Patents Examined by Gordon Jones
  • Patent number: 11268705
    Abstract: A pneumatic radiation unit according to the present invention includes: a first chamber including a first air discharger configured to discharge air-conditioning air to a second chamber; and the second chamber including a second air discharger configured to discharge the air-conditioning air to a space to be air conditioned, the second chamber being configured to take in the air-conditioning air from the first chamber and discharge the air-conditioning air and radiate heat to the space to be air conditioned. A second aperture ratio of the second air discharger is set to be greater than a first aperture ratio of the first air discharger, or a cross-sectional area of a flow passage of the air-conditioning air in the first chamber is gradually reduced from an upwind side to a downwind side of the flow passage of the air-conditioning air.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: March 8, 2022
    Assignee: KIMURA KOHKI CO., LTD.
    Inventors: Keiichi Kimura, Katsuhiro Urano
  • Patent number: 11260979
    Abstract: An aircraft environmental control system comprising a bleed air or compressed ambient air input and a RAM air input, heat exchanger means for receiving bleed air from the bleed air input and RAM air from the RAM air input and using RAM air to cool the bleed air, and means for providing the cooled bleed air to an interior of the aircraft; the system further comprising means for feeding back exhaust air emitted from the interior of the aircraft to combine with the RAM air to further cool the bleed air or compressed ambient air.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: March 1, 2022
    Assignee: HAMILTON SUNDSTRAND CORPORATION
    Inventors: Yonghua Zhu, Catherine Thibaud, Mathieu Le Cam, Erica Zavaglio, Giovanni Franzini
  • Patent number: 11262109
    Abstract: Envisaged is a regeneration system for a metal hydride heat pump of a damper type. The system comprises a plurality of reactor assembly modules configured to act as a heat pump, an ambient air inlet and a fluid recirculation circuit. The plurality of reactor assembly modules includes first, second, third and fourth metal hydride reactor assembly modules. The fluid recirculation circuit comprises a mixer, a fluid stream switching means, a flow regulating means and an exhaust outlet. The mixer is adapted to mix a portion of a recirculation stream received from the exhaust outlet and the exhaust gas stream to provide a resultant stream. The fluid stream switching means is coupled to the mixer and is adapted to switch flow of the resultant stream as received from the mixer and the ambient air stream in a cyclic manner in a series of half-cycles of operation.
    Type: Grant
    Filed: November 18, 2019
    Date of Patent: March 1, 2022
    Assignee: THERMAX LIMITED
    Inventors: Devadatta Pundlik Navale, Amol Jambukumar Bharamgonda, Sachin Narayan Gunjal, Ramakrishna Ramanath Sonde, Sameer Vasudeo Kulkarni
  • Patent number: 11241935
    Abstract: An air-conditioning system comprises a channel system, a system conveying device positioned in the channel system and configured to convey air in the channel system, a sensor device comprising at least one analysis channel and configured to measure a characteristic of air flowing through the at least one analysis channel, and a suction jet pump comprising a motive-fluid inlet, a suction inlet, and a pump outlet. The system conveying device separates a suction area of the channel system arranged upstream of the system conveying device from a pressure area of the channel system arranged downstream from the system conveying device, and the sensor device further comprises a sensor outlet configured to release air from the sensor device. The motive-fluid inlet is fluidically connected to the pressure area via a suction jet branch-off point within the channel system, and the suction inlet is fluidically connected to the sensor outlet.
    Type: Grant
    Filed: September 3, 2018
    Date of Patent: February 8, 2022
    Inventors: Daniel Eberle, Rainer Knoeller, Markus Michael, Anja Reiter, Oliver Schultze, Isabelle Seitz, Joachim Treier, Walter Wolf
  • Patent number: 11246239
    Abstract: The present disclosure provides a heatsink that can improve heat radiation efficiency of a heat radiating fin and equalize a heat input in a heat receiving portion while securing sufficient volumes of the heat receiving portion, a heat insulating portion, and a heat radiating portion even in an environment in which an installation space for the heatsink, more specifically, an installation space in a width direction of the heatsink is limited.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: February 8, 2022
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yosuke Watanabe, Kenya Kawabata, Yoshikatsu Inagaki, Tatsuro Miura, Kazuaki Aotani, Toshiaki Nakamura
  • Patent number: 11226144
    Abstract: A transcritical R-744 refrigeration system with a medium temperature section having a plurality of circuits, at least one evaporator receiving an R-744 refrigerant in a medium-pressure liquid state from a receiver and feeding at least one transcritical compressor to compress the R-744 refrigerant from a low-pressure gaseous state into a high-pressure gaseous state to feed a gas cooler and a throttling device to partially condense the R-744 refrigerant into a medium-pressure gaseous-liquid state, the system comprising a pressure reducing valve connected to a discharge conduit of the at least one transcritical compressor and feeding hot gas to a defrost manifold to defrost one of the plurality of circuits of the medium temperature section, wherein the hot gas being fed to the defrost manifold has a pressure value less than or equal to a maximum operating pressure of the at least one evaporator.
    Type: Grant
    Filed: May 18, 2018
    Date of Patent: January 18, 2022
    Assignee: SYSTEMES LMP INC.
    Inventors: GaƩtan Lesage, Jordan Kantchev
  • Patent number: 11215403
    Abstract: The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. A fluid may be contained within the wicking structure and vapor cavity for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane, wherein the fluid may be driven by capillary forces within the wicking structure. The intermediate substrate may form narrow channels within the wicking structure, providing high capillary forces to support large pressure differences between the liquid and vapor phases, while minimizing viscous losses of the liquid flowing in the wicking structure.
    Type: Grant
    Filed: August 16, 2019
    Date of Patent: January 4, 2022
    Assignee: PiMEMS, Inc.
    Inventor: Payam Bozorgi
  • Patent number: 11215404
    Abstract: A heat transfer tube includes a twisted baffle arranged in an inner wall of the tube. The twisted baffle extends spirally along an axial direction of the heat transfer tube. The twisted baffle is provided with a non-through gap extending along an axial direction of the heat transfer tube from an end to the other end of the twisted baffle. A cracking furnace uses the heat transfer tube. The heat transfer tube and cracking furnace have good heat transfer effects and small pressure loss.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: January 4, 2022
    Assignees: CHINA PETROLEUM & CHEMICAL CORPORATION, BEIJING RESEARCH INSTITUTE OF CHEMICAL INDUSTRY, CHINA PETROLEUM & CHEMICAL CORPORATION
    Inventors: Guoqing Wang, Lijun Zhang, Xianfeng Zhou, Junjie Liu, Zhiguo Du, Yonggang Zhang, Zhaobin Zhang, Cong Zhou
  • Patent number: 11206746
    Abstract: A fluid heat dissipation device is provided. The fluid heat dissipation device includes a heat sink body and a plurality of pasting elements. The heat sink body is a porous structure, and pores of the heat sink body are configured to enable the heat sink body to absorb a working fluid that can be liquid or gas. The pasting elements are fixed on a first surface of the heat sink body. The pasting elements include polymer materials and are sheet-like colloids. The heat sink body is fixedly attached onto an outer surface of an electronic device through the pasting elements. A thickness gap of the pasting element is a vaporization chamber, and the working fluid in the pores can absorb heat from the electronic device and then be vaporized to remove heat through the heat sink body.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: December 21, 2021
    Inventor: Chia-Hsing Liu
  • Patent number: 11193715
    Abstract: A microchannel evaporator includes a plurality of microchannels. Each of the plurality of microchannels includes a first end and a second end. A first end-tank is coupled to each first end of the plurality of microchannels and a second end-tank is coupled to each second end of the plurality of microchannels. A second-fluid inlet is coupled to either the first end-tank or the second end-tank and configured to receive a fluid into the microchannel evaporator and a second-fluid outlet is coupled to either the first end-tank or the second end-tank and configured to expel the fluid from the microchannel evaporator. Each microchannel of the plurality of microchannels includes at least one bend along a length thereof.
    Type: Grant
    Filed: October 20, 2016
    Date of Patent: December 7, 2021
    Assignee: Hyfra Industriekuhlanlagen GmbH
    Inventor: Berthold Adomat
  • Patent number: 11184996
    Abstract: A cooling unit positioned between a first and a second gas stream, the first and the second gas stream having no direct fluid contact therebetween. The cooling unit includes a double-sided heat exchanger with a first side that is in thermal communication with the first gas stream and a second side that is in thermal communication with the second gas stream. The double-sided heat exchanger provides a direct path of thermal conduction between the first gas stream and the second gas stream. First fins are provided on the first side of the double-sided heat exchanger and second fins are provided on the second side of the double-sided heat exchanger. A first surface area of the first side of the double-sided heat exchanger is at least 5% greater than a second surface area of the second side of the double-sided heat exchanger. A housing surrounds a fan and the second fins.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: November 23, 2021
    Assignee: ADVANCED COOLING TECHNOLOGIES, INC.
    Inventors: Scott D. Garner, Peter Dussinger, Jon Zuo, Daniel T. Reist
  • Patent number: 11168946
    Abstract: A cooling system transfers thermal energy from a temperature-critical reservoir to a heat sink. The system has an intermediate reservoir which is thermally interposed between the temperature-critical reservoir and the heat sink. The intermediate reservoir serves as an energy buffer between the two reservoirs by accepting thermal energy from the temperature-critical reservoir, storing that energy, and then transferring it to a heat sink by means of a temperature-driven process rather than by means of a heat pump. Transfer of thermal energy from the intermediate reservoir to the heat sink is temporally coordinated with naturally occurring temperature variations of the heat sink so that all thermal energy transfer processes conducted by the system are temperature-driven.
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: November 9, 2021
    Inventor: James T. Ganley
  • Patent number: 11171443
    Abstract: A connector includes a heat spreader. The heat spreader is configured to direct heat from ports to a thermal plate that is spaced apart from the connector. A plurality of connectors can be supported and a heat spreader can be associated with each connector. One or more thermal plates can be thermally coupled to the corresponding heat spreader(s) so as to direct thermal energy away from each connector. Cold blocks can be used to thermally couple the heat spreader to the corresponding thermal plates.
    Type: Grant
    Filed: November 8, 2012
    Date of Patent: November 9, 2021
    Assignee: Molex, LLC
    Inventor: Kent E. Regnier
  • Patent number: 11162737
    Abstract: A cold layer adapted for use in a cross counter flow heat exchanger core includes a hot inlet tent for receiving hot flow and a hot outlet tent for discharging hot flow. The cold layer is configured to receive a cold inlet flow and discharge a cold outlet flow defining a main cold flow direction. The cold layer includes a first and second cold main closure bar, each parallel to the main cold flow direction and located near the respective hot inlet or outlet tent, cold main fins perpendicular to the direction of the hot inlet flow, and cold inlet corner fins near the hot inlet tent, configured to receive a portion of the cold inlet flow in a direction that forms an angle with the main cold flow that is greater than 5 degrees.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: November 2, 2021
    Assignee: Hamilton Sundstrand Corporation
    Inventor: Alan Retersdorf
  • Patent number: 11162745
    Abstract: A heat radiating plate 10 of a metal material includes a flat plate portion 10a, a large number of columnar protruding portions 10b which protrude from one major surface of the flat plate portion and which are integrated with the flat plate portion, and a reinforcing plate member 12 of a material, which has a higher melting point than that of the flat plate portion and columnar protruding portions and which is arranged in a region, which is arranged in the flat plate portion and which is close to one major surface of the flat plate portion, the reinforcing member passing through the flat plate portion to extend in directions substantially parallel to the one major surface of the flat plate portion and having end faces exposed to the outside, the whole surface of the reinforcing member except for the end faces being bonded directly to the flat plate portion.
    Type: Grant
    Filed: October 29, 2019
    Date of Patent: November 2, 2021
    Assignee: DOWA METALTECH CO., LTD.
    Inventors: Satoru Ideguchi, Hideyo Osanai, Hirotaka Kotani
  • Patent number: 11150026
    Abstract: A heat exchanger including a plurality of flat sheets arranged in parallel and a plurality of profiled sheets, each of which including a number of straight segments and being arranged between two subsequent flat sheets and having a repeating profile. The profiled sheets and the flat sheets together create a plurality of parallel ducts arranged in layers. The parallel ducts are divided by the profiled sheets into ducts of a first type and ducts of a second type, the ducts of the second type neighboring the ducts of the first type. Each duct of the first and second type has a width w(d) which is a function of a distance d with d the distance from a first flat sheet.
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: October 19, 2021
    Assignee: RECAIR B.V.
    Inventor: Marinus Henricus Johannes Van Kasteren
  • Patent number: 11150027
    Abstract: A plate type heat exchanger for an oil cooler includes at least two heat exchanger members, each enclosing a respective first cavity (C1). The plate type heat exchanger includes at least one inlet port (20, 22), for feeding a medium to the first cavities and at least one output port (21, 23) for extracting the medium from the first cavities (C1). The plate type heat exchanger includes at least one mounting member (13, 14), which is attached to an outside of an outermost one, as seen in a stacking direction (Z), of the heat exchanger members. A second cavity (C2) is formed between the at least two heat exchanger members. A reinforcement plate (30, 31) is located on an inside of the outermost one of the heat exchanger members, and at least partially overlapping the mounting member (13, 14).
    Type: Grant
    Filed: March 30, 2015
    Date of Patent: October 19, 2021
    Inventors: Arnaud Contet, Rolf Hedman, Jenny Fritiofsson
  • Patent number: 11143466
    Abstract: A heat transfer system including a fluid inlet; a fluid outlet; and a substrate in fluid communication with the fluid inlet and fluid outlet, the substrate including a heat exchange region having a heat transfer surface and a flow field adjacent the heat transfer surface, the flow field including a fluid flow area including an open region at the inlet, a heat transfer region in thermal communication with the heat exchange region, and a taper of the flow field cross-sectional area in the flow direction, wherein the flow field heat transfer region includes a plurality of spaced apart open enhancement features from 1 micron to 3 mm in size, and method for enhancing the heat transfer performance of an apparatus is disclosed.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: October 12, 2021
    Assignee: Rochester Institute of Technology
    Inventor: Satish G. Kandlikar
  • Patent number: 11143461
    Abstract: A flat loop heat pipe includes an evaporator that vaporizes a working fluid, a condenser that liquefies the working fluid vaporized by the evaporator, a vapor pipe that connects the evaporator to the condenser, and a liquid pipe that connects the condenser to the evaporator. The liquid pipe includes a first wick. The condenser includes a flow passage and a second wick. The flow passage connects the vapor pipe and the liquid pipe. The second wick is connected to the first wick. The second wick is exposed in the flow passage and extends from the flow passage in a planar direction.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: October 12, 2021
    Assignee: Shinko Electric Industries Co., LTD.
    Inventor: Nobuyuki Kurashima
  • Patent number: 11137210
    Abstract: A heat exchanger includes a header and a side plate. The header has a face plate that defines a plurality of orifices. The header has a protrusion that extends outward from the header and down such that a gap is formed between the header and the protrusion. An external portion of the protrusion is configured to break away from the header during thermal expansion. The side plate is disposed adjacent to an array of alternating tubes and fins. Each tube extends into one of the orifices of the plurality of orifices. The side plate has an end that is secured to the external portion of the protrusion.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: October 5, 2021
    Assignee: DENSO International America, Inc.
    Inventor: Mark Holmes