Abstract: The invention provides a high-pressure hydrogen production apparatus for preventing hydrogen gas from leaking toward an anode side and for obtaining excellent electrolytic efficiency. The apparatus includes a single cell having a solid polymer electrolyte membrane, power feeders, separators, and fluid channels provided in respective separators. High-pressure hydrogen gas accompanied by water is obtained in the fluid channel by supplying water to the fluid channel and applying current to each power feeder to electrolyze water. The obtained hydrogen gas and water are subjected to gas-liquid separation in a second compartment of a high-pressure vessel, and hydrogen gas thus separated is used to press a barrier member towards the single cell. The separated water is supplied to the fluid channel through the hydrogen gas guide channel.

Abstract: An apparatus for processing a substrate is provided. The apparatus includes a plating head configured to plate a surface of the substrate with a layer of a material using a fluid meniscus between the plating head and a surface of the substrate. The apparatus also includes a fluid meniscus stabilizing apparatus configured to apply a pre-processing fluid to the surface of the substrate before the fluid meniscus is applied to the surface.

Abstract: An apparatus and process is disclosed for the electrolytic removal of metal from a device, such as a medical device. More particularly, the apparatus of the invention includes a mandrel having slots or openings therein to expose portions of a metallic device, such as a stent, to an electrolytic solution to remove metal from the exposed portion.

Abstract: There is here disclosed a nozzle type ELID grinding apparatus comprising a conductive grindstone 12 having a contact surface with a workpiece 1; and an ion supply nozzle 16 that supplies an electrolytic medium 2 containing hydroxyl ions (OH?) onto a surface of the conductive grindstone, the workpiece being ground while the surface of the grindstone is dressed by electrolysis or chemical reaction. Furthermore, the apparatus comprises a grindstone power source 14 for setting the conductive grindstone to be a positive potential (+).

Abstract: An electrocoagulation treatment device includes a plurality of spaced reaction plates disposed within a reaction chamber. A voltage is applied to selected reaction plates to create an electrical field within the electrocoagulation chamber. The plates are arranged vertically which induces a vertical flow of liquid through a device. The device includes various embodiments adapted for use as a large industrial unit, a portable unit or for use within the home. The voltage and amperage of the electrical field chamber may be adjusted by placing selected reaction plates in electrical contact with the voltage source. One embodiment is especially adapted for treatment of oil slop to remove water from the oil, and for treatment of seawater to desalinate the same.

Abstract: An ion elution unit generates metal ions by applying a voltage between electrodes. Terminals are formed integrally to the electrodes. An interval between the electrodes becomes narrower from an upstream side to a downstream side with respect to a water current flowing through an inside of a casing of the ion elution unit. Terminals that are so laid as to run from the electrodes out of a casing of the ion elution unit are disposed on an upstream side with respect to a water current flowing through an inside of the casing.

Abstract: A conductive planarization assembly for use in electrochemical mechanical planarization is provided. A conductive planarization assembly in accordance with an exemplary embodiment of the invention comprises a first insulating member and a second insulating member overlying the first insulating member and having a plurality of first holes. A conductive member is interposed between the first insulating member and the second insulating member and is electrically coupled to an external circuit. The conductive member comprises a plurality of cathode regions that are exposed by the plurality of first holes of the second insulating member.

Abstract: An insulating end cap for a cylindrical electrolysis cell the type comprising at least two tubular electrodes with a cylindrical membrane arranged co-axially between them, comprises a first annular section with first and second axial ends, having at its first axial end a circular seating or one end of an outer cylindrical electrode and at its second end a circular aperture, of smaller diameter than the circular seating and co-axial therewith, to accommodate one end of the membrane. A second annular section of the end cap is detachably secured to the first and has a central circular aperture of smaller diameter than the central aperture of the first section and co-axial therewith, to accommodate one end of the inner cylindrical electrode. The two part construction of the end cap facilitates the assembly of the cell, and reduces the likelihood of breakage of the fragile ceramic membrane.

Abstract: The purpose of this invention is a leak limiter (20) of an electrolytic cell (1) for the production of aluminum, fitted with confinement means comprising passage openings for the insertion of anode stems (3), characterized in that it comprises at least one support (21), capable of surrounding all or part of an anode stem, and at least one flexible sealing body (30, 30a, 30b, 30c) arranged around all or part of the periphery (23) of the support (21) and designed to close off all or some of the free space between the inside edge of an opening and an anode stem (3). This invention improves the leak tightness of covering means used in electrolytic cells.

Abstract: An electroplating apparatus for electroplating a surface of a wafer is provided. The wafer is capable of being electrically charged as a cathode. The electroplating apparatus includes a plating head capable of being positioned either over or under the surface of a wafer and capable of being electrically charged as an anode. The plating head is capable of enabling metallic plating between the surface of the wafer and the plating head when the wafer and plating head are charged. The plating head further comprises a voltage sensor pair capable of sensing a voltage present between the plating head and the surface of the wafer, and a controller capable of receiving data from the voltage sensor pair. The data received from the voltage sensor pair is used by the controller to maintain a substantially constant voltage to be applied by the anode when the plating head is placed in positions over the surface of the wafer. A method of electroplating a wafer is also provided.

Abstract: A system and method increase yield from semiconductor wafer electroplating. The aspects include a semiconductor wafer, the semiconductor wafer comprising a plurality of die areas. A plating ring for holding the semiconductor wafer in position during electroplating is also included, the plating ring substantially surrounding a circumference of the semiconductor wafer and having a width that varies in order to avoid overlap near edge die areas of the semiconductor wafer.

Abstract: An apparatus and method are provided for electrochemically etching grooves in a working surface. In an aspect, a frame holds a working surface about an axis and facing an electrode movable along the axis. The electrode, axially movable, has surface carrying a groove pattern to fix on the working surface. A source of electrolyte is pumped at a fixed static pressure rate between the surface of the movable electrode and the working surface. In an aspect, a support fixture supports the electrode for movement toward and away from the working surface with minimal frictional restriction. A force biases the electrode surface toward the working surface so that a gap through which the electrolyte flows between the surface of the movable electrode and the working surface is determined primarily by the static flow rate of the electrolyte and the force bias of the electrode toward the working surface.

Abstract: A method of manufacture for optical spectral filters with omnidirectional properties in the visible, near IR, mid IR and/or far IR (infrared) spectral ranges is based on the formation of large arrays of coherently modulated waveguides by electrochemical etching of a semiconductor wafer to form a pore array. Further processing of said porous semiconductor wafer optimizes the filtering properties of such a material. The method of filter manufacturing is large scale compatible and economically favorable. The resulting exemplary non-limiting illustrative filters are stable, do not degrade over time, do not exhibit material delamination problems and offer superior transmittance for use as bandpass, band blocking and narrow-bandpass filters. Such filters are useful for a wide variety of applications including but not limited to spectroscopy, optical communications, astronomy and sensing.

Abstract: Some embodiments of the invention relate to an electrodeionization device that includes comprising a generally cylindrical housing. The cylindrical housing includes a cylindrical inner core and an inner electrode that extends around the inner core. The cylindrical housing includes a leaf arranged as a spiral winding about the inner electrode and an outer electrode that extends about the spiral winding. Active treatment cells are defined by spaces within the spiral winding and by interleaf spaces thereof. One or more sealing bands extend between membranes of the spiral winding to define fluid flow.

Abstract: The present invention relates to methods and apparatus for plating a conductive material on a semiconductor substrate by rotating pad or blade type objects in close proximity to the substrate, thereby eliminating/reducing dishing and voids. This is achieved by providing pad or blade type objects mounted on cylindrical anodes or rollers and applying the conductive material to the substrate using the electrolyte solution disposed on or through the pads, or on the blades. In one embodiment of the invention, the pad or blade type objects are mounted on the cylindrical anodes and rotated about a first axis while the workpiece may be stationary or rotate about a second axis, and metal from the electrolyte solution is deposited on the workpiece when a potential difference is applied between the workpiece and the anode. In another embodiment of the present invention, the plating apparatus includes an anode plate spaced apart from the cathode workpiece.

Abstract: Application of a redox polymer of the poly-[Me(R-Salen)] type onto a conducting substrate is accomplished by the method of electrochemical polymerization. Said polymerization is accomplished by supplying a voltage between the substrate (that serves as an anode) and a counter electrode (that serves as a cathode), with both of them being submerged into the electrolyte containing an organic solvent and the compounds capable of dissolving in said solvent. The process is accompanied by the production of electrochemically inactive (at concentrations of no less than 0.01 mol/l) ions within the range of potentials from ?3.0 V to +1.5 V, and metal complex [Me(R-Salen)] dissolved at a concentration of no less than 5-10?5 mol/l, (where: Me is a transition metal having at least two different degrees of oxidation, R is an electron-donating substituent, Salen is a residue of bis-(salicylaldehyde)-ethylenediamine in Schiff's base.

Abstract: Apparatus and method for electrolytic coating of a mould, the internal surfaces of which demarcate a mould cavity, with a coating material for the purpose of achieving or re-achieving intended mould cavity dimensions. The mould, as the cathode, and an anode positioned in the mould cavity and an electrolyte containing the coating material are used. The electrolyte serving as the carrier of the coating material flows through the mould cavity in a controlled manner. During the electrolytic coating, only the internal surfaces of the mould cavity come into contact with the electrolyte and the external surfaces of the s mould therefore do not have to be covered. The mechanical properties can be kept largely uniform over the entire region. The coating can be achieved more rapidly than with the conventional processes.

Abstract: A diaphragm electrolytic cell is composed of two or more overlaid modules; at least the upper modules having U-shaped anodes with diaphragm-coated cathodes housed within, allowing for a reduced electrode pitch.

Abstract: A plating apparatus for plating a substrate comprises a power supply for generating a voltage between a pair of terminals; an anode connected to one terminal of the power supply; a main cathode connected to the other terminal of the power supply while in contact with the substrate; an auxiliary cathode connected to the other terminal of the power supply while out of contact with the substrate; a main resistance R1 connected in series between the other terminal of the power supply and the main cathode; and an auxiliary resistance R2 connected in series between the other terminal of the power supply and the auxiliary cathode.

Abstract: An apparatus for electropolishing a conductive layer on a wafer using a solution is disclosed. The apparatus comprises an electrode assembly immersed in the solution configured proximate to the conductive layer having a longitudinal dimension extending to at least a periphery of the wafer, the electrode assembly including an elongated contact electrode configured to receive a potential difference, an isolator adjacent the elongated contact electrode, and an elongated process electrode adjacent the isolator configured to receive the potential difference, a voltage supply is configured to supply the potential difference between the contact electrode and the process electrode to electropolish the conductive layer on the wafer.