Abstract: A multi-fiber, fiber optic connector is interchangeable between a male connector and a female connector by including a pin retainer having a releasable retention device configured to lock the pins in place within the retainer. The retention device may be opened, for example, with a release tool, to free the retention pins for removal of the pins. A method for switching a connector between a male connector configuration and a female connector configuration may be possible as a result of the releasable retention configuration.

Abstract: An example head-mounted display device includes a plurality of optical elements in optical communication. The optical elements are configured to project an image in a field of view of a user wearing the head-mounted display device. A first optical element is configured to receive light from a second optical element. The first optical element defines a grating at along a periphery of the first optical element. The grating includes a plurality of protrusions extending from a base portion of the first optical element. The protrusions include a first material having a first optical dispersion profile for visible wavelengths of light. The grating also includes a second material disposed between at least some of the plurality of protrusions along the base portion of the first optical element. The second material has a second optical dispersion profile for visible wavelengths of light.

Abstract: A scalable independent unit cell device architecture may include a phase-shifting element and a phase shift driver both integrated within the unit cell device. The phase shift driver may be coupled to the phase-shifting element and the phase shift driver may independently control the phase-shifting element to produce an optical beam having a desired phase. The unit cell device may further include an optical antenna that outputs the beam having the desired phase. The unit cell device may be formed as an opto-electronic hybrid optimized to leverage direct bond hybridization (DBH) to attach an electronic integrated circuit wafer to a side of a photonic integrated circuit wafer. The resulting unit cell device (i.e., 24 microns) may tightly integrate individual element-level phase control, which may be implemented within large-scale two-dimensional photonic arrays with hemispherical beam steering.

Abstract: Provided is a planar lightwave circuit in which stress on a substrate is reduced to decrease the curve of the substrate. The planar lightwave circuit is formed by layering a glass film on the substrate. When the optical axis direction from an input waveguide toward an output waveguide is in the longitudinal direction of the substrate, a plurality of grooves are formed in a line in the transverse direction of the substrate.

Abstract: Fiber optic terminals and fiber optic networks having variable ratio couplers are disclosed. The fiber optic terminals comprise a shell having a portion of a variable ratio coupler disposed therein. The variable ratio coupler comprises an optical input, a first optical output, a second optical output and a control. The control may be adjusted for changing an output power level between the first optical output and the second optical output.

Abstract: Aspects of the present disclosure describe distributed fiber optic sensing (DFOS) systems, methods, and structures that advantageously are employed in smart stadium or other venue applications, such applications including: parking lot security and management; intrusion detection; social sensing; air quality monitoring and early fire detection—among others.

Abstract: A silicon-based photonic chip is provided that includes an interface for optically coupling the photonic chip to an optical fiber or an optical fiber assembly. The interface includes: a single-mode waveguide configured to guide light and to provide a first light beam; a first optical element configured to expand the light beam in a first direction in-plane of the photonic chip, thereby providing an expanded light beam; and a second optical element configured to deflect and to further expand the expanded light beam in a second direction, thereby providing an output light beam from the photonic chip. Also provided are methods for fabricating such a photonic chip.

Abstract: A connector device for an endoscope that can prevent infiltration of water into an exterior member is provided. A linear portion (46A) of an elliptical ring portion (46) of a connector exterior case (28) includes through-holes (50 and 52). An inner peripheral surface of the linear portion (46A) includes a semicircular groove (54) that connects the through-hole (50) and the through-hole (52) to each other. An outer peripheral surface of a linear portion (30A) of an elliptical ring portion (30) of a plug (26) includes a semicircular groove (56), and the groove (56) is disposed to face the groove (54) so that an insertion passage (58) is formed. A pin (60) is fitted into the through-hole (52) from the through-hole (50) via the insertion passage (58), and the pin (60) is fitted to the through-hole (50), the insertion passage (58), and the through-hole (52).

Abstract: An optical cable (31) includes: a stress wave detection optical cable (30) having an optical fiber (7) and a plurality of first steel wires (8) which are helically wound so as to surround the optical fiber (7) and which are surrounded by a flexible material (9); and second steel wires (32) different from the first steel wires (8). The stress wave detection optical cable (30) and the plurality of second steel wires (32) are helically wound to form one annular body as a whole, and a winding angle (?) of the stress wave detection optical cable (30) with respect to the axis is determined by a property value prescribed by Lamé constants of the flexible material (9).

Abstract: An optical scan device includes an optical waveguide array, including a plurality of optical waveguides each of which propagates light along a first direction, that emits a light beam, the plurality of optical waveguides being arranged in a second direction that intersects the first direction, a phase shifter array including a plurality of phase shifters connected separately to each of the plurality of optical waveguides, a control circuit that controls a phase shift amount of each of the plurality of phase shifters and/or inputting of light to each of the plurality of phase shifters and thereby controls a direction and shape of the light beam that is emitted from the optical waveguide array, a photodetector that detects the light beam reflected by a physical object, and a signal processing circuit that generates distance distribution data on the basis of output from the photodetector.

Abstract: Optical terminators comprising a ferrule assembly with an optical filter for providing a reflective event in an optical network are disclosed. The optical filter assembly reflecting one or more preselected wavelengths so that the service provide can test optical links in an unmated connection node of the optical network. In one embodiment, the optical terminator has a hardened connector interface for outside plant applications. A ferrule assembly comprises the optical filter, and at least a portion of the ferrule assembly is disposed within the connector housing of the optical terminator. In another embodiment the connector housing comprises a locking feature integrally formed into the body of the connector housing for securing the reflective terminator. Other embodiments comprise a sealing element for sealing a rear end of the reflective terminator, a plug end of an outer housing having first and second fingers, and a coupling nut disposed about a portion of the outer housing.

Abstract: A multi-phase submarine power cable including: a plurality of power cores arranged in a stranded configuration, and a curvature sensor including: an elastic elongated member, and a plurality of Fibre Bragg Grating, FBG, fibres, each FBG fibre extending axially along the elongated member at a radial distance from the centre of the elongated member; wherein the elongated member extends between the stranded power cores along a central axis of the multi-phase submarine power cable.

Abstract: An electro-optical waveguide modulator device includes a seed layer on a substrate, the seed layer having a first crystallographic plane aligned with a surface of the seed layer, an electro-optical channel extending in a first direction on the seed layer and having a second crystallographic plane aligned with the surface of the seed layer, an insulator layer on both sides of the electro-optical channel on the substrate in a second direction perpendicular to the first direction, an electrode barrier layer on the electro-optical channel and the insulator layer, and one or more of electrodes extending in the second direction. The seed layer and the insulator layer each comprise material having a refractive index that is lower than the electro-optical channel.

Abstract: Methods, devices and systems for communication are disclosed. An example device can comprise a first waveguide portion disposed on a substrate, a second waveguide portion, and a third waveguide portion disposed between the first waveguide portion and the second waveguide portion. The third waveguide portion can be configured to carry a signal based on a refractive index of the third waveguide portion matching an effective refractive index of an optical mode of a combination of the first waveguide portion and the second waveguide portion.

Abstract: An optical scanning device includes: a first waveguide that propagates light by total reflection; and a second waveguide. The second waveguide includes: a first multilayer reflective film; a second multilayer reflective film that faces the first multilayer reflective film; and a first optical waveguide layer directly connected to the first waveguide and located between the first and second multilayer reflective films. The first optical waveguide layer has a variable thickness and/or a variable refractive index and propagates the light transmitted through the first waveguide. The first multilayer reflective film has a higher light transmittance than the second multilayer reflective film and allows part of the light propagating through the first optical waveguide layer to be emitted to the outside. By changing the thickness of the first optical waveguide layer and/or its refractive index, the direction of the part of the light emitted from the second waveguide is changed.

Abstract: A method of making a photonic integrated circuit (PIC) is provided. The method comprises depositing a functional resist material layer over a substrate, disposing and pressing a stamp with a plurality of nanopatterns into the functional resist material for a period of time, and removing the stamp from the functional resist material to provide nanofeatures that are inverted versions of the nanopatterns, wherein the nanofeatures form one or more optical elements.

Abstract: A cavity substrate may have a directional optoelectronic transmission channel. The cavity substrate includes a support frame, a first dielectric layer on a first surface of the support frame, and a second dielectric layer on a second surface of the support frame. The support frame, the first dielectric layer and the second dielectric layer constitute a closed cavity having an opening on one side in the length direction of the substrate, a first circuit layer is arranged on the inner surface of the first dielectric layer facing the cavity, an electrode connected with an optical communication device is arranged on the first circuit layer, the electrode is electrically conducted with the first circuit layer, a second circuit layer is arranged on the outer surfaces of the first dielectric layer and the second dielectric layer, and the first circuit layer and the second circuit layer are communicated through a via column.

Abstract: An integrated circuit includes an electronic circuit. The integrated circuit further includes a photonic device. The photonic device includes a first photodetector (PD) electrically connected to the electronic circuit. The photonic device further includes a second PD electrically connected to the electronic circuit. The photonic device further includes a first waveguide configured to receive an optical signal input, wherein the first waveguide is optically connected to the first PD. The photonic device further includes a second waveguide optically connected to the second PD. The photonic device further includes a resonant structure between the first waveguide and the second waveguide, wherein the resonant structure is configured to optically couple the first waveguide to the second waveguide.

Abstract: Disclosed are apparatus and methods for optical coupling in optical communications. In one embodiment, an apparatus for optical coupling is disclosed. The apparatus includes: a planar layer; an array of scattering elements arranged in the planar layer at a plurality of intersections of a first set of concentric elliptical curves crossing with a second set of concentric elliptical curves rotated proximately 90 degrees to form a two-dimensional (2D) grating; a first taper structure formed in the planar layer connecting a first convex side of the 2D grating to a first waveguide; and a second taper structure formed in the planar layer connecting a second convex side of the 2D grating to a second waveguide. Each scattering element is a pillar into the planar layer. The pillar has a top surface whose shape is a concave polygon having at least 6 corners.

Abstract: Disclosed is a photonic structure and associated method. The structure includes a closed-curve waveguide having a first height, as measured from the top surface of an insulator layer, and an outer curved sidewall that extends essentially vertically the full first height (e.g., to minimize signal loss). The structure includes a closed-curve thermal coupler and a heating element. The closed-curve thermal coupler is thermally coupled to and laterally surrounded by the closed-curve waveguide and has a second height that is less than the first height. In some embodiments, the closed-curve waveguide and the closed-curve thermal coupler are continuous portions of the same semiconductor layer having different thicknesses. The heating element is thermally coupled to the closed-curve thermal coupler and thereby indirectly thermally coupled to the closed-curve waveguide.