Abstract: A remedial composition comprising a soluble silicate, a surfactant, a polyol and water is disclosed. The remedial composition of the present invention is generally intended for use in the treatment of soil, sand, water, fly ash and other mediums that may contain hazardous materials. In one embodiment of the present invention the soluble silicate of the remedial composition has a mole ratio of about 2.6 to about 3.9 moles silicate per mole of alkali metal oxide. In another embodiment of the present invention the remedial composition will have a pH level ranging from about 10.5 to about 11.9. In another embodiment the water component further comprises from about 0.5% to about 15% dissolved oxygen (O2). In another embodiment of the present invention the remedial composition may be further diluted by adding water to create various solutions comprising about 1 to 300 parts water to 1 part remedial composition.

Abstract: The invention provides an additive for preparing suede on a monocrystalline silicon chip, which comprises: polyethylene glycol, sodium benzoate, citric acid, hydrolytic polymaleic anhydride, sodium acetate and water. The invention also provides a suede preparation liquid for preparing suede on a monocrystalline silicon chip, which contains the foregoing additive for preparing suede on a monocrystalline silicon chip and an aqueous alkali in a mass ratio of 0.2-5:100, wherein the aqueous alkali is the aqueous solution of an inorganic or organic alkali. The invention also provides a method for preparing suede on a monocrystalline silicon chip, by using which suede can be prepared on the surface of a monocrystalline silicon chip with the foregoing suede preparation liquid.

Abstract: Disclosed is a liquid chemical for forming a water repellent protective film on a wafer that has at its surface a finely uneven pattern and contains silicon element at least at a part of the uneven pattern, the water repellent protective film being formed at least on surfaces of recessed portions of the uneven pattern at the time of cleaning the wafer. The liquid chemical contains: a silicon compound (A) represented by the general formula R1aSi(H)b(X)4?a?b and an acid; or a silicon compound (C) represented by the general formula R7gSi(H)h(CH3)w(Z)4?g?h?w and a base that contains no more than 35 mass % of water. The total amount of water in the liquid chemical is no greater than 1000 mass ppm relative to the total amount of the liquid chemical. The liquid chemical can improve a cleaning step that easily induces pattern collapse.

Abstract: A pre-fill solution for application onto a substrate surface prior to a fill operation is provided, the fill operation defined by application of an electroless deposition solution onto the substrate surface to deposit a metallic material in an etched feature, the substrate surface having metallic contaminants generated from an etch operation that generated the etched feature in the substrate surface, the pre-fill solution effective for preventing the electroless deposition solution from depositing on the metallic contaminants, the pre-fill solution comprising: a surfactant, the surfactant configured to enhance wetting of the substrate surface, the concentration of the surfactant in the solution being approximately in the range of 10 ppm to 2000 ppm, wherein the surfactant is an amphoteric surfactant; oxalic acid dihydrate; and hypophosphorous acid as a pH adjusting agent configured to reduce the pH of the solution to approximately less than 2 during the application onto the substrate surface.

Abstract: A cleaning composition comprises at least one surfactant and at least one colorant. The cleaning composition can have a pH of about 3 or less. The colorant exhibits one of several specified structures at a pH of about 7. A method for cleaning a surface utilizes the cleaning composition.

Abstract: A non-Newtonian concentrate composition includes a sensitizer or irritant, a surfactant, an anti-mist component and optionally a stability component. Example sensitizers and irritants include, but are not limited to, acids, quaternary compounds, and amines, and example anti-mist components include, but are not limited to, polyethylene oxide and polyacrylamide.

Abstract: Formulations comprising (A) at least one aminocarboxylate selected from methylglycine diacetate (MGDA), iminodisuccinic acid (IDA) and glutamic acid diacetate (GLDA), and salts and derivatives thereof, and (B) at least one alkoxylated alkyleneimine polymer with an average molecular weight Mw in the range from 800 to 25 000 g/mol which has a positive charge density of at least 5 meq/g and which has in the range from 2 to at most 80% by weight alkylene oxide side chains, based on total alkoxylated alkyleneimine polymer.

Abstract: A method and low pH compositions for removing bulk and/or hardened photoresist material from microelectronic devices have been developed. The low pH compositions include sulfuric acid and at least one phosphorus-containing acid. The low pH compositions effectively remove the hardened photoresist material while not damaging the underlying silicon-containing layer(s) or the metal gate materials.

Abstract: The invention relates to an electromagnetic interference shielding film comprising an electromagnetic wave absorptive layer which contains electromagnetic wave absorptive particles; a conductive layer which contains conductive particles, and the conductive layer is disposed on a surface of the electromagnetic wave absorptive layer; a metallic layer disposed on another surface of the electromagnetic wave absorptive layer; and an insulating layer disposed on the metallic layer. The electromagnetic interference shielding film according to the invention can prevent the circuits and components from the electromagnetic interference.

Abstract: A solid controlled release composition according to the present invention includes at least one cellulosic material, water, at least one active ingredient, and optionally at least one of a saccharide, sugar alcohol or salt. The active ingredient can be a polycarboxylic acid.

Abstract: Provided are azeotrope-like compositions comprising tetrafluoropropene and hydrofluorocarbons and uses thereof, including use in refrigerant compositions, refrigeration systems, blowing agent compositions, and aerosol propellants.

Abstract: A non-flammable ternary liquid cleaner is formulated from a first solvent that is a dichloroethylene, a second solvent that is a hydrofluorocarbon and a third solvent that is a fluoroketone having low flammability. The dichloroethylene is present in a concentration of at about 50 percent to about 60 percent by weight of the cleaner, the hydrofluorocarbon is present in a concentration of about 25 percent to about 35 percent by weight of the cleaner and the fluoroketone is present in a concentration of at about 13 percent to about 25 percent by weight of the cleaner.

Abstract: A composition including (a) a quaternary ammonium hydroxide having a general formula (I): as defined herein, and (b) a dipolar aprotic solvent substantially free of water.

Abstract: The present application relates to encapsulated, preformed peracids and products comprising such encapsulates, as well as processes for making and using such encapsulates and products comprising such encapsulates. Such products deliver bleaching that results in superior whiteness and stain removal without the stability issues that are normally associated with certain bleaching systems.

Abstract: Alkaline sprayable aqueous compositions are disclosed. In particular, sprayable alkaline aqueous chlorine compositions including a surfactant system for modifying the viscosity of the composition, are combined with an alkalinity source and a chlorine source. Methods of cleaning having reduced amounts of airborne particulates of the composition during spray applications are also provided according to the invention, namely reduction of airborne particulates having a micron size of 10 or less within a breathing zone of a user of less than or equal to 60 particles/cm3.

Abstract: A device and method for descaling flow passages of a pod-type beverage machine is provided. The device includes a container having liquid absorbing material and dry powder vinegar contained therein. As the brewing cycle is started, water is injected into the container causing the dry powder vinegar to dissolve into a cleaning solution. At least a portion of the cleaning solution is absorbed by the liquid absorbing material, which retards the flow of the cleaning solution from out of the container. The increased retention time of the cleaning solution within the container improves the cleaning effectiveness.

Abstract: The cleaning agent for a diesel engine includes a mixed solution obtained by blending a solvent that exhibits solubility and has an ignition point of 238° C. or more, and lubricating oil such as mineral oil in a predetermined ratio. The solvent and the grease are selected such that the cleaning agent has a higher ignition temperature characteristic than the ignition characteristic of light oil, and an evaporation characteristic that takes eight minutes or more to vaporize 2.5 cc of the cleaning agent in a heated state at 120° C.

Abstract: A method of manufacturing a semiconductor device including attaching, by a liquid treatment, a first liquid to a surface of a semiconductor substrate having a fine pattern formed therein; substituting the first liquid attached to the surface of the semiconductor substrate with a solution, the solution comprising a sublimate dissolved in a second liquid; vaporizing the second liquid and precipitating the sublimate to the surface of the semiconductor substrate to form a solid precipitate comprising the sublimate; and removing the precipitate by sublimation. For example, the sublimate may be a material having at least two carboxyl groups bonded to cyclohexane or a material formed of two carboxyl groups bonded to benzene with the bonding sites of the two carboxyl groups being adjacent to one another.

Abstract: Provided are methods for coating plastic substrates with an aqueous coating composition comprising at least one organic polymer as binder, the coating composition being applied to the surface of the plastic substrate and being subsequently cured, wherein the plastic substrate is pretreated before the coating composition is applied, the pretreatment comprising the two following separate steps in the order stated: (A) heat-treating a plastic substrate at an ambient temperature in the range from 60° C. to 160° C. for a period in the range from 1 minute to 20 minutes, (B) flaming the surface of the plastic substrate pretreated as per step (A), there being a period of up to 90 minutes between the ending of step (A) and the beginning of step (B). Additionally, provided are coated plastic substrates that have been coated by the methods of the invention.

Abstract: The invention relates to a coating system, in particular a coating system containing an organometallic layer which allows the selective removal of post coating layers from substrates without detrimental impact to their “in-service” performance. The organometallic layer comprises (a) an organic polymer containing multi-chelating functionalities; and (b) a metallic agent which forms an organo metallic complex with the organic polymer containing multi-chelating functionalities and is located between an optionally coated substrate and at least one post coating layer of a coating system.