Patents Examined by Harry Wilkins
  • Patent number: 6890418
    Abstract: The invention describes a process for the electrolysis of an aqueous solution of alkali metal chloride, in particular sodium chloride, by the membrane process with an aqueous solution of alkali metal hydroxide, in particular sodium hydroxide, as catholyte, where the temperature of the alkali metal chloride solution in the anode half-element and/or the volume flow rate of the alkali metal chloride solution in the anode half-element are set in such a way that the difference between the temperature of the alkali metal hydroxide solution at the entry into the cathode half-element and the temperature of the alkali metal hydroxide solution at the exit from the cathode half-element are not greater than 15° C.
    Type: Grant
    Filed: December 3, 2002
    Date of Patent: May 10, 2005
    Assignee: Bayer Aktiengesellschaft
    Inventors: Andreas Bulan, Fritz Gestermann, Hans-Dieter Pinter
  • Patent number: 6652803
    Abstract: When a nitride film is formed on a substrate containing at least metallic aluminum, a fluctuation in forming a nitride film can be prevented, or the formation of the nitride film can be accelerated. A substrate containing at least metallic aluminum is subjected to a heating treatment in vacuum of 10−3 torrs or less, and subsequently it is subjected to a heating/nitriding treatment in an atmosphere (5) containing at least nitrogen. During the heating/nitriding treatment, porous bodies (3) and (4) through which nitrogen atoms-containing gases (A) and (B) can flow are contacted with the atmosphere (5).
    Type: Grant
    Filed: July 26, 2001
    Date of Patent: November 25, 2003
    Assignee: NGK Insulators, Ltd.
    Inventors: Morimichi Watanabe, Shinji Kawasaki, Takahiro Ishikawa
  • Patent number: 6521176
    Abstract: A lead-free solder alloy composition containing Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.
    Type: Grant
    Filed: December 4, 2000
    Date of Patent: February 18, 2003
    Assignee: Fujitsu Limited
    Inventors: Masayuki Kitajima, Masakazu Takesue, Yasuo Moriya, Yoshinori Nemoto, Yumiko Fukushima
  • Patent number: 6416598
    Abstract: A free machining aluminum alloy contains an effective amount of one or more high melting point constituents that provide enhanced machining capability. The high melting point constituents occupy from about 0.1 to about 3.0 volume percent of the aluminum alloy. The constituents can be any material that is essentially insoluble in the aluminum alloy matrix so as to form a discontinuity and one that will resist deformation during machining to enhance the formation of voids between the matrix and the free machining constituents. The constituents include elements, nitrides, oxides, borides, carbides, silicides, aluminides and combinations thereof that have a high melting point and high strength and low solubility in aluminum at the elevated temperature so that the constituents resist deformation during the machining operation. The free machining aluminum alloy can be formed as a workpiece and subjected to any machining operation.
    Type: Grant
    Filed: April 20, 1999
    Date of Patent: July 9, 2002
    Assignee: Reynolds Metals Company
    Inventor: Subhasish Sircar
  • Patent number: 6409853
    Abstract: A process for forging large components of Alloy 718 material so that the components do not exhibit abnormal grain growth includes the steps of: a) providing a billet with an average grain size between ASTM 0 and ASTM 3; b) heating the billet to a temperature of between 1750° F. and 1800° F.; c) upsetting the billet to obtain a component part with a minimum strain of 0.125 in at least selected areas of the part; d) reheating the component part to a temperature between 1750° F. and 1800° F.; e) upsetting the component part to a final configuration such that said selected areas receive no strains between 0.01 and 0.125; f) solution treating the component part at a temperature of between 1725° F. and 1750° F.; and g) aging the component part over predetermined times at different temperatures. A modified process achieves abnormal grain growth in selected areas of a component where desirable.
    Type: Grant
    Filed: October 25, 1999
    Date of Patent: June 25, 2002
    Assignee: General Electric Company
    Inventors: Samuel V. Thamboo, Ling Yang