Abstract: A tire includes a tread portion 2. At least one middle lateral groove 10 includes first and second middle tie bars 16 and 17. First and second middle sipes 21 and 22 are provided on a ground-contact surface 15s of at least one middle block 15. The first middle sipe 21 includes a termination end 21a located on an inner side in a tire axial direction with respect to the first middle tie bar 16. The second middle sipe 22 includes a termination end 22a located on an outer side in the tire axial direction with respect to the second middle tie bar 17 and on the inner side in the tire axial direction with respect to the termination end 21a of the first middle sipe 21. On the ground-contact surface 15s of the middle block 15, no groove and no sipe are provided in a first region 23.
Abstract: An electrically powered suspension system performs an accurate vibration damping of a vehicle with low power consumption even if a linear motor of an electromagnetic actuator strokes to reach an irregular region and includes an electromagnetic actuator generating a driving force for the vibration damping. A linear motor of the actuator includes a cylindrical rod member provided with a plurality of on-rod armature coils along its axis and a housing surrounding the rod member, mounted movable back and forth along the axis with respect to the rod member, and provided with a plurality of permanent magnets along the axis. The on-rod armature coils located on ends of the rod member are provided with short-circuit parts b suppressing the rod member and the housing from moving back and forth with respect to each other.
Abstract: An image sensor for securing an area of a photodiode includes a pixel area and a transistor area adjacent to the pixel area. The pixel area may include a photodiode and a floating diffusion area. The transistor area may include transistors extending along an edge of the pixel area. The transistors in the transistor area may include a reset transistor, one or more source follower transistors, and one or more selection transistors, and the reset transistor and one source follower transistor adjacent to the reset transistor may share a common drain area. The source follower transistors and the selection transistors may each share a common source area or a common drain area between two adjacent transistors thereof.
Abstract: A chip package structure, manufacturing method thereof, and module are described. In an embodiment, the chip package structure includes: a substrate, a wiring layer, a chip, and a second conductive bump, wherein, in an embodiment, the substrate includes a first region and a second region surrounding the first region, and the wiring layer is located on side of the substrate and includes metal wire, wherein at least part of a metal wire is in contact with the substrate in direction perpendicular to the substrate, and the metal wire overlaps with the second region, wherein the chip is located on side of the wiring layer facing away from the substrate, and the chip corresponds to the first region. In an embodiment, a first conductive bump is provided on side of the chip facing away from the substrate and is electrically connected to the metal wire.
Abstract: An obstacle detection system includes a light emitter that emits a light signal and a light detector configured to receive a portion of the light signal reflected back from an object. The system includes a processor operatively coupled to the light emitter and the light detector to determine a presence of an obstacle based on the portion of the light signal received by the light detector. The system includes a heater operatively coupled to a power source and at least one sensor configured to determine an ambient temperature and an ambient relative humidity. The processor is operatively coupled to the power source, the heater, and the at least one sensor. The processor is configured to calculate a dew point of the environment from the ambient relative humidity and the ambient temperature and to activate the heater in response to the ambient temperature being less than the dew point.
Abstract: The present invention relates to a master cylinder arrangement for a brake system, comprising a tandem master cylinder including a master cylinder housing, a first master piston movably arranged in the master cylinder housing, a second master piston movably arranged in the master cylinder housing, a balancing piston movably arranged in the second master piston, and an elastic pedal feel element. The invention further relates to a hydraulic system for a brake system as well as a brake system.
Abstract: A wheeled cart includes a collapsible basket assembly configured to transport a variety of objects placed within. A brake lever arm is pivotably attached to the basket assembly and pivotable about a brake lever arm axis. A brake lever arm distal end is engaged by a user's foot to move between a released position and a braked position. The brake lever arm includes a brake feature. An inside face of a wheel includes a plurality of stops radially disposed about its axis. In the braked position the brake feature is configured to be positioned between at least two of the plurality of stops of the respective rear wheel thereby preventing rotation of the wheel. In the released position the brake feature is configured to be positioned outside the plurality of stops thereby allowing rotation of the wheel.
Abstract: The optical module includes a housing, a lid that closes an opening of the housing, an optical component arranged inside the housing, and a printed circuit board arranged on a front surface of the lid outside the housing so as to be used as a board on which a control circuit that controls the optical component is mounted. The optical module further includes a side electrode that is provided on a side surface of the housing and configured to be electrically connected to an electrode of the optical component; and a flexible substrate that provides electrical connection between the side electrode and an electrode of the control circuit. The optical module can be miniaturized by integrating the optical component and the control circuit.