Patents Examined by Gerald Stevens
  • Patent number: 9035723
    Abstract: The present invention discloses a filter for removing noise, which includes: a lower magnetic substrate; a coil layer disposed on the lower magnetic substrate and including at least one conductor pattern and an insulating layer covering the conductor pattern; an upper magnetic substrate disposed on the coil layer; and a magnetic permeability enhancing layer disposed on the magnetic substrate with lower magnetic permeability of the lower magnetic substrate and the upper magnetic substrate. According to the present invention, it is possible to implement a filter for removing noise with high performance, characteristics, and reliability by increasing magnetic permeability to improve impedance characteristics and improving an effect of shielding electromagnetic waves such as jamming.
    Type: Grant
    Filed: March 14, 2012
    Date of Patent: May 19, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong Suk Kim, Young Ghyu Ahn, Young Seuck Yoo, Jeong Bok Kwak, Sang Moon Lee, Kang Heon Hur, Sung Kwon Wi
  • Patent number: 9030278
    Abstract: A method of tuning the frequency of a waveguide filter including the step of removing dielectric material from one or both of the first and second opposed exterior side surfaces of the waveguide filter to cause a change in the center frequency of the waveguide filter. In one embodiment, dielectric material is removed from one or both of the first and second opposed exterior side surfaces of the waveguide filter in unequal amounts wherein the tuned waveguide filter includes first and second slits defined in the respective first and second opposed exterior side surfaces which extend unequal first and second distances into the body of the waveguide filter.
    Type: Grant
    Filed: August 2, 2012
    Date of Patent: May 12, 2015
    Assignee: CTS Corporation
    Inventor: Reddy R. Vangala
  • Patent number: 9019038
    Abstract: An electrical component, e.g., a diplexer or a duplexer, can have one of a number of diverse arrangements for terminal surfaces on the substrate bottom. For example, the terminal surfaces for first and second filters are not disposed at the maximum distance from one another. First and second filters can be disposed as one or two discrete components on the substrate, wherein one filter can be implemented as being integrated in a multilayer substrate.
    Type: Grant
    Filed: March 24, 2010
    Date of Patent: April 28, 2015
    Assignee: Epcos AG
    Inventors: Maximilian Pitschi, Juergen Kiwitt, Andreas Fleckenstein
  • Patent number: 9000868
    Abstract: The present disclosed technique pertains to high Q mode resonators, and, more particularly, to a technique for separating a high Q mode from masking low Q modes. In a first aspect, it includes a high Q mode resonator, comprising: a housing defining a clover-shaped resonating cavity; a dielectric material filling the cavity; an input to the cavity; and an output from the cavity. In a second aspect, it includes a high Q mode resonator, comprising: a housing defining a clover-shaped resonating cavity, the cavity comprising four intersecting right angle, cylindrical chambers; a fluid dielectric material filling the cavity; an input to the cavity; and an output from the cavity. In a third aspect, it includes a method, comprising: introducing a signal to a resonating cavity; resonating the signal within a chamber, the resonating cavity shifting the resonance of the low Q mode higher in frequency than it shifts the high Q mode; and permitting egress of the signal from the resonating cavity.
    Type: Grant
    Filed: August 11, 2009
    Date of Patent: April 7, 2015
    Assignee: Lockheed Martin Corporation
    Inventor: Ronald L. Squillacioti
  • Patent number: 8988172
    Abstract: A multifunction electronics member combining structural and electronics functions includes in one embodiment an elongate longitudinally-extending structural body configured to support a structural load and including a first support base, a stiffening projection, and a first electrical circuit supported by the first support base. The circuit preferably is embedded between the first circuit base and a cover to form an electrically-active, or in some embodiments passive, structural member.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: March 24, 2015
    Assignee: Lockheed Martin Corporation
    Inventor: Marc T. Angelucci
  • Patent number: 8981877
    Abstract: A radio frequency (RF) filter includes an input port configured to receive a signal, an output port configured to output a signal, and a tuning probe configured to be movable within a tuning probe port to adjust filter characteristics. The tuning probe port is configured to receive the tuning probe therein, and a locking mechanism is configured to lock the tuning probe in the tuning probe port at a desired depth and further configured to prevent movement of the tuning probe in the tuning probe port when the locking mechanism is in a locked configuration.
    Type: Grant
    Filed: July 19, 2012
    Date of Patent: March 17, 2015
    Assignee: Dielectric, LLC
    Inventor: Francis Baldwin
  • Patent number: 8975985
    Abstract: A frequency-tunable microwave bandpass filter including a wave guide having a rectangular cross-section and including a stationary first conductive portion I and a movable second conductive portion II. The first portion includes first conductive partitions having one or more conductive obstacles related to complementary openings in the section of the guide that forms capacitive irises. The first partitions are transversely mounted, at the propagation of the wave in the guide, define cavities in the longitudinal direction of the guide, are rigidly connected to the first portion and the second conductive partitions that have one or more openings defining capacitive irises, and, in combination with the adjacent guide lengths, form immitance inverters. The first partitions form a series of resonating cavities coupled by the immitance inverters. A means ensures electrical contact between the conductive portions I and II.
    Type: Grant
    Filed: December 17, 2010
    Date of Patent: March 10, 2015
    Assignee: Thales
    Inventor: Bernard Meuriche
  • Patent number: 8970327
    Abstract: A filter is provided with a planar transmission line and a combined via structure connected to (both) one ends of the planar transmission line. The planar transmission line and the combined via structure are disposed in a same multilayer board. The combined via structure comprises two working parts. The first working part comprises a segment of signal via and a plurality of segments of ground vias surrounding the signal via. The second working part comprises a segment of the same signal via, a plurality of segments of the same ground vias, smooth conductive plate and corrugated conductive plate. The smooth conductive plate and the corrugated conductive plate are connected to the signal via. The second working part comprises a segment of the same signal via, a plurality of segments of the same ground vias and corrugated conductive plate. The corrugated conductive plate is connected to the signal via.
    Type: Grant
    Filed: December 25, 2008
    Date of Patent: March 3, 2015
    Assignee: NEC Corporation
    Inventor: Taras Kushta
  • Patent number: 8947177
    Abstract: The microwave signals are coupled from a transmission line embedded in a Printed Circuit Board PCB to a resonant cavity mounted on an external metalized surface of this PCB. The coupling mechanism implements an easy-to-fabricate mechanism leading to high-quality filtering owing to the fact that the end of the transmission line is provided with a metalized feeding pad located at the external layer of the PCB inside the resonant cavity. The resonant cavity is provided with a re-entrant inner stub orthogonal to the PCB and separated from the PCB by a capacitive gap. The metalized feeding pad is facing the inner stub in the area of the capacitive gap and is offset from the axial direction of this inner stub. The metalized feeding pad is further separated from the external metalized surface of the PCB by a surface capacitive gap.
    Type: Grant
    Filed: June 21, 2011
    Date of Patent: February 3, 2015
    Assignee: Alcatel Lucent
    Inventor: Titos Kokkinos
  • Patent number: 8933768
    Abstract: Metallization layer structures for reduced changes in radio frequency characteristics due to registration error and associated methods are provided herein. An example resonator includes a first conductive layer defining an error limiting feature and a second conductive layer. The resonator further includes at least one communication feature configured to electrically couple the first conductive layer and the second conductive layer at a communication position. The error limiting feature is configured to reduce changes in radio frequency characteristics of the resonator due to registration error. Methods of manufacturing resonators are also provided herein.
    Type: Grant
    Filed: October 24, 2012
    Date of Patent: January 13, 2015
    Assignee: ZIH Corp.
    Inventors: Edward A. Richley, Sifen Luo
  • Patent number: 8928431
    Abstract: A low pass filter includes an RF input terminal, an RF output terminal, a plurality of inductors coupled in series between the RF input and output terminals, at least one electrically tunable capacitor coupled between ground and a node of one of the inductors. At least one of the inductors includes a winding, and a resistance and a capacitance coupled in series across a portion of the winding to enhance the out of band rejection of the low pass filter.
    Type: Grant
    Filed: February 1, 2011
    Date of Patent: January 6, 2015
    Assignee: Hittite Microwave Corporation
    Inventor: Michael Koechlin
  • Patent number: 8922305
    Abstract: A microstrip combline bandpass filter includes an input port, an output port, and a plurality of resonators each including a microstrip line having a first end and a second end. One of the plurality of resonators is connected to the input port, and another of the plurality of resonators is connected to the output port. The filter also includes a plurality of pairs of series coupled varactors. The first end of each microstrip line is coupled to one of the pairs of varactors, and the second end of each microstrip line is coupled to ground.
    Type: Grant
    Filed: May 12, 2011
    Date of Patent: December 30, 2014
    Assignee: Hittite Microwave Corporation
    Inventor: Ekrem Oran
  • Patent number: 8912868
    Abstract: A bandstop filter configured to suppress a spurious resonance frequency includes a resonator and a transmission line that is coupled to the resonator at a first junction and at a second junction with a length ? of transmission line running between the two couplings. The configuration provides two signal paths so that constructive interference occurs at the spurious resonance, and destructive interference occurs at a fundamental bandstop frequency. This provides spurious suppression by effectively cancelling out resonator couplings via the constructive interference, extending the upper passband of the bandstop filter to any degree required by the application.
    Type: Grant
    Filed: July 20, 2012
    Date of Patent: December 16, 2014
    Assignee: The United States of America, as represented by the Secretary of the Navy
    Inventor: Andrew C. Guyette
  • Patent number: 8907749
    Abstract: An apparatus includes a filter that includes a multi-layer planar structure having a first layer and a second layer. The first layer includes an electronic band-gap structure that is configured to suppress a first frequency component of signals passing through the filter. The second layer includes a quarter-wavelength stub that is configured to suppress a second frequency component of the signals passing through the filter.
    Type: Grant
    Filed: March 20, 2012
    Date of Patent: December 9, 2014
    Assignee: Cisco Technology, Inc.
    Inventor: Miroslav Pajovic
  • Patent number: 8878632
    Abstract: A laminated filter includes a first insulation layer including first and second coil patterns and a first capacitor pattern and a second insulation layer including third and fourth coil patterns and second and third capacitor patterns. The first and second coil patterns are located near one longer side of the first insulation layer and connected to the third and fourth coil patterns through penetration electrodes in the first insulation layer. The third and fourth coil patterns extend to ends of the second insulation layer through extension patterns and are connected to external electrodes to define input and output inductors. The first capacitor pattern is located near the other longer side of the first insulation layer and connected to an external ground electrode through an extension pattern. The first capacitor pattern faces the second and third capacitor patterns with the first insulation layer interposed therebetween to define input and output capacitors.
    Type: Grant
    Filed: August 11, 2010
    Date of Patent: November 4, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yosuke Matsushita, Masashi Miyamoto
  • Patent number: 8878634
    Abstract: [Object] An object is to provide a bandpass filter that can be used for a wide frequency band and has a large degree of freedom in designing a passband, and a wireless communication module and a wireless communication device that use the bandpass filter. [Solution] A bandpass filter includes first to third resonance electrodes 31a, 31b, and 31c sequentially arranged side-by-side such that they are electromagnetically coupled to each other, the first to third resonance electrodes 31a, 31b, and 31c being grounded at one end and constituting first to third resonators, respectively; a first input/output coupling electrode 40a facing the first resonance electrode 31a and electromagnetically coupled thereto; a second input/output coupling electrode 40b facing the second resonance electrode 31b and electromagnetically coupled thereto; and a resonator coupling electrode 43 configured to provide electromagnetic coupling between the first resonance electrode 31a and the third resonance electrode 31c.
    Type: Grant
    Filed: November 24, 2009
    Date of Patent: November 4, 2014
    Assignee: Kyocera Corporation
    Inventors: Hiromichi Yoshikawa, Masafumi Horiuchi
  • Patent number: 8860533
    Abstract: A low pass filter includes a signal transmission line, a first open stub, a second open stub, a first coupling line, and a second coupling line. The signal transmission line is connected between a first port and a second port, and operable to transmit RF signals from the first port to the second port. The signal transmission line defines a first side and a second side opposite to the first side. The first open stub and the second stub are disposed on the first side and perpendicularly connected to the signal transmission line. The second open stub and the first open stub co-define a T-shaped gap. The first coupling line is parallel to the signal transmission line and disposed in the T-shaped gap. The second coupling line is parallel to the signal transmission line and disposed on the second side of the signal transmission line.
    Type: Grant
    Filed: March 7, 2011
    Date of Patent: October 14, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Hsuan-Ta Chou
  • Patent number: 8854159
    Abstract: Microstrip filters and methods of operation are described. In one aspect, a filter includes a substrate having a substantially planar surface and a microstrip patch located on the surface of the substrate. The microstrip patch includes multiple symmetric slots in the microstrip patch, a first feed line extending from the microstrip patch, and a second feed line extending from the microstrip patch. The first and second feed lines are asymmetric.
    Type: Grant
    Filed: March 20, 2011
    Date of Patent: October 7, 2014
    Assignee: King Saud University
    Inventors: Abdel F. A. Sheta, Majeed A. R. Alkanhal, Saleh A. Alshebeili, Mohamed A. M. Abouelela
  • Patent number: 8847707
    Abstract: A filter includes a multilayer body including a plurality of insulator layers stacked on top of one another. Outer electrodes are provided on surfaces of the multilayer body. A first resonator is connected to a first one of the outer electrodes and includes a first coil. A second resonator is connected to a second one of the outer electrodes and includes a second coil. A third resonator includes a third coil that is magnetically coupled with the first and second coils. The first and second coils are respectively defined by coil conductor layers provided on an insulator layer. The third coil is defined by via hole conductors that penetrate through the insulator layer in a z-axis direction.
    Type: Grant
    Filed: March 15, 2012
    Date of Patent: September 30, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hiroshi Masuda, Takahiro Mori
  • Patent number: 8847706
    Abstract: An multiband resonator of the present invention includes a dielectric substrate including three or more dielectric layers, a ground conductor, a main-line conductor, a sub-line conductor, a sub open stub, a main open stub, a short-circuit conductor, a main through conductor, and a sub through conductor. The short-circuit conductor electrically connects one end of the main-line conductor to one end of the sub-line conductor and to the ground conductor. The main through conductor electrically connects the other end of the main-line conductor to one end of the main open stub that is aligned with that other end of the main-line conductor. The sub through conductor electrically connects the other end of the sub-line conductor to one end of the sub open stub that is aligned with that other end of the sub-line conductor.
    Type: Grant
    Filed: June 22, 2011
    Date of Patent: September 30, 2014
    Assignee: NTT DoCoMo, Inc.
    Inventors: Kei Satoh, Shoichi Narahashi, Yuta Takagi