initiate a wafer etching operation. Photoresist material on the dummy wafer reacts with the gases inside the reaction chamber to form high molecular weight particles so that the chamber is reconditioned within a very short time. Alternatively, instead of a dummy wafer, a production wafer with an etch-pending layer that can react with gaseous nitrogen and oxygen may be placed inside the reaction chamber after a dry cleaning or preventive maintenance. Gaseous nitrogen and hydrogen are introduced into the reaction chamber and then RF power is switched on to initiate wafer etching.

Abstract: A polymer electrolyte battery having a high discharge capacity, a high mechanical strength, and a high heat resistance is provided. This polymer electrolyte battery includes: a polymer electrolyte layer 51 covering an edge face 20a of a positive electrode plate 20 and an edge part 40b of a porous membrane 40; a polymer electrolyte layer 52 covering an edge face 30a of a negative electrode plate 39 and an edge part 40c of the porous membrane 40; and a polymer electrolyte layer 53 covering an edge face 40a of the porous membrane 40 in a manner that connects the polymer electrolyte layer 51 with the polymer electrolyte layer 52.

Abstract: An oxide and coating removal system includes a mobile gantry or transport system supporting an end effector and high energy waterjet rotating nozzles judiciously located relative to the surface of the vehicle and includes positioning mechanism for locating the nozzle discretely relative to the vehicle. An environmentally safe system serves to re-claim the effluent by removing the contaminated particles and returning the re-claimed water to the pumping system.

Abstract: A substrate treatment assembly for treating a work object on a surface of a substrate by supplying to the work object a wet ozone-containing gas wetted with a treatment solution includes a substrate heating device for maintaining a substrate at a temperature higher than room temperature, a wetting device for producing a wet ozone-containing gas by wetting an ozone-containing gas with a treatment solution, a supply device for supplying the wet ozone-containing gas to a work object on a surface of the substrate, a gas conduit connecting the wetting device to the supply device, and a heating device for heating the wet ozone-containing gas to a temperature approximately equal to or greater than the temperature of the substrate.

Abstract: A photoresist stripping apparatus and a corresponding method for removing photoresist layers after a patterned polyimide layer is developed. The photoresist-stripping apparatus includes a transporting unit, a stripping unit, a washing unit, a drying unit and a control unit. The transporting unit connects the stripping unit, the washing unit and the drying unit. The control unit is responsible for controlling the transport sequence and timing of the transporting unit. The method of stripping the photoresist layer off the OLED panel includes providing a stripping solution to the stripping unit to remove photoresist layers. The OLED panel is jet-cleaned with a washing solution in the washing unit so that any residual stripping agent is removed. Finally, the surface of the OLED panel is blown dry.

Abstract: The present invention is a method and apparatus for shielding the lens and the field of view of an optical device, such as a camera or an image projector, from obstruction by unwanted contaminants such as dust, dirt, rain, and the like. The invention employs a transparent shield positioned to protect the lens from such contaminants. A wiper is positioned to be in contact with the shield but the wiper is also positioned to not obstruct the field of view. A rotation mechanism is used to cause rotation of the shield. Contaminants that may be deposited upon the shield may be wiped from the shield by the wiper yet the wiper does not obstruct the field of view. Rotation of the shield allows a portion of the shield that is obstructed by a contaminant to be rotated away from the field of view. Rotation of the shield allows a portion of the shield that has been wiped to be rotated into the field of view.

Abstract: A method for reducing contamination of HEPA filters with radioactive and/or hazardous materials is described. The method includes pre-processing of the filter for removing loose particles. Next, the filter medium is removed from the housing, and the housing is decontaminated. Finally, the filter medium is processed as pulp for removing contaminated particles by physical and/or chemical methods, including gravity, flotation, and dissolution of the particles. The decontaminated filter medium is then disposed of as non-RCRA waste; the particles are collected, stabilized, and disposed of according to well known methods of handling such materials; and the liquid medium in which the pulp was processed is recycled.