Abstract: The present disclosure provides a chemical mechanical polishing system having a unitary platen. The platen includes one or more recesses within the platen to house various components for the polishing/planarization process. In one embodiment, the platen includes a first recess and a second recess. The first recess is located under the second recess. An end point detector is placed in the first recess and a detector cover may be placed in the second recess. A sealing mean is provided in a space between the end point detector and the detector cover to prevent any external or foreign materials from coming in contact with the end point detector. A fastener used for fastening the detector cover to the platen also provides addition protection to prevent foreign materials from coming in contact with components received in the recesses.

Abstract: A tool for chamfering cleaved tips of optical fibers. The tool including conical bores of relatively smooth and hard material terminate at a cylindrical bore that is slightly larger than the fiber core maximum diameter and a fiber centering bore that is slightly larger than the fiber coating maximum diameter. The tool provided such that when a cleaved fiber tip is inserted into the centering bore the sharp edge falls upon the chamfering surface that, when rotated relative to the fiber, gently grinds the edge to the chamfer angle. Chamfering cannot occur on the core face due to the absence of tool surface at this dimension.

Abstract: Controlling a polishing system includes receiving from an in-situ monitoring system, for each region of a plurality of regions on a substrate being processed by the polishing system, a sequence of characterizing values for the region. For each region, a polishing rate is determined for the region, and an adjustment is calculated for at least one processing parameter. For each of a plurality of parameter update times, an adjustment is calculated for at least one processing parameter, wherein calculation of the adjustment for a particular parameter update time from the plurality of parameter update times includes calculation of expected future parameter changes for one or more future parameter update times subsequent to the particular parameter update time.

Abstract: A method of fabricating a film vibration device, including: photoetching a surface of a silicon wafer to form a circular-hole array; etching an aluminum layer on the silicon wafer; etching the silicon wafer to form a through-hole array to obtain a porous silicon wafer; attaching a polyethylene terephthalate (PET) sheet to a side of the porous silicon wafer; ablating the PET sheet to obtain a porous PET film; attaching a polyvinylidene fluoride (PVDF) film to a lower side of the porous silicon wafer; performing vacuumization above the porous silicon wafer, while heating the PVDF film below the porous silicon wafer to create dome micro-structures on the PVDF film; and laminating the porous PET film on each of two sides of the PVDF film to obtain the film vibration device. This application also provides a cleaning device having the film vibration device.

Abstract: A method of polishing a target surface of a waveguide to achieve perpendicularity relative to a reference surface is disclosed. The method includes i) providing a polishing apparatus having a polishing plate with a flat surface defining a reference plane, and an adjustable mounting apparatus configured to hold the waveguide during polishing at a plurality of angular orientations; ii) positioning an optical alignment sensor and a light reflecting apparatus such that a first collimated light beam is reflected off of a surface parallel to the reference plane, and a second perpendicular collimated light beam is reflected off of the reference surface; iii) aligning the waveguide within the polishing apparatus such that the reflections received by the optical alignment sensor align within the optical alignment sensor, thereby being indicative of perpendicularity between the reference plane and the reference surface; and iv) polishing the target surface of the aligned waveguide.

Abstract: Implementations described herein generally relate to polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes. More particularly, implementations disclosed herein relate to composite polishing articles having graded properties. In one implementation, a polishing article is provided. The polishing article comprises one or more exposed first regions formed from a first material and having a first zeta potential and one or more second exposed regions formed from a second material and having a second zeta potential, wherein the first zeta potential is different from the second zeta potential.

Abstract: A system for blast-cleaning a barge deck, sides, and fittings providing for safety and avoidance of damage to the barge and to persons, where a barge is blast-cleaned with moving blaster units suspended from and traveling along an overhead track beam. In one embodiment, the moving blaster units are each controlled by a person in a moving operator capsule moving in tandem with a moving blaster unit. In another embodiment, the moving blaster units are robotically controlled from a robotic controller which has access to a three-dimensional plan of the barge, communicating with the robotic blaster units via RF antennae, and receiving real-time data from sensors located on each blaster head. Optionally, the system for blast-cleaning a barge can provide blaster-head cameras for real-time remote monitoring of operations and for recording of the operations allowing review of any issue, such as damage, that might arise.

Abstract: Embodiments of the disclosure generally provide polishing pads having a composite pad body and methods for forming the polishing pads. In one embodiment, the composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.

Abstract: The present invention relates to a polishing apparatus having a surface-property measuring device for measuring surface properties of a polishing pad which is used to polish a substrate, such as semiconductor wafer, and a polishing system including such a polishing apparatus. The polishing apparatus includes a surface-property measuring device (30) for measuring surface properties of a polishing pad (2), a support arm (50) for supporting the surface-property measuring device (30), and a moving unit (53) coupled to the support arm (50) and configured to move the surface-property measuring device (30) from a retreat position to a measure position.

Abstract: A tile saw includes a saw with a cutting blade, a frame supporting the saw, a table supporting a workpiece and being slidable relative to the frame, and a rear fence secured to the table. The rear fence has an engagement surface and is adjustable between an operating position and a bypassed position. The bypassed position includes the engagement surface of the fence being no higher than even with the planar surface of the table to allow a workpiece to extend beyond a rear edge of the table. In the operating position, the engagement surface of the rear fence projects axially from the planar surface of the table to support the workpiece as the workpiece is pushed into the cutting blade during operation. The fence can be adjusted between the operating and bypassed positions by using any one of a cam lever clamp, pin and guideway, or rotatable latch.

Abstract: Methods and apparatus for shaping workpieces are described in which data representing the surface form of the workpiece is analysed to determine characteristics of curvature of the surface, and these characteristics are used to determine the size and form required for a tool to apply shaping treatment to all parts of the workpiece surface. Measurements of the actual workpiece are then compared with data relating to the required workpiece form, to determine the amount and distribution of material to be removed from the workpiece. A tool path for moving the tool over the workpiece to achieve the required shaping operation is then determined, and the tool and tool path data are provided to a shaping machine to carry out the shaping operation. The shaping tool may comprise an elastomeric body covered in a flexible cloth on which rigid pellets containing abrasive material are fixed. The specification discloses methods of manufacturing such tools, and also discloses methods for conditioning the pelleted cloth.

Abstract: A substrate holding apparatus which can adjust polishing profile precisely is disclosed. The substrate holding apparatus includes an elastic membrane that forms a plurality of pressure chambers for pressing a substrate, and a head body to which the elastic membrane is coupled. The elastic membrane includes a contact portion to be brought into contact with the substrate for pressing the substrate against a polishing pad, an edge circumferential wall extending upwardly from a peripheral edge of the contact portion, and a plurality of inner circumferential walls arranged radially inwardly of the edge circumferential wall and extending upwardly from the contact portion. At least two adjacent inner circumferential walls of the plurality of inner circumferential walls include slope circumferential walls inclined radially inwardly. The slope circumferential walls are inclined radially inwardly in their entirety from their lower ends to upper ends, and extend upwardly.

Abstract: An attachment for a mobile handling device is configured for processing walls or ceilings. The attachment comprises a mounting unit that is arranged to be supported at a mounting interface of the handling device, a processing head that is arranged to be equipped with at least one tool for material-removing processing or smoothing processing, and a compensation arrangement that is arranged between the mounting unit and the processing head and that defines a longitudinal axis. The mounting unit provides at least two pivot positions for the attachment that are offset from one another. The processing head is movable relative to the mounting unit in a longitudinal direction along the longitudinal axis. The compensation arrangement is configured to provide a defined contact pressure force for the processing head in a defined operating range along the longitudinal axis towards the surface to be processed.

Abstract: The present disclosure is directed to techniques of zone-based target control in chemical mechanical polishing of wafers. Multiple zones are identified on a surface of a wafer. The CMP target is achieved on each zone in a sequence of CMP processes. Each CMP process in the sequence achieves the CMP target for only one zone, using a CMP process selective to other zones.

Abstract: A chemical mechanical polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, and a controller. The polishing pad has a polishing control groove. The carrier is laterally movable by a first actuator across the polishing pad and rotatable by a second actuator. The controller synchronizes lateral oscillation of the carrier head with rotation of the carrier head such that over a plurality of successive oscillations of the carrier head such that when a first angular swath of an edge portion of the substrate is at an azimuthal angular position about an axis of rotation of the carrier head the first angular swath overlies the polishing surface and when a second angular swath of the edge portion of the substrate is at the azimuthal angular position the second angular swath overlies the polishing control groove.

Abstract: An optical film-thickness measuring apparatus capable of eliminating an influence of a fluid flow on optical fiber cables when the fluid, such as pure water, is flowing through a through-hole of a polishing pad, and capable of achieving highly accurate measuring of a film thickness is disclosed. The optical film-thickness measuring apparatus includes: a light-emitting optical fiber cable coupled to a light source; a light-receiving optical fiber cable arranged to receive light reflected from the workpiece; a cable housing surrounding the light-emitting optical fiber cable and the light-receiving optical fiber cable; and a flow-passage structure defining a fluid passage adjacent to the light-emitting optical fiber cable and the light-receiving optical fiber cable. The light-emitting optical fiber cable and the light-receiving optical fiber cable are supported by at least one of the cable housing and the flow-passage structure.

Abstract: A rocker polishing apparatus for full-aperture deterministic polishing of a planar part includes a control system, a substrate, a lifting plate, a polishing module and a measuring module. The polishing module and the measuring module are arranged on the substrate. The lifting plate is arranged between the polishing module and the measuring module. The polishing module includes a rocker mechanism, a polishing pad surface dressing mechanism, a polishing pad surface profile measuring apparatus and a continuous polishing pad mechanism. The apparatus allows the material removal rate distribution of the planar part and the surface profile of the planar part be in the normalized mirror symmetry relationship by controlling the material removal rate distribution on the surface of the planar part, thereby implementing the deterministic polishing of the planar part and ensuring the efficient convergence of the surface profile of the planar part in the polishing process.

Abstract: A synthetic grindstone for performing surface processing, includes: abrasive grains; binder made of a thermosetting resin material and holding the abrasive grains in a dispersed state; and filler including at least one of first filler, second filler, and third filler. The first filler has a larger average particle diameter than the abrasive grains. The second filler has electrical conductivity. The third filler is harder than a workpiece. The filler is disposed in a state of being dispersed in the binder.

Abstract: A chemical mechanical polishing pad includes a surface portion of a first material. The surface portion includes a plurality of grooves. A first portion of the grooves are exposed grooves located at a surface of the chemical mechanical polishing pad. A second portion of the grooves are buried grooves embedded below the surface of the chemical mechanical polishing pad, such that, during use of the chemical mechanical polishing pad, one or more of the buried grooves are exposed at the surface.

Abstract: A shot blasting cabinet with adjustable impellers includes a cabinet, a plurality of impeller apparatuses, and a plurality of adjusting devices. A shot-blasting working line is defined between an inlet and an outlet of the cabinet. The impeller apparatuses are symmetrically disposed on upper and lower sides of the cabinet. Each impeller apparatus has a protective housing, a driving device, a pair of rotary plates, and a plurality of impeller blades. The driving device connects one of the rotary plates. The protective housing covers the pair of rotary plates and the impeller blades, and defines a shot-blasting exit surface. The shot-blasting exit surface communicates with an interior of the cabinet. The adjusting devices are used to adjust an angle and a distance of the shot-blasting exit surface relative to the shot-blasting working line.