Abstract: A fiber optic cable breakout assembly includes: a fiber optic cable including a plurality of first optical fibers and a first jacket surrounding the optical fibers; a breakout canister; a plurality of pigtail cords, each of the pigtail cords including a second optical fiber partially encased in a second jacket and an optical connector, each of the pigtail cords extending away from the canister, each of the optical fibers extending through the canister; and a flexible furcation tube attached to and extending between the fiber optic cable and the breakout canister, the furcation tube including an armored inner layer and a polymeric outer layer, wherein each of the first optical fibers is spliced to a respective second optical fiber within the inner layer of the furcation tube.

Abstract: An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C. The waveguide provides low film stress and low optical signal loss. Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops. Optical signals are delivered to the submount assembly via optical fibers. The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted. The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.

Abstract: An electronic device may have a display and other optical components such as optical sensors. The display and other components may be overlapped by chemically strengthened glass coherent fiber bundles. The surfaces of a coherent fiber bundle may include ion-exchanged glass that places theses surfaces under compressive stress. In some configurations, the coherent fiber bundle is symmetrically stressed and has equal amounts of compressive stress on opposing surfaces. In other configurations, the coherent fiber bundle is asymmetrically stressed and has more compressive stress on one surface than the other. The coherent fiber bundle may have areas with curved cross-sectional profiles, planar areas, and/or areas with compound curvature. Sensor windows may be formed in the coherent fiber bundle that are surrounded by an opaque area. When overlapping a display, the coherent fiber bundle may serve as a display cover glass layer.

Abstract: An optical module includes a waveguide interposer and at least one light source unit. The waveguide interposer includes at least one input terminal, at least one waveguide channel, and at least one output terminal. The at least one input terminal is configured to receive laser light, and the at least one waveguide channel is coupled to the at least one input terminal and is configured to guide the laser light. Each light source unit is configured to output the laser light to a corresponding input terminal of the at least one input terminal.

Abstract: A device includes a light guide. The device also includes a first in-coupling element configured to couple a first input light into the light guide, and a first out-coupling element configured to couple the first input light out of the light guide as a first output light having a first output field of view (“FOV”). The device also includes a second in-coupling element configured to couple a second input light into the light guide. The device further includes a second out-coupling element configured to couple the second input light out of the light guide as a second output light having a second output FOV substantially non-overlapping with the first output FOV. A combination of the first and second output FOVs is larger than at least one of the first or second output FOV, and the first and second input lights have orthogonal polarizations.

Abstract: A piezoelectric actuator is provided, including a vibration plate, a piezoelectric layer, a plurality of individual electrodes arranged in two arrays, first and second common electrodes which have first and second facing portions facing parts of the individual electrodes and first and second connecting portions connecting the first and second facing portions respectively, and first and second wiring portions which are arranged on the vibration plate and which are connected to the first and second common electrodes respectively via first and second connecting wirings, wherein one of the first connecting wirings connects the first connecting portion and one of the first wiring portion while striding over the second connecting portion.

Abstract: To reduce bad connections of a BGA optical module as an optical fiber interface during mounting by reflowing. An optical module includes: a substrate to which an optical fiber is connected and fixed and on which an electronic circuit, an optical circuit or the like is formed; a ball grid array provided on one face of the substrate as an electrical interface used when the optical module is mounted on a mounting substrate; a lid having a thermal conductivity provided on another face of the substrate; and a fiber routing mechanism provided in contact with the lid, the fiber routing mechanism having a thermal conductivity and shaped to enable the optical fiber to be wound around the fiber routing mechanism.

Abstract: A fiber optic connector along with a tool allows for the changing of the polarity of the fiber optic connector. Keys may be installed in both the top and the bottom of the fiber optic connector, one in a first position and the other in a second position. Using the tool in one back-and-forth motion, the polarity of the fiber optic connector can be changed. The keys have a configuration that resist an incorrect insertion and provide better retention of the keys in the correct configuration due to a better retention force.

Abstract: A transparent substrate has two parallel faces and guides collimated image light by internal reflection. A first set of internal surfaces is deployed within the substrate oblique to the parallel faces. A second set of internal surfaces is deployed within the substrate parallel to, interleaved and in overlapping relation with the first set of internal surfaces. Each of the internal surfaces of the first set includes a first coating having a first reflection characteristic to be at least partially reflective to at least a first subset of components of incident light. Each of the internal surfaces of the second set includes a second coating having a second reflection characteristic complementary to the first reflection characteristic to be at least partially reflective to at least a second subset of components of incident light. The sets of internal surfaces cooperate to reflect all components of light from the first and second subsets.

Abstract: Examples disclosed herein relate to quantum-dot (QD) photonics. In accordance with some of the examples disclosed herein, a QD semiconductor optical amplifier (SOA) may include a silicon substrate and a QD layer above the silicon substrate. The QD layer may include an active gain region to amplify a lasing mode received from an optical signal generator. The QD layer may have a gain recovery time such that the active gain region amplifies the received lasing mode without pattern effects. A waveguide may be included in an upper silicon layer of the silicon substrate. The waveguide may include a mode converter to facilitate optical coupling of the received lasing mode between the QD layer and the waveguide.

Abstract: Aspects described herein include an apparatus supporting optical alignment with one or more optical waveguides optically exposed along an edge of a photonic integrated circuit (IC). The apparatus comprises a frame body comprising an upper portion defining a reference surface, and a lateral portion defining an interface for an optical connector connected with one or more optical fibers. The lateral portion comprises one or more optical components defining an optical path through the lateral portion. The one or more optical components are arranged relative to the reference surface such that the one or more optical components align with (i) the one or more optical waveguides along at least one dimension when the reference surface contacts a top surface of an anchor IC, and with (ii) the one or more optical fibers when the optical connector is connected at the interface.

Abstract: A method for depositing silicon oxynitride film structures is provided that is used to form planar waveguides. These film structures are deposited on substrates and the combination of the substrate and the planar waveguide is used in the formation of optical interposers and subassemblies. The silicon oxynitride film structures are deposited using low thermal budget processes and hydrogen-free oxygen and hydrogen-free nitrogen precursors to produce planar waveguides that exhibit low losses for optical signals transmitted through the waveguide of 1 dB/cm or less. The silicon oxynitride film structures and substrate exhibit low stress levels of less than 20 MPa.

Abstract: Fiber optic connectors, cable assemblies and methods for making the same are disclosed. In one embodiment, the optical connector comprises a housing and a ferrule. The housing comprises a longitudinal passageway between a rear end and a front end, and, a part of the rear portion of the housing comprises a round cross-section and a part of the front portion of the housing comprises a non-round cross-section with a transition region disposed between the rear portion and the front portion.

Abstract: A method of aligning a first and a second structure, the first structure comprising one or more first surface relief features and a channel system communicating with a surface of the first structure at one or more of the first surface relief features, the second structure comprising one or more second surface relief features shaped complementarily to the first surface relief features; the method comprising: generating suction in the channel system to draw the first and second structures together in a drawing direction; wherein, when the first and second structures are drawn together, the interaction between one or more of the first surface relief features and one or more of the second surface relief features aligns the structures in a plane perpendicular to the drawing direction such that the first and second surface relief features mate.

Abstract: Fiber optic connectors and junctions between fiber optic connectors include ferrules terminating a plurality of optical fibers, the ferrules having a ferrule keying portion that rotationally aligns and constrains the ferrules with a guide keying portion of an annular guide tube. The ferrules may further aligned and constrained and aligned in a lateral direction with a ferrule sleeve in the junction of connectors. Each of the ferrule sleeve and the guide keying portion individually constrain movement of the ferrules in different dimensions, the guide keying portion rotationally aligning and constraining the ferrules, while allowing freedom of movement in a lateral direction, and the ferrule sleeve aligning and constraining the ferrules in the lateral direction, while allowing rotational freedom of movement.

Abstract: An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C. The waveguide provides low film stress and low optical signal loss. Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops. Optical signals are delivered to the submount assembly via optical fibers. The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted. The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.

Abstract: The present disclosure relates generally to methods for processing ferrules of fiber optic connectors such that the amount of cleaving and/or polishing that is required is eliminated or at least reduced. An apparatus and method of dispensing adhesive through a front end face of a fiber optic ferrule are provided.

Abstract: An electronic device may have a display, a display cover layer, and a drawn sheet-packed coherent fiber bundle. The coherent fiber bundle may have an input surface that receives an image from the display and a corresponding output surface to which the image is transported. The coherent fiber bundle may be placed between the display and the display cover layer and mounted to a housing. The coherent fiber bundle may have fiber cores with bends that help conceal the housing from view and make the display appear borderless. The coherent fiber bundle has filaments formed from elongated strands of binder in which multiple fibers are embedded. Sheets of filaments are stacked and fused together to form a block of material that is subsequently drawn to form the drawn sheet-packed coherent fiber bundle.

Abstract: A first optical device is adapted to couple to a second optical device along a coupling direction and includes two spaced apart pairs of leading and trailing pads, such that when the first optical device lands and slides on a landing surface of the second optical device to optically couple to the second optical device, and for each pair of leading and trailing pads, the leading pad prevents any debris on the landing surface from collecting on the trailing pad. Upon full coupling of the first optical device with the second optical device, the leading pads do not make contact with the landing surface. The first optical device may be, for example, an optical ferrule or a cradle having a recess adapted to receive an optical ferrule.

Abstract: A fiber optic telecommunications device includes a rack for mounting a plurality of chassis, each chassis including a plurality of trays slidably mounted thereon and arranged in a vertically stacked arrangement.