Patents Examined by Gordon Jones
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Patent number: 11859914Abstract: The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. A fluid may be contained within the wicking structure and vapor chamber for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane, wherein the fluid may be driven by capillary forces within the wicking structure. The intermediate substrate may form narrow channels within the wicking structure, providing high capillary forces to support large pressure differences between the liquid and vapor phases, while minimizing viscous losses of the liquid flowing in the wicking structure.Type: GrantFiled: December 2, 2021Date of Patent: January 2, 2024Assignee: PIMEMS, INC.Inventor: Payam Bozorgi
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Patent number: 11858641Abstract: An aircraft includes a fuselage defining a cabin region and a crown region. The aircraft also includes a duct disposed within the fuselage. The duct is coupled to one or more drying air vents disposed in the crown region and coupled to one or more cabin vents disposed with the cabin region. The one or more drying air vents are configured to output drying air, received via the duct, into the crown region, and the one or more cabin vents are configured to output conditioned air, received via the duct, into the cabin region. The aircraft further includes one or more valves coupled to the duct and configured to, in a first valve position, route airflow within the duct to the one or more drying air vents and configured to, in a second valve position, route the airflow within the duct to the one or more cabin vents.Type: GrantFiled: October 24, 2019Date of Patent: January 2, 2024Assignee: THE BOEING COMPANYInventors: Michael L. Trent, Warren A. Atkey
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Patent number: 11851171Abstract: A heat exchanger for a transmission unit of an aircraft is described that comprises: a first module defining a first feed path for a first fluid to be cooled; a second module defining a second feed path for a second cooling fluid; the first and second feed paths being thermally coupled to each other; each second module comprising: at least one cell formed by an inlet for a second cooling fluid; an outlet for the second cooling fluid, which is arrange on the opposite side to the inlet along a first direction; a first wall thermally coupled to the first path; a pair of second walls; and a plurality of fins projecting in a cantilever fashion from the first wall. The heat exchanger further comprises at least a first row of fins, which lie on a plane orthogonal to the first direction, the fins of the first row extending at progressively increasing distances from one of the second walls along a second direction orthogonal to the first direction.Type: GrantFiled: July 26, 2019Date of Patent: December 26, 2023Assignee: LEONARDO S.P.A.Inventors: Paolo Pisani, Federico Montagna, Stefano Poggi
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Patent number: 11852420Abstract: A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface thereof, and is thermally contacted with the heat source to absorb heat generated from the heat source. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passes through the evaporator, absorbs heat, and is transformed into vapor to flow out of the evaporator.Type: GrantFiled: February 15, 2023Date of Patent: December 26, 2023Assignee: Acer IncorporatedInventors: Yung-Chih Wang, Jau-Han Ke, Wen-Neng Liao, Cheng-Wen Hsieh
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Patent number: 11841195Abstract: A brazed plate heat exchanger comprises a number of heat exchanger plates (100) provided with a pressed pattern comprising ridges (R) and grooves (G). The ridges and grooves of neighboring plates contact one another in order to keep the plates on a distance from one another under formation of interplate flow channels for media to exchange heat when the heat exchanger plates are placed in a stack to form the heat exchanger. Means (120a, 120b) are provided for allowing temperature measurement of a fluid present in a second flow channel counted from an end of the stack of heat exchanger plates (100).Type: GrantFiled: December 11, 2017Date of Patent: December 12, 2023Assignee: SWEP INTERNATIONAL ABInventors: Tomas Dahlberg, Sven Andersson
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Patent number: 11839165Abstract: A solid state cooler device is disclosed that comprises a first normal metal pad, a first aluminum layer and a second aluminum layer disposed on the first normal metal pad and separated from one another by a gap, a first aluminum oxide layer formed on the first aluminum layer, and a second aluminum oxide layer formed on the second aluminum layer, and a first superconductor pad disposed on the first aluminum oxide layer and a second superconductor pad disposed on the second aluminum oxide layer. The device further comprises a first conductive pad coupled to the first superconductor pad, and a second conductive pad coupled to the second superconductor pad, wherein hot electrons are removed from the first normal metal pad when a bias voltage is applied between the first conductive pad and the second conductive pad.Type: GrantFiled: February 1, 2023Date of Patent: December 5, 2023Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: Aaron Ashley Hathaway, John X. Przybysz, Robert Miles Young, Edward R. Engbrecht
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Patent number: 11828497Abstract: A chilled liquid recirculation device (CLRD) is disclosed. In embodiments, the CLRD has a first air-cooling stage wherein a liquid cooling medium (LCM) is pumped through a first-stage radiator and forced-air chilled by axial fans driving ambient air through the radiator fins. The initially chilled LCM passes to a second thermoelectric-cooling stage wherein a second-stage liquid-cooled heatsink receives the LCM, the liquid-cooled heatsink in contact with the cold side of a thermoelectric module having a hot side in contact with a finned heatsink through which second-stage fans force ambient air, cooling the hot side and thereby further chilling the cold side and the LCM by contact. The twice-chilled LCM is then pumped to a remote chiller device to chill the hot side of another thermoelectric module, thereby chilling a recirculating air supply passing through a finned heatsink in contact with the cold side.Type: GrantFiled: March 10, 2020Date of Patent: November 28, 2023Assignee: B/E Aerospace, Inc.Inventor: Peter J. L. Burd
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Patent number: 11815315Abstract: A flexible heat dissipation device includes an evaporator, a vapor tube, a liquid tube and a condenser. The evaporator has at least one vapor chamber. A capillary structure and a working fluid are received in the vapor chamber. Two ends of the vapor tube is respectively in communication with one end of the evaporator and the condenser. Two ends of the liquid tube are respectively in communication with the evaporator and the condenser, whereby the evaporator, the vapor tube, the condenser and the liquid tube form a loop for the working fluid to flow through. At least one bellows section is disposed on one or both of the vapor tube and the liquid tube. The bellows section has multiple waved stripes. More than one of the heights, widths and pitches of the multiple waved stripes are equal to or unequal to each other.Type: GrantFiled: February 18, 2021Date of Patent: November 14, 2023Assignee: Asia Vital Components (China) Co., Ltd.Inventors: Han-Min Liu, Xiao-Xiang Zhou, Shi-Lei Wei
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Patent number: 11815318Abstract: A multiple tube bank heat exchanger includes a first tube bank including at least a first and a second flattened tube segments extending longitudinally in spaced parallel relationship and a second tube bank including at least a first and a second flattened tube segments extending longitudinally in spaced parallel relationship. The second tube bank is disposed behind the first tube bank with a leading edge of the second tube bank spaced from a trailing edge of the first tube bank. A continuous folded fin extends between the first and second flattened tube segments of both of said first tube bank and said second tube bank.Type: GrantFiled: July 21, 2020Date of Patent: November 14, 2023Assignee: CARRIER CORPORATIONInventors: Michael F. Taras, Arindom Joardar, Luis F. Avila, Bruce J. Poplawski, Jack L. Esformes, Melkamu Woldesemayat
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Patent number: 11815297Abstract: Disclosed is a power generation device including a case including a through hole configured to pass therethrough in a first direction and form an inner surface, a duct disposed in the through hole of the case and having a flow path such that a first fluid flows in a second direction perpendicular to the first direction, a first thermoelectric module including a first thermoelectric device disposed on a first surface of the duct and a first fin disposed in the first thermoelectric device, a second thermoelectric module including a second thermoelectric device disposed on a second surface facing the first surface of the duct and a second fin disposed in the second thermoelectric device, a plurality of first guide portions coupled to the case and disposed on the duct while facing each other, and a second guide portion disposed on a third surface formed between the first surface and the second surface of the duct.Type: GrantFiled: April 3, 2020Date of Patent: November 14, 2023Assignee: LG INNOTEK CO., LTD.Inventors: Un Hak Lee, Jong Hyun Kang
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Patent number: 11812582Abstract: Embodiments are disclosed of a cold plate including substantially identical first and second frames. The first frame includes a first frame body with a first recess, a first mating surface surrounding the first recess, and a first plurality of heat transfer fins in the first recess. The second frame includes a second frame body with a second recess, a second mating surface surrounding the second recess, and a second plurality of heat transfer fins in the second recess. The second mating surface is in sealing contact with the first mating surface, so that the first and second recesses form a fluid chamber. The first and second pluralities of heat transfer fins form a plurality of fin channels in the fluid chamber. Advanced sealing structures can be formed between the first and second mating surfaces. A first fluid port and a second fluid port are fluidly coupled via fluid channels to the plurality of fin channels.Type: GrantFiled: November 9, 2020Date of Patent: November 7, 2023Assignee: BAIDU USA LLCInventor: Tianyi Gao
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Patent number: 11808529Abstract: A cast part includes an outermost wall, at least one inner wall defining at least two internal passages and at least one cast cooling fin extending from an outer surface. The cooling fin includes a ratio of fin height to an average fin thickness that is greater than 2.0 and no more than 18.0. A method is also disclosed.Type: GrantFiled: February 8, 2019Date of Patent: November 7, 2023Assignee: RTX CORPORATIONInventors: Michael A. Disori, Steven J. Bullied, Ryan C. Breneman, John Marcin, David J. Hyland, William P. Stillman, Carl R. Verner
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Patent number: 11802807Abstract: A leak inhibition/detection device includes an absorbent material, a leak sensor in contact with the absorbent material, and an enclosure surrounding the absorbent material. The leak inhibition/detection device is configured to surround a joint between tubing and a cold plate/evaporator or a radiator/condenser of a liquid cooling module of an information handling system.Type: GrantFiled: September 25, 2019Date of Patent: October 31, 2023Assignee: Dell Products L.P.Inventors: Chao Hung (Brian) Li, Wen Hung (Steven) Lu
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Patent number: 11802735Abstract: A heat exchanger is provided. The heat exchanger provides a first plurality of tubes and a second plurality of flow passages which furcate near one of the first and second manifolds into two or more furcated flow passages and subsequently converge to exit the heat exchanger. The plurality of furcated flow passages are intertwined, reducing the distance between flow passages containing each fluid therebetween to improve thermal transfer. Further, the furcations create changes of direction of the fluid to re-establish new thermal boundary layers within the flow passages to further reduce resistance to thermal transfer.Type: GrantFiled: April 6, 2021Date of Patent: October 31, 2023Assignee: Unison Industries, LLCInventors: Daniel Jason Erno, William Dwight Gerstler
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Patent number: 11789505Abstract: A loop heat pipe includes an evaporator configured to vaporize a working fluid, a condenser configured to liquefy the working fluid, a liquid line connecting the evaporator and the condenser, and a vapor line connecting the evaporator and the condenser. The evaporator, the condenser, the liquid line, and the vapor line are formed by stacking a lowermost metallic layer, an uppermost metallic layer, and an intermediate layer set formed of a plurality of metallic layers, which is provided between the uppermost metallic layer and the lowermost metallic layer. The evaporator, the liquid line, the condenser, and the vapor line form a loop-shaped flow path through which the working fluid flows, and a portion of the flow path is formed in the intermediate layer set.Type: GrantFiled: April 15, 2021Date of Patent: October 17, 2023Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Takeshi Shioga, Yoshihiro Mizuno
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Patent number: 11780591Abstract: An example system for determining a performance status of an environmental control system (ECS) in a vehicle includes memory and processing circuitry. The processing circuitry is configured to determine, based on one or more of the aircraft data, the weather data, or the trending data, an estimated compressor exit temperature. The processing circuitry is configured to determine a current residual compressor exit temperature based on the estimated compressor exit temperature and a current compressor exit temperature. The processing circuitry is configured to determine whether a residual condition is met based at least in part on the residual compressor exit temperature and whether a pack condition is met based at least in part on a pack temperature. The processing circuitry is configured to provide an indication of the performance status of the ECS based on at least one of the residual condition or the pack condition being met.Type: GrantFiled: November 23, 2020Date of Patent: October 10, 2023Assignee: Honeywell International Inc.Inventors: Kyusung Kim, Qingqiu Ginger Shao, Roy Araki, Bin Dong, Qi Li, Gary Kumagai
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Patent number: 11759352Abstract: A thermal control unit for delivering temperature-controlled fluid to one or more patient therapy devices (e.g. pads, blankets, etc.) that are in contact with a patient is disclosed. The thermal control unit includes a fluid circuit with an inlet and outlet, a reservoir, a heat exchanger, a pump, and a controller. The thermal control also includes any one or more of the following: (1) an air eliminator with an air filter for filtering air vented from the fluid circuit to the ambient surroundings; (2) a plug that moves in response to changing fluid levels and that fluidly isolates the air filter from the fluid; (3) a second air filter coupled to the reservoir; (4) a check valve to prevent fluid from back flowing into the reservoir; and/or (5) a liquid filter coupleable to the reservoir to filter liquid entering or exiting the reservoir.Type: GrantFiled: August 5, 2021Date of Patent: September 19, 2023Assignee: Stryker CorporationInventor: Gregory S. Taylor
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Patent number: 11686530Abstract: A flexible manifold adapted for use on a plate-fin heat exchanger core, the flexible manifold including a plurality of individual layers configured to be metallurgically joined to respective ones of a plurality of layers of the plate-fin heat exchanger core, and further including a first end with at least one port adapted to receive or discharge a medium, a second end distal from the first end, adapted to transfer the medium to or from the plurality of individual layers, a plurality of horizontal guide vanes defining the plurality of individual layers, and a plurality vertical members positioned within each of the individual layers. The flexible manifold is configured to be mechanically and thermally compliant, and can be metallurgically joined to the heat exchanger core by brazing or welding.Type: GrantFiled: October 4, 2018Date of Patent: June 27, 2023Assignee: HAMILTON SUNDSTRAND CORPORATIONInventors: James Streeter, Feng Feng, Matthew W. Miller
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Patent number: 11683914Abstract: An electronic device connected to external heat dissipation device and including chassis, heat source, and heat dissipation assembly. Heat dissipation assembly includes evaporator, tubing, and liquid-cooling plate. Evaporator is in thermal contact with heat source. Tubing includes evaporation portion and condensation portion. Evaporation portion is in fluid communication with condensation portion and in thermal contact with evaporator. Liquid-cooling plate is disposed on chassis and spaced apart from heat source. Liquid-cooling plate includes liquid-cooling accommodation space and is configured to be in fluid communication with external heat dissipation device. Condensation portion is located in liquid-cooling accommodation space. Condensation portion includes first tube part, second tube part and connecting tube parts. Two opposite ends of each connecting tube part are respectively in fluid communication with first and second tube parts. Connecting tube parts are connected in parallel.Type: GrantFiled: June 16, 2021Date of Patent: June 20, 2023Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventors: Kai-Yang Tung, Hung-Ju Chen
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Patent number: 11661199Abstract: An air conditioning system that is designed to be retroactively added to, and removed from, an existing aircraft, vehicle, boat or similar confined space. The air conditioning system includes a cooler module that is carried into a first compartment to circulate and cool the air. The cooler module contains a condenser, an evaporator and a compressor. A heat exchanger module is mounted into a vented second compartment. The heat exchanger is capable of exchanging heat with the ambient air. The heat exchanger module is connected to the cooler module with tubes that contain a heat exchanger fluid. In order for the tubes to pass through a compartment barrier, fluid couplings are mounted through the barrier. The tubes connect to the fluid couplings on either side of the barrier. A control unit is provided within the pressurized cabin and/or cockpit for controlling the operations of the cooler module.Type: GrantFiled: October 21, 2019Date of Patent: May 30, 2023Inventor: Peter Schiff