Abstract: The present invention provides a method for producing a film forming resin suitable for use in a photoresist composition, involving the following steps: (a) providing a solution of a film forming resin in a solvent; (b) providing the following two filter sheets: (i) a filter sheet containing a self-supporting fibrous matrix having immobilized therein a particulate filter aid and particulate ion exchange resin particles, where the particulate filter aid and ion exchange resin particles are distributed substantially uniformly throughout a cross-section of said matrix; and (ii) a filter sheet containing a self-supporting matrix of fibers having immobilized therein particulate filter aid and binder resin; (c) rinsing the filter sheets of step (b) with the solvent of step (a); and (d) passing the solution of the film forming resin through the rinsed filter sheets of step (c).

Abstract: A lithographic printing plate support includes a support and a hydrophilic layer on the support, wherein the hydrophilic layer includes a polymer compound that is chemically bonded directly to the support surface and has a hydrophilic functional group.

Abstract: Dipropargyl acetamide derivatives of following Formula 1 which are photoresist monomers, polymers thereof, and photoresist compositions containing the same. The photoresist polymer has high etching resistance, adhesiveness and post-exposure delay stability. As a result, the photoresist composition is suitable to form a fine pattern in a deep ultraviolet region. wherein, n is an integer from 0 to 5.

Abstract: A hydrogenated product of a ring-opening metathesis polymer comprising structural units as shown below has improved heat resistance, pyrolysis resistance and light transmission and is suited as a photoresist for semiconductor microfabrication using UV or deep-UV. A resist composition comprising the polymer as a base resin is sensitive to high-energy radiation and has excellent sensitivity, resolution, and etching resistance.

Abstract: In accordance with the present invention there is provided an imaging element for lithographic offset printing. The imaging element comprises hydrophobic polymer particles in an aqueous medium, a substance for converting light into heat and an inorganic salt. The imaging element may be used for printing long run lengths on lower quality paper and in the presence of set-off powder. The imaging element may be imaged and developed on-press and may be sprayed onto a hydrophilic surface to create a printing surface that may be processed wholly on-press. The hydrophilic surface may be a printing plate substrate or the printing cylinder of a printing press or a seamless sleeve around the printing cylinder of a printing press. This cylinder may be conventional or seamless.

Abstract: An image-forming material which has high sensitivity and is excellent in image-forming performance and which does not produce smudges on an optical system of an exposing apparatus, and a planographic printing original plate which uses this image-forming material and can produce images by an infrared laser for a direct plate-making process. These can be achieved by an image-forming material containing an infrared absorber having in the same molecule thereof two or more chromophoric groups which can absorb infrared radiation and are each bonded by a covalent bond.

Abstract: Photoresist monomers which can be used to form photoresist polymers and photoresist compositions using the same which are suitable for photolithography processes employing a deep ultraviolet light source and copolymers thereof. Monomers are represented by following Formula 1: wherein, R1, is —OH or —R—OH; R represents substituted or unsubstituted linear or branched (C1-C10) alkylene, substituted or unsubstituted (C1-C10) alkylene comprising an ether linkage, substituted or unsubstituted (C1-C10) alkylene comprising an ester linkage, or substituted or unsubstituted (C1-C10) alkylene comprising an ketone moiety; and 1 is an integer of 1 or 2.

Abstract: The present invention can provide a heat-sensitive lithographic printing plate which can be subjected to aqueous development or does not require any special treatment such as wet development and rubbing after image writing, in particular, a heat-sensitive lithographic printing plate which can be subjected to recording by a solid laser or semiconductor laser emitting infrared rays to allow direct plate making from digital data. Furthermore, the present invention can provide a heat-sensitive lithographic printing plate excellent in press life. The heat-sensitive lithographic printing plate comprises an image-forming layer containing a polymer which is capable of changing its hydrophilicity by heat and is crosslinked by crosslinking reaction.

Abstract: A photosensitive flexographic printing element for the production of flexographic printing plates by digital imaging by means of lasers which has an IR-ablative layer with a polyether-polyurethane as binder. A process for the production of flexographic printing plates using an element of this type.

Abstract: A process for making thermally imageable negative working compositions comprising the steps of: (1) providing a patterning composition layer on a substrate, said patterning composition comprising: (a) at least one thermal-generator acid generator, (b) at least one cross-linking resin or compound; (c) at least one binder resin comprising a polymer containing at least one reactive pendent group selected from the group, consisting of hydroxyl, carboxylic acid, sulfonamide, alkoxymethylamide and mixtures thereof; and (d) at least one infrared absorber; (2) subjecting the patterning composition layer to a two-stage radiation exposure; (a) one stage being a flood UV-exposure; and (b) the other stage being a imagewise infrared exposure stage; (3) treating the exposed patterning composition with heat energy; and (4) developing the heat treated, exposed patterning composition with an aqueous alkaline developer to remove the non-imaged areas of the patterning composition and leaving the imaged areas substanti

Abstract: A printing plate element is disclosed, comprising a substrate and a component layer containing a first material which is water-insoluble or capable of varying from being water-soluble to being water-insoluble at a prescribed temperature of not less than 60° C. and a second material which is water-soluble and has a melting point of 60 to 300° C. A method of preparing a printing plate is also disclosed, comprising imagewise exposure of the printing plate element and removing an unexposed area of the printing plate element with aqueous solution.

Abstract: A lithographic printing plate precursor having a heat-sensitive layer on a water-receptive substrate, wherein the heat-sensitive layer comprises microcapsules containing a compound having a thermally reactive functional group, and the heat-sensitive layer or a layer adjacent to the heat-sensitive layer contains a compound capable of acting as a co-reactant in thermal reaction of the compound having a thermally reactive functional group in a state contained in other microcapsules.

Abstract: A copolymer useful in radiation sensitive compositions for lithographic printing plates comprises the units A, B, C and D, wherein A is present in an amount of 0.5 to 30 wt.-% and is of the formula wherein R is hydrogen, C1-C4 alkyl, —CH═COOH or B is present in an amount of 5 to 35 wt.-% and is of the formula C is present in an amount of 10 to 55 wt.

Abstract: A compound of formula (I) wherein n is e.g. a number from 2 to 50; R5′ and R5″ are e.g. a group of formula (II); G1, G2, G3 and G4 are e.g. C1-C4akyl; R1 is e.g. hydrogen or C1-C4alkyl; R2 is e.g. methylene; R3′ is e.g. hydrogen and R3″ is e.g. hydrogen or C1-C4alkyl; R4 is e.g. C2-C8alkylene; and X is e.g. —N(R7)R8) with R7 and R8 being independently of one another hydrogen or C1-C8alkyl, is useful for stabilizing an organic material against degradation induced by light, heat or oxidation.

Abstract: Contact structures, methods for forming contact structures, and masks for forming contact structures are disclosed. According to one embodiment a contact hole (208) may be formed with a contact hole mask (106/106′) that may have a generally rectangular shape and include corner extensions (108-0 to 108-3) and side indents (110-0 to 110-3). A long side of a contact hole (208) may be aligned in the same direction as an active area (204). A contact hole (208) may be situated between a first portion (206-0) and a second portion (206-1) of an intermediate structure (206). Alternate embodiments can include a “cactus” shaped intermediate structure (406) that may be formed with an intermediate structure mask having corner indents (308).

Abstract: There are provided a photosensitive polymer and a photoresist compositing containing the same. The photosensitive polymer is represented by the following formula: wherein R1 is an acid-labile tertiary alkyl ester group, R2 is hydrogen atom, methyl, ethyl, carboxyl, &ggr;-butyrolactone-2-yl ester, &ggr;-butyrolactone-3-yl ester, pantolactone-2-yl ester, mevalonic lactone ester, 3-tetrahydrofuranyl ester, 2,3-propylenecarbonate-1-yl ester, 3-methyl-&ggr;-butyrolactone-3-yl ester or C3 to C20 alicyclic hydrocarbon, a/(a+b+c) is 0.1˜0.7, b/(a+b+c) is 0.1˜0.8, c/(a+b+c) is 0.0˜0.8, and n is an integer in the range of 0 to 2.

Abstract: A positive photosensitive printing plate is prepared wherein the photosensitivity is to near-infrared rays which do not induce a chemical change in a photosensitive component. The photosensitive material has an inclined structure from the viewpoint of dissolution of the irradiated portion in an alkali developer. The dissolution rate is such that it continuously increases from the upper, surface part of the photosensitive material to the lower part of the photosensitive material. This effect may be enhanced by diffusion of a material, preferably a polar compound, such as H2O, from the surface toward the inner lower part of the photosensitive material. Techniques for accomplishing the diffusion include contacting the surface of the photosensitive material with an atmosphere of high humidity or overlaying the photosensitive material with a layer of protective material (paper) containing moisture and heating the resultant composite.

Abstract: An ester compound of the following formula (1) is provided. R1 is H, methyl or CH2CO2R3, R2 is H, methyl or CO2R3, R3 is C1-C15 alkyl, k is 0 or 1, Z is a divalent C2-C20 hydrocarbon group which forms a single ring or bridged ring with the carbon atom and which may contain a hetero atom, m is 0 or 1, n is 0, 1, 2 or 3, and 2m+n=2 or 3. A resist composition comprising as the base resin a polymer resulting from the ester compound is sensitive to high-energy radiation, has excellent sensitivity, resolution, and etching resistance, and is suited for micropatterning using electron beams or deep-UV.

Abstract: A lithographic printing method is disclosed which comprising the steps of providing an imaging material which comprises a support and an image-recording layer that is not removable with a single-fluid ink which comprises an ink phase and a polar phase; image-wise exposure of the image-recording layer to heat or light without substantially ablating said image-recording layer, thereby switching the affinity of the image-recording towards ink or an ink-abhesive fluid and thereby creating a printing master comprising a lithographic image which consists of unexposed areas that have affinity for one phase of said ink phase and polar phase and of exposed areas that have affinity for the other phase of said ink phase and polar phase; printing, wherein the single-fluid ink is supplied to the printing master.

Abstract: A first resist layer, capable of generating an acid, is formed on a semiconductor base layer and is developed in a shortened developing time than usual. The first resist pattern is covered with a second resist layer containing a material capable of crosslinkage in the presence of an acid. The acid is generated in the first resist pattern by application of heat or by exposure to light, and a crosslinked layer is formed in the second resist pattern at the interface with the first resist pattern as a cover layer for the first resist pattern, thereby the first resist pattern is caused to be thickened. The non linked portion of the second resist layer is removed and the fine resist pattern is formed. Thus, the hole diameter of the resist pattern can be reduced, or the isolation width of a resist pattern can be reduced.