Patents Examined by Jason N Thompson
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Patent number: 11959650Abstract: An outdoor unit of an air-conditioning apparatus includes a compressor, a heat exchanger, and a controller. The controller includes a compressor driving circuit configured to drive the compressor, a harmonic suppressing unit configured to suppress harmonics in the compressor driving circuit, and a housing containing the compressor driving circuit and the harmonic suppressing unit. The housing has a first section having ventilation holes that allow communication between the outside and the inside, and a second section constituting a frame outside the first section. The first section contains the harmonic suppressing unit and a fan configured to blow air from inside the first section to the outside through the ventilation holes. The second section contains the compressor driving circuit.Type: GrantFiled: November 16, 2018Date of Patent: April 16, 2024Assignee: Mitsubishi Electric CorporationInventors: Tomohiro Mori, Keizo Kamada
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Patent number: 11940177Abstract: An air treatment apparatus (10), such as a dehumidifier or latent cooling system, has a desiccant wheel (12) having a plurality of similar internal structures (14), a shroud (16), at least a first fan (18, 20), a motor (30), an axle (32), slip rings (34), and sliding contacts (36). The similar internal structures are coated with a desiccant, and may be shaped as blades, cylinders, boxes, teeth, or corrugations. The shroud divides the wheel into an active area where the desiccant removes moisture to provide treated air (22), and a regeneration area where the desiccant is heated to release the adsorbed moisture from the air (28). Switches, such as magnetic switches, apply electrical power to heaters in the similar internal structures as they rotate into the regeneration area thereby heating and drying the desiccant.Type: GrantFiled: May 26, 2022Date of Patent: March 26, 2024Assignee: MakeSHIFT Innovations, LLCInventor: William R. Nixdorf
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Patent number: 11930618Abstract: A liquid cooling head includes a bottom plate, a heat dissipation plate, a partition plate and an upper cover plate. The bottom plate includes an opening, and the heat dissipation plate, the partition plate and the upper cover plate are fixed to the bottom plate. The partition plate divides the opening into a plurality of cooling chambers, and each cooling chamber is equipped with a cooling liquid inlet, a cooling liquid outlet, a pump and an electric control device. The cooling liquid inlet and the cooling liquid outlet are formed in the upper cover plate, the pump is fluid-connected to the cooling liquid outlet, and the electric control device drives the pump to rotate, so that the cooling liquid flows through the cooling chamber to cool one heat source below the heat dissipation plate. In addition, a liquid cooling device with the liquid cooling head is also disclosed therein.Type: GrantFiled: August 31, 2021Date of Patent: March 12, 2024Assignee: AURAS TECHNOLOGY CO., LTD.Inventors: Chien-Yu Chen, Tian-Li Ye, Jen-Hao Lin, Chien-An Chen
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Patent number: 11913735Abstract: A heat exchanger includes a collecting pipe, a number of heat exchange tubes and a distribution pipe. A pipe wall of the distribution pipe defines a number of through holes communicating with the collecting pipe. The through holes are a first through hole, . . . an (n?1)th through hole and an nth through hole disposed in sequence along a direction from a first end to a second end of the distribution pipe. A distance between an (i+1)th through hole and an ith through hole is: di=?iL0, i=1, 2, . . . n?1, ?=0.618, L0 is a distance between adjacent heat exchange tubes. As a result, uniformity of refrigerant distribution in the heat exchanger is improved.Type: GrantFiled: May 25, 2021Date of Patent: February 27, 2024Assignee: HANGZHOU SANHUA RESEARCH INSTITUTE CO., LTD.Inventors: Zhaogang Qi, Linjie Huang, Qiang Gao, Jianlong Jiang, Yujiao Niu, Chunyu Shao
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Patent number: 11910566Abstract: A commonly designed processor heat exchanger decouples the mounting hardware used to mount the heat exchanger to a processor from the heat exchanger itself. This allows a single heat exchanger design to be mounted to various different types of processors using processor customized mounting brackets that engage with flanges extending out from a body of the heat exchanger.Type: GrantFiled: March 18, 2021Date of Patent: February 20, 2024Assignee: Amazon Technologies, Inc.Inventors: Luke Thomas Gregory, Darin Lee Frink, Rick Chun Kit Cheung, Nafea Bshara, Kenny Kiet Huynh, Noah Kelly, Priti Choudhary, Ali Elashri
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Patent number: 11906253Abstract: A heat exchange device includes a heat exchanger and a water guider. The water guider is arranged on the heat exchanger and has a water guide groove, and condensed water on at least a part of the heat exchanger can flow out through the water guide groove. The heat exchange device has a good drainage performance, can prevent the condensed water from accumulating, and thus improves a heat exchange area and a heat exchange efficiency of the heat exchanger.Type: GrantFiled: July 26, 2019Date of Patent: February 20, 2024Assignee: SANHUA (HANGZHOU) MICRO CHANNEL HEAT EXCHANGER CO., LTD.Inventors: Zhiming Dong, Peng Qin, Qiang Gao, Xionglin Li, Michael Shows, James Thomas
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Patent number: 11877421Abstract: A cooling liquid flow control device includes a heat dissipation bottom plate, a fixing holder, a cooling module, and a temperature control element. The heat dissipation bottom plate has a bottom surface configured to be in contact with a heating element on a substrate. The fixing holder is connected to the heat dissipation bottom plate and configured to be fixed with the substrate. The cooling module is connected to a top surface of the heat dissipation bottom plate to form a cavity. The cavity is configured to circulate a cooling liquid. The temperature control element is connected to the cooling module and includes a valve. The valve is configured to reciprocally move based on a temperature of the heating element, thereby adjusting a flow rate of the cooling liquid in and out of the cavity.Type: GrantFiled: December 7, 2021Date of Patent: January 16, 2024Assignees: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATIONInventors: Han Chih Hsieh, Hsiu-Hui Kuo, Yang Chang Su, Chih Hung Cheng
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Patent number: 11867423Abstract: A heat pump and a method for operating a heat pump are provided. The heat pump may include an outdoor unit including a compressor that compresses a refrigerant and an outdoor heat exchanger that exchanges heat between the refrigerant and outdoor air, a hybrid unit including at least one fluid-refrigerant heat exchanger that exchanges heat between the refrigerant supplied from the outdoor unit and a fluid, such as water, and at least one refrigerant control valve that controls an amount of refrigerant flowing through the at least one fluid-refrigerant heat exchanger, a plurality of indoor units each including an indoor heat exchanger that exchanges heat between the fluid supplied from the hybrid unit and indoor air, and a controller. The controller may calculate operation loads of the plurality of indoor units and control an opening degree of the at least one refrigerant control value based on the operation loads of the plurality of indoor units.Type: GrantFiled: March 25, 2021Date of Patent: January 9, 2024Assignee: LG ELECTRONICS INC.Inventors: Youngjoo Shin, Chiwoo Song, Jaewon Lee, Soyoon Kim
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Patent number: 11867471Abstract: A heat exchanger includes a bag-like outer packaging material. A heat medium flows into an inside of the outer packaging material via the heat medium inlet, passes through the inside, and flows out of the outer packaging material via the heat medium outlet. An inner core material is arranged in the inside of the outer packaging material. The outer packaging material has an outer packaging laminate material including a metal heat transfer layer and a resin thermal fusion layer on a surface side of the heat transfer layer. The outer packaging laminate materials form a bag shape by integrally joining the thermal fusion layers along the peripheral edge portions. The inner core material includes the inner core laminate material with a metal heat transfer layer and resin thermal fusion layers on surface sides of the heat transfer layer.Type: GrantFiled: January 31, 2023Date of Patent: January 9, 2024Assignee: SHOWA DENKO PACKAGING CO., LTD.Inventor: Koji Minamitani
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Patent number: 11835268Abstract: An underground heat exchange type cooling and heating system includes an underground heat exchange device to allow heat to be exchanged between a first heat medium and a geothermal heat; a plurality of cooling and heating units which cools or heats an indoor space by means of a second heat medium; a plurality of heat pump units which allows heat to be exchanged between the first heat medium and the second heat medium; a first transfer line which transmits the first heat medium to the plurality of heat pump units and transmits the first heat medium having undergone heat exchange in the plurality of heat pump units to the underground heat exchange device; and a second transfer line which transmits the second heat medium to the plurality of cooling and heating units.Type: GrantFiled: November 20, 2020Date of Patent: December 5, 2023Assignee: INTERTECH Co., Ltd.Inventor: Jong Woo Kim
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Patent number: 11832418Abstract: A liquid cooling head includes a chassis, an inlet channel, a thermally-conducting structure, a liquid gathering structure, a drain channel and a pump set. The chassis includes a lower chamber and an upper chamber communicated with the lower chamber through a connection opening. The inlet channel is disposed on one side of the chassis, and communicated with the upper chamber for radiating the heat of the working fluid away. The thermally-conducting structure is disposed in the lower chamber for gathering the working fluid passed through the thermally-conducting structure. The drain channel is disposed on one side of the chassis to be communicated with the lower chamber. The pump set for pushing the working fluid in the lower chamber to discharge the working fluid outwards from the drain channel.Type: GrantFiled: March 26, 2021Date of Patent: November 28, 2023Assignee: AURAS TECHNOLOGY CO., LTD.Inventors: Chien-Yu Chen, Tian-Li Ye, Yu Chen, Jen-Hao Lin, Chien-An Chen, Yun-Kuei Lin
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Patent number: 11827957Abstract: There are provided a heat exchanger having a flat tube and a fin bonded together, without causing melting of a coating material covering the fin, and a method of manufacturing thereof. A heat exchanger includes: a flat tube having a flat cross-sectional shape and covered with an anticorrosive layer; and a fin bonded to the flat tube with a bonding agent on a first surface of the anticorrosive layer interposed therebetween, and covered with a coating material, the first surface of the anticorrosive layer having been roughened, and the bonding agent being fixed to the roughened first surface.Type: GrantFiled: September 30, 2022Date of Patent: November 28, 2023Assignee: Mitsubishi Electric CorporationInventor: Daisuke Ito
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Patent number: 11796212Abstract: An air-conditioning apparatus includes a controller configured to operate in a heating normal operation mode and a heating-defrosting operation mode. In a case of switching from the heating normal operation mode to the heating-defrosting operation mode, the controller makes a selection from an initial control mode 1, in which control is performed such that an initial frequency of the compressor is set to a predetermined maximum frequency and an initial opening degree of the flow control device is set to an opening degree lower than a predetermined maximum opening degree, and an initial control mode 2, in which control is performed such that the initial opening degree of the flow control device is set to the predetermined maximum opening degree and the initial frequency of the compressor is set to a frequency lower than the predetermined maximum frequency, to execute the heating-defrosting operation mode.Type: GrantFiled: April 11, 2019Date of Patent: October 24, 2023Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Kazuya Watanabe, Shohei Ishimura, Koji Fukui, Kojiro Katayama, Kosuke Tanaka, Kazuki Okada, Kazushige Baba
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Patent number: 11800634Abstract: A heat sink fastening structure includes a push pin to fasten a heat sink to a printed circuit board (PCB) and including a head portion formed at an end thereof, a bracket mounted on the PCB and including a through hole formed at a central portion thereof to allow the head portion to penetrate, and an accommodating hole included in the PCB to accommodate the head portion therein, and the head portion is configured to penetrate the through hole and thereafter be accommodated in the accommodating hole, to thereby be fixed to the bracket.Type: GrantFiled: September 18, 2020Date of Patent: October 24, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Juhyeok Kim, Boik Cho, Jieun Ha, Sangeun Lee
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Patent number: 11774196Abstract: A heat exchange system having desired anti-scaling performance and an anti-scaling method thereof are disclosed. The heat exchange system at least comprises a load control unit, a temperature and pressure detection unit and an anti-scaling treatment unit. The heat exchange system conditions bonding ways of water quality in a HVAC chiller unit, an air compressor, a heat exchanger, a cooling unit, or a boiler under a variety of scaling conditions in both field operation and water quality, by integrating the interaction of those units together with the anti-scaling method for simulating water quality that has a water quality limit same as that in field operation. The heat exchange system further integrates with a testing of anti-scaling performance to make water quality no longer charged and lose the reaction power so as to prevent scaling formation, enhance the anti-scaling performance, and ensure operating efficiency and performance.Type: GrantFiled: May 23, 2019Date of Patent: October 3, 2023Inventor: Chu-Fu Chen
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Patent number: 11732981Abstract: This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.Type: GrantFiled: June 7, 2022Date of Patent: August 22, 2023Assignee: COOLER MASTER CO., LTD.Inventors: Chia-Yu Lin, Chang-Yu Hsieh, Shan-Yin Cheng, Hsiang-Fen Chou
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Patent number: 11725888Abstract: A mounting bracket for mounting a condensate trap to a heating, venting, and air conditioning (HVAC) system that can be mounted in multiple orientations such that the condensate trap receives condensate fed by gravity.Type: GrantFiled: December 6, 2019Date of Patent: August 15, 2023Assignee: JOHNSON CONTROLS TYCO IP HOLDINGS LLPInventor: Thomas D. Chase
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Patent number: 11725847Abstract: A device comprises: a plurality of tubular members; a plurality of nodes configured to be assembled with the tubular members and thereby form a frame configured to support an outdoor equipment item thereon; and a plurality of augers configured to be driven through the nodes into a ground such that the frame is secured to the ground when the frame supports the outdoor equipment item.Type: GrantFiled: March 9, 2021Date of Patent: August 15, 2023Assignee: DiversiTech CorporationInventors: Jonathan M. Sada, David J. Oriatti
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Patent number: 11724789Abstract: Disclosed herein is a BOG reliquefaction method for LNG ships. The BOG reliquefaction method for LNG ships includes: 1) compressing BOG; 2) cooling the BOG compressed in Step 1) through heat exchange between the compressed BOG and a refrigerant using a heat exchanger; 3) expanding the BOG cooled in Step 2); and 4) stably maintaining reliquefaction performance regardless of change in flow rate of the BOG compressed in Step 1) and supplied to the heat exchanger to be used as a reliquefaction target.Type: GrantFiled: January 24, 2018Date of Patent: August 15, 2023Assignee: DAEWOO SHIPBUILDING & MARINE ENGINEERING CO., LTD.Inventors: Hae Won Jung, Dong Eok Kang, Joon Chae Lee, Dong Kyu Choi
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Patent number: 11712942Abstract: A receiver drier assembly for an automotive heat exchanger is provided with a single-piece cap. In embodiments described herein, a modulator has a tubular wall and one or more openings are formed therein. The cap is a single-piece cap and is configured to attach directly to the tubular wall via a snap fit. The cap may have a protrusion that is configured to snap into engagement with the opening in the modulator when properly assembled. The protrusion may be tapered such that as the cap is assembled to the modulator, the protrusion is forced radially inwardly via the tapered surface sliding along the tubular wall. Once the protrusion meets the opening, the protrusion is allowed to flex radially outward toward its natural unbiased position, snap fitting with the opening of the tubular wall.Type: GrantFiled: March 30, 2021Date of Patent: August 1, 2023Assignee: Denso International America, Inc.Inventor: Luis David Gutierrez