Patents Examined by Harry E Arant
  • Patent number: 11982496
    Abstract: A plate kind heat exchanger (1) has a plurality of stacked plates (2) forming flow paths for heat exchanging fluids there between, a first inlet channel being fluidly connected to inlets of a first set of flow paths, a second inlet channel being fluidly connected to inlets of a second set of flow paths, a first outlet channel being fluidly connected to outlets of the first set of flow paths, and a second outlet channel being fluidly connected to outlets of the second set of flow paths. The first inlet channel is provided with a stack (15) of rings (5) forming fluid passages towards the inlets of the first set of flow paths.
    Type: Grant
    Filed: May 25, 2022
    Date of Patent: May 14, 2024
    Assignee: DANFOSS A/S
    Inventor: Helge Nielsen
  • Patent number: 11976885
    Abstract: A phase change thermal management device includes a casing, a plurality of inner walls and a phase change material. The casing defines an internal space. The inner walls are arranged in the internal space and crossed one another to form a plurality of accommodation cells. Two adjacent accommodation cells are communicated with each other through at least one opening on one of the inner walls. The phase change material is provided in at least portions of the accommodation cells.
    Type: Grant
    Filed: December 29, 2021
    Date of Patent: May 7, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yi-Tseng Li, Yion-Ni Liu
  • Patent number: 11968804
    Abstract: A cooling system includes a tank, a heat exchanger, a separation tank, a first tube, a second tube, a third tube, a gas storage device, a fourth tube, a first valve, a second valve and a third valve. A heating element is immersed in a dielectric liquid in the tank. The heat exchanger condenses dielectric vapor of the dielectric liquid. The separation tank is used for a separation operation. The first tube is connected to the tank and the heat exchanger. The second tube is connected to the heat exchanger and the separation tank. The third tube is connected to the separation tank and the tank. The gas storage device stores the dielectric vapor. The fourth tube is connected to the gas storage device and the separation tank.
    Type: Grant
    Filed: June 13, 2022
    Date of Patent: April 23, 2024
    Assignees: Inventec (Pudong) Technology Corp., Inventec Corporation
    Inventors: Kai-Yang Tung, Hung-Ju Chen
  • Patent number: 11965698
    Abstract: A slim heat-dissipation module is provided. The slim heat-dissipation module includes a first plate, a second plate, a first porous structure, a second porous structure, a first fluid, and a second fluid. The second plate is combined with the first plate to form a first type chamber and a second type chamber, wherein the first type chamber and the second type chamber are sealed and independent, respectively. The first porous structure is disposed in the first type chamber. The second porous structure is disposed in the second type chamber. The first fluid is disposed in the first type chamber. The second fluid is disposed in the second type chamber.
    Type: Grant
    Filed: November 8, 2021
    Date of Patent: April 23, 2024
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Shih-Lin Huang, Ting-Yuan Wu
  • Patent number: 11959659
    Abstract: An outdoor unit for an air-conditioning apparatus, having a compressor, a top cover configured to cover an upper surface of the compressor, and a side cover configured to cover a side of the compressor and a side of the top cover, the side cover including a rectangular cutout portion formed in a part of an upper end of the side cover. The outdoor unit has a non-water-absorbent draining element disposed across from a central portion of the top cover to a bottom portion of the cutout portion, and tilts down from the central portion of the top cover toward the bottom portion of the cutout portion.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: April 16, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kento Oku, Keiichi Tomita, Tetsuya Masuda
  • Patent number: 11953269
    Abstract: A loop heat pipe includes: an evaporator; a condenser; a liquid pipe; a vapor pipe; and a loop-like flow channel through which the working fluid flows. At least one of the evaporator, the condenser, the liquid pipe, and the vapor pipe includes a first outer metal layer, a second outer metal layer, and an inner metal layer. The inner metal layer includes a porous body. The porous body includes: a first bottomed hole formed in one face of the inner metal layer; a second bottomed hole formed in the other face of the inner metal layer; a pore, wherein the first bottomed hole and the second bottomed hole partially communicates with each other through the pore; and a first column portion provided inside the first bottomed hole. The first column portion is bonded to the first outer metal layer.
    Type: Grant
    Filed: February 9, 2022
    Date of Patent: April 9, 2024
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Yoshihiro Machida
  • Patent number: 11956926
    Abstract: An outdoor unit includes a housing having a front surface formed with an outlet and a back surface facing the front surface, an airflow flowing through the outlet; a substrate horizontally placed in the housing, an electric component being mounted on the substrate; and a heat dissipator including a plurality of fins, each of the fins having a heat dissipation surface, the heat dissipator dissipating, due to the airflow, heat generated by the electric component. The heat dissipation surface of each of the fins is parallel to the back surface or is angled at greater than 0 degrees and less than 90 degrees relative to the back surface in top view.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: April 9, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kenji Iwazaki, Koichi Arisawa, Takashi Yamakawa, Takuya Shimomugi, Keisuke Mori
  • Patent number: 11946699
    Abstract: A bendable vapor chamber structure includes a first plate body and a second plate body assembly. The first plate body has a first face and a second face on upper and lower sides. The second plate body assembly has multiple plate bodies and at least one bendable connection body. The bendable connection body is disposed between the plate bodies and connected with the plate bodies. The second plate body assembly is correspondingly mated with the first plate body to together define a receiving space. A first capillary structure is disposed in the receiving space. A working liquid is filled in the receiving space. By means of the bendable connection body, the vapor chamber is bendable.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: April 2, 2024
    Assignee: ASIA VITAL COMPONENTS (SHEN ZHEN) CO., LTD.
    Inventor: Han-Min Liu
  • Patent number: 11940222
    Abstract: A heat sink includes a plurality of extrusions each including a base and a fin, the plurality of extrusions being aligned in a width direction orthogonal to an extrusion direction and joined to each other. The plurality of extrusions include a first extrusion including a plurality of fins, the first extrusion including, in the base, a through-hole in which a heat pipe is mountable, the through-hole extending in the extrusion direction.
    Type: Grant
    Filed: September 12, 2017
    Date of Patent: March 26, 2024
    Assignee: Sumitomo Precision Products Co., Ltd.
    Inventors: Shota Hanafusa, Keiji Miki
  • Patent number: 11930979
    Abstract: A free-standing Energy Recovery System enables sanitary recovery of thermal energy with heat transfer from hot waste effluent to incoming domestic water. The source of the effluent may, for example, be conventional commercial ware-washing, clothes washing equipment, pasteurization and other industrial processes.
    Type: Grant
    Filed: August 21, 2022
    Date of Patent: March 19, 2024
    Inventor: William K. Glass
  • Patent number: 11927397
    Abstract: The present invention is directed to providing a tube assembly for a heat exchanger or heat management apparatus in which the tube assembly can be integrally assembled using inner fin tubes having a two-row structure and drainage performance and corrosion resistance performance can be improved. The tube assembly for the heat exchanger or heat management apparatus includes a first- and second-row tube including an inner fin type tube respectively, a central connection portion that connects the first-row tube to the second-row tube, and a header in which a first- and a second-row tube hole, into which ends of the first- and the second-row tube are inserted, are arranged, wherein a cut portion formed in the direction opposite to the ends of the first- and the second-row tube inserted into the header is included in the central connection portion.
    Type: Grant
    Filed: January 8, 2020
    Date of Patent: March 12, 2024
    Assignee: Hyundai Mobis Co., Ltd.
    Inventor: Hwa Sung Kim
  • Patent number: 11920868
    Abstract: A micro-channel pulsating heat pipe, preferably closed loop, includes a plate with micro-channels with obstructions along interior walls to increase surface area, add nucleation sites for the working fluid vaporization, and otherwise enhance fluid movement and heat transfer. Various shapes of obstructions are considered on one or more of the bottom wall, the side walls, and top wall of the channel. Plating may fit over or around the plate to enhance strength and heat transfer. Ribbing, of a thermally conductive material, may set on the exterior surface of the plate and/or plating to enhance surface area to encourage heat transfer and arranged to facilitate air movement across exterior surface.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: March 5, 2024
    Assignee: GLOBAL COOLING TECHNOLOGY GROUP, LLC
    Inventors: Victor Adrian Chiriac, John Richard Thome
  • Patent number: 11924997
    Abstract: A cold plate apparatus is disclosed. A cold plate includes a first set of sinusoidal conduits and a second set of sinusoidal conduits formed therein. The first set of sinusoidal conduits is arranged in a first direction, and the second set of sinusoidal conduits is arranged in a second direction. Crests of the first set of sinusoidal conduits overlap troughs of the second set of sinusoidal conduits. Crests of the second set of sinusoidal conduits overlap troughs of the first set of sinusoidal conduits. A first set of header plates is fluidically coupled to the first set of sinusoidal conduits, and a second set of header plates is fluidically coupled to the second set of sinusoidal conduits.
    Type: Grant
    Filed: October 19, 2021
    Date of Patent: March 5, 2024
    Assignee: Rockwell Collins, Inc.
    Inventors: Joseph Turney, Kimberly Saviers, Ram Ranjan, Robert H. Dold, Kathryn L Kirsch
  • Patent number: 11913726
    Abstract: A vapor chamber heatsink assembly, under vacuum, having a working fluid therein, comprising a plurality of heatsink fins and a vapor chamber is provided. The vapor chamber and the plurality of heatsink fins each comprise a plurality of obstructers defining a plurality of braided channels therein. Thus, the condenser regions of the vapor chamber are expanded to the plurality of heatsink fins. When heat from a greater temperature heat source and a lower temperature heat source is applied to the vapor chamber, via the plurality of obstructers and braided channels, the working fluid and liquid vapor travel therethrough, providing an effective phase change mechanism to the greater temperature heat source, while concurrently, hindering agglomeration of working fluid thereto. An effective phase change mechanism is also concurrently provided to the lower temperature heat source due to the non-agglomeration of working fluid to the greater temperature heat source.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: February 27, 2024
    Assignee: Cooler Master Co., Ltd.
    Inventors: Yuanlong Wen, Meiping Fan, Shan yin Cheng
  • Patent number: 11892249
    Abstract: The present invention discloses a heat dissipation table made of an alloy material and with a special waterway design, comprising a sample placing table, a graphene heating structure abutted against the sample placing table, a heat dissipation structure abutted against the graphene heating structure and a protective cover for wrapping the heat dissipation structure. The heat dissipation structure comprises a heat dissipation table abutted against the graphene heating structure and a heat dissipation pipeline communicated with the heat dissipation table; a water pipe through groove is formed in the middle part of the heat dissipation table; and the heat dissipation pipeline is embedded into the water pipe through groove. A plurality of waterway annular grooves are formed in the heat dissipation table and communicated with the water pipe through groove. According to the present invention, the demand of diamonds on heat dissipation with high power can be met, and the cost is low.
    Type: Grant
    Filed: June 17, 2022
    Date of Patent: February 6, 2024
    Assignee: Shanghai Worldiray Semiconductor Technology Co., Ltd.
    Inventors: Changqing Hu, Jianhai Zhao
  • Patent number: 11879694
    Abstract: The invention relates to a turbulator (1, 10) for a channel (21, 23, 31, 42) of a process apparatus (30, 41, 44), in particular a heat exchanger, reactor or mixer, with a plurality of ribs (3, 14, 15), wherein at least one row (12, 13) of ribs (3, 14, 15), which define a common rib plane, is arranged, preferably uniformly, distributed and is, preferably uniformly, spaced apart from one another via gaps (4, 18, 19) in the longitudinal extension of the turbulator (1, 10). In order that the dead volumes and therefore the average residence times can be reduced by proportions that are not utilised or are utilised less efficiently for the process in order to keep the respective process medium in a defined and preferred operational state as far as possible over the entire residence time, it is provided that on at least one longitudinal end of the turbulator (1, 10) a hook element (6, 20) is provided for positively hooking a tool (7) to remove the turbulator (1, 10) from the channel (21, 23, 31, 42).
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: January 23, 2024
    Assignee: Ehrfeld Mikrotechnik GmbH
    Inventors: Matthias Kroschel, Frank Herbstritt, Johann Peter Born
  • Patent number: 11867472
    Abstract: A heat exchanger header includes a first inlet, a first passageway that fluidically connects the first inlet to a first outlet, a second inlet, and a second passageway. The second passageway fluidically connects the second inlet to a second outlet. The first inlet, the first passageway, and the first outlet are fluidically isolated from the second inlet, the second passageway, and the second outlet.
    Type: Grant
    Filed: April 30, 2021
    Date of Patent: January 9, 2024
    Assignee: HAMILTON SUNDSTRAND CORPORATION
    Inventors: Donald Army, Eric J. Welch, Patrick McCord
  • Patent number: 11859859
    Abstract: An outdoor unit for an air-conditioning apparatus includes a casing having an air inlet through which air enters the casing, an air-sending device disposed in the casing and configured to create a flow of air passing through the air inlet, a heat exchanger disposed between the casing and the air-sending device and exposed through the air inlet and including a plurality of fins spaced apart from each other, and a partition disposed in the casing and dividing a space in the casing into an air-sending device chamber containing the heat exchanger and the air-sending device and a machine chamber containing a compressor. The plurality of fins include an end fin group located at an end remote from the partition. The casing includes a wall having at least one vent that faces the end fin group and that is located along a side edge part defining an edge of the air inlet.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: January 2, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kentaro Yonehara, Hiroyuki Jinnai, Takashi Ikeda, Shingo Hamada
  • Patent number: 11852566
    Abstract: A cooling system for a wind tunnel is disclosed. The heat exchanger of the present disclosure is formed as a turning vane in an airflow duct of a re-circulating wind tunnels. The individual vanes are formed from extruded aluminum with coolant fluid channels running continually down the length of the vane. One or more channels can be used, depending on the application of vane and the cooling capacity needed. The exterior of the vanes are formed in an airfoil shape to efficiently turn the air flow the desired amount in a manner well known in the art. The turning vanes are connected to a fluid supply with single piece connectors that removably attach to the turning vanes. In the depicted embodiment the connectors are attached with screws. In the depicted embodiment the connectors are formed as a single piece in a two-piece injection mold.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: December 26, 2023
    Assignee: IFLY HOLDINGS, LLC
    Inventors: N. Alan Metni, Mark Arlitt
  • Patent number: 11846471
    Abstract: Disclosed is a shell-and-tube heat exchanger assembly, having: a first tubesheet configured for being secured to a shell of the shell-and-tube heat exchanger assembly, the first tubesheet including: a first section and a second section; the second section configured to be secured to a first shell end of the shell; and the first section including a plurality of holes configured to support a respective plurality of aluminum tubes extending through the shell, wherein the first section is configured to limit a galvanic response of the plurality of aluminum tubes when exposed to a chiller water.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: December 19, 2023
    Assignee: CARRIER CORPORATION
    Inventors: Luis Felipe Avila, Jefferi J. Covington, Tobias H. Sienel, Brian D. Videto