Abstract: An accuracy of detecting a slip out of a substrate from a top ring is improved. A polishing unit 300 includes a polishing table 350, a top ring 302, a light emitting member 371, a slip-out detector 370, and an elimination mechanism 380. A polishing pad 352 that polishes a substrate WF is attached to the polishing table 350. The top ring 302 holds the substrate WF to press the substrate WF against the polishing pad 352. The light emitting member 371 emits a light to a detection area 372 on the polishing pad 352. The slip-out detector 370 detects a slip out of the substrate WF from the top ring 302 based on the light reflected from the detection area 372. The elimination mechanism 380 eliminates a polishing liquid flowing into the detection area 372.

Abstract: A quick clamping device for a portable power tool includes at least one rotatably drivable output shaft, at least one clamping unit, at least one operating unit, and at least one uncoupling unit. The clamping unit, for tool-free fastening of an insert tool unit to the output shaft, includes at least one movably mounted clamping element for applying clamping force to the insert tool unit in a clamping position of the clamping element. The operating unit is configured to move the clamping element into the clamping position and/or into a release position of the clamping element. In the release position, the insert tool unit can be removed from the clamping unit. The at least one uncoupling unit is configured to uncouple the operating unit from the clamping unit in accordance with the rotational speed of the output shaft.

Abstract: A double-sided polishing apparatus includes: a lower surface plate; an upper surface plate; and a carrier disposed between the lower surface plate and the upper surface plate and holding a disk-shaped workpiece, wherein the carrier is configured to rotate about a center of the lower surface plate and the upper surface plate and to rotate about a center of the carrier, the double-sided polishing apparatus includes a thickness measuring sensor at a fixed position above the upper surface plate or below the lower surface plate or at a movable position in an upper portion of the upper surface plate or a lower portion of the lower surface plate, the carrier includes circular perforations each holding the workpiece at a position eccentric to the center of the carrier, when a central position of any of the perforations preset by a user is defined as a first reference position, with a distance between a center of the upper surface plate or the lower surface plate and a center of any of the perforations preset by the u

Abstract: Embodiments of the present disclosure generally relate to structures formed using an additive manufacturing process, and more particularly, to polishing pads, and methods for manufacturing polishing pads, which may be used in a chemical mechanical polishing (CMP) process. The structures described herein are formed from a plurality of printed layers. The structure comprises a first material domain having a first material composition and a plurality of second material domains having a second material composition different from the first material composition. The first material domain is configured to have a first rate of removal and the plurality of second material domains are configured to have a different second rate of removal when an equivalent force is applied to a top surface of the first material domain and the plurality of second material domains.

Abstract: The blade holder has a movable plate and a fixture. A rotatable bolt in operative engagement with a block attached to the plate. A motor is in operative engagement with the bolt. The motor rotates the bolt to move the plate towards the fixture to grip a first set of blades until a torque threshold value is reached. The processor determines a number of blades included in the set of blades based on the number of rotations of the bolt. A first grinding portion of a rotating abrasive belt is applied against the set of blades (having width (W1)) to sharpen the set of blades. Sliding a vise sideways a distance (W1) until a second grinding portion is aligned on top of the second set of blades.

Abstract: The invention relates to a method for the hydro-erosive processing of components, in which hydro-erosive grinding a liquid containing grinding particles flows over surfaces of the component (1), in a device having a channel (3), through which the liquid containing grinding particles flows under pressure and in which the component (1) to be ground is held and in which a valve (5) is positioned upstream of the component (1) in the flow direction, by means of which valve the flow of the liquid can be adjusted.

Abstract: An as-sliced wafer processing method includes a grinding step of grinding a first surface of an as-sliced wafer, an outer periphery positioning step of moving a chuck table and a grinding unit relative to each other in directions parallel to a holding surface of the chuck table so as to position an edge on an outer periphery of grinding stones at an outer peripheral edge of the first surface after the grinding step is carried out, and a chamfering step of chamfering an outer periphery of the first surface of the as-sliced wafer by the grinding stones after the outer periphery positioning step is carried out.

Abstract: A method for slicing an ingot with a wire saw, comprising: forming a wire row by a wire spirally wound between a plurality of wire guides and configured to travel in an axial direction of the wire; feeding an ingot held with a workpiece-feeding mechanism to the wire row for slicing; and slicing the ingot into a plurality of wafers, while supplying a slurry to a contact portion between the ingot and the wire, wherein a warp direction in a wire travelling direction of a wafer obtained in previous ingot slicing is checked in advance, and the ingot is then sliced under a condition that a warp direction in a workpiece feeding direction of a wafer to be obtained matches the checked warp direction in the wire travelling direction, so that the wafers have identical warp directions in the workpiece feeding direction and in the wire travelling direction.

Abstract: A blade sharpener for manual use includes a base, and at least one sharpening device pivotally attached to the base. Each sharpening device has a channel for receiving a blade to be sharpened. A second pivotally attached device may be sharpening device or a guide. The two devices are pivotable independently of each other thereby accommodating any curvature of a blade to be sharpened as the blade sharpener is moved along the blade. A blade sharpener for use with a powered rotary tool includes a main body having a bore for receiving the powered rotary tool, and a channel for receiving a blade to be sharpened. A guide having a channel is pivotably attached to the main body to accommodate any curvature of a blade.

Abstract: A substrate processing method of thinning a substrate having a protective tape attached on a front surface thereof includes measuring a thickness of the protective tape; and grinding, by using a grinder, a rear surface of the substrate held by a substrate holder.

Abstract: After a workpiece unit has been delivered from a cassette and before the workpiece unit is delivered to a chuck table, a value of the thickness of the workpiece unit is recognized on the basis of a result of a measurement performed by a measuring unit. The value of the thickness of the workpiece unit is represented by the sum of values of respective thicknesses of a workpiece and a tape affixed thereto. On the basis of the result of the measurement performed by the measuring unit, it is possible to decide whether or not the tape affixed to the workpiece has a desired thickness, i.e., whether the tape is of a desired type or not. As a result, a workpiece with an inadequate tape affixed thereto is prevented from being ground.

Abstract: There is provided a grinding apparatus including a chuck table configured to hold a workpiece, a grinding unit configured to grind the workpiece held by the chuck table by grinding stones fixed to a grinding wheel, a grinding feed mechanism configured to raise or lower the grinding unit, a reading unit configured to read a thickness of a base which thickness is recorded on a recording medium on which the thickness of the base of the grinding wheel is recorded, a base thickness storage section configured to store the thickness of the base which thickness is read by the reading unit, and a detecting unit configured to make the grinding unit perform processing by the grinding feed mechanism, and detect a fitting surface of a mount and the lower surface of a grinding stone of the grinding wheel fitted to the mount.

Abstract: An automatic knife sharpening machine may include a vice to grip a blade of a knife and a pair of grind wheels to grind material from the blade. The machine may include a scanner to determine a profile of an edge of the blade, and a sharpness sensor to determine a sharpness level of the edge. The machine may include a controller. The controller may perform a first sharpening pass on the knife by moving the grind wheels into contact with the blade, and advancing the grind wheels longitudinally along the blade from adjacent the vice towards a tip of the blade with the grind wheels in contact with the blade. The controller may determine, using the sharpness sensor, the sharpness level of the edge after the first sharpening pass and perform at least one second sharpening pass when the determined sharpness level is less than a threshold sharpness level.

Abstract: An apparatus and method for sequential application of cleaning fluids for improved maintenance of chemical mechanical polishing (CMP) systems is disclosed. A method includes transferring a first substrate to a first polishing station of a plurality of polishing stations, polishing the first substrate at the first polishing station, transferring the first substrate to a second polishing station, and transferring a second substrate to the first polishing station. The method includes cleaning a first surface of a plurality of surfaces of the polishing system by dispensing a first cleaning fluid from a first one or more nozzles of a plurality of nozzles to direct the first cleaning fluid onto the first surface and dispensing a second cleaning fluid from the first one or more nozzles to direct the second cleaning fluid onto the first surface, where the second cleaning fluid is different from the first cleaning fluid.

Abstract: A grinding apparatus includes a grinding unit, a grinding feeding mechanism, and a grinding water supply unit. The grinding water supply unit includes a nozzle that jets grinding water to grindstones, and a biasing mechanism that biases the nozzle upward. The nozzle is configured to be movable downward against the upward biasing according to a downward movement of the grinding unit. The grinding apparatus further includes an upper limit stopping section that sets an upper limit position for upward movement of the nozzle biased upward by the biasing mechanism, for forming a gap through which the grinding wheel is passed, between the nozzle and the mount.

Abstract: In some embodiments, the present disclosure relates to a chemical mechanical planarization (CMP) tool. The CMP tool includes a carrier and a malleable membrane coupled to the carrier and having a lower surface facing away from the carrier. The lower surface of the malleable membrane includes a first malleable material within a central region of the lower surface and a second malleable material within a peripheral region of the lower surface, which surrounds the central region. The first malleable material provides the central region of the lower surface with a first stiffness and the second malleable material provides the peripheral region of the lower surface with a second stiffness that is different than the first stiffness.

Abstract: A substrate processing apparatus includes: a holding part for holding a substrate; a rotating part for rotating the holding part to rotate the substrate together with the holding part; a liquid supply part for supplying a cleaning liquid to a main surface of the substrate; a polishing head for polishing the main surface; a moving part for scanning the polishing head in a radial direction of the substrate while pressing the polishing head against the main surface; and a controller for controlling the rotating part, the liquid supply part, and the moving part. The controller sets a division line that divides the main surface into plural areas in the radial direction, and controls the liquid supply part to supply the cleaning liquid for each area and controls the moving part to scan the polishing head for each area while a subsequent supply of the cleaning liquid is stopped.

Abstract: A chemical-mechanical polishing pad comprising a thermosetting polyurethane polishing layer includes an isocyanate-terminated urethane prepolymer, a polyamine curative, and a cyclohexanedimethanol curative. The polyamine curative and the cyclohexanedimethanol curative are in a molar ratio of polyamine curative to cyclohexanedimethanol curative in a range from about 20:1 to about 1:1.

Abstract: A method for preparing a polishing pad includes: preparing a polishing pad transition structure formed with a plurality of grooves, openings of the plurality of grooves being all located on a same side surface of the polishing pad transition structure; filling the plurality of grooves of the polishing pad transition structure with inorganic nanoparticles; pouring a mixture of a liquid polymer and a curing agent on the polishing pad transition structure, and evacuating air in the liquid polymer and the plurality of grooves; and placing the polishing pad transition structure in an environment at a temperature higher than or equal to a first temperature threshold, and the cured liquid polymer and the polishing pad transition structure constituting the polishing pad.

Abstract: A grinding machine tool with random eccentric orbital motion speed detection, the grinding machine tool comprises a body and a grinding disc, the body comprises a driving shaft and a tool holder connecting the grinding disc and having an eccentric distance relative to the driving shaft, and the grinding disc performs grinding in a random eccentric orbital motion when the driving shaft rotates. The grinding disc comprises at least one detected member on a side of the grinding disc facing the body for detecting a speed of the random eccentric orbital motion, and the at least one detected member defines a detection area with a range greater than or equal to twice the eccentric distance. Thereby, an accurate speed of the grinding disc performing the random eccentric orbital motion is obtained, so that the grinding operation of precision grinding which is gradually performed by automation is more precisely controlled.