Abstract: A method of plating a pattern of metal (e.g. copper or nickel) on a dielectric surface, i.e. surface of a dielectric material such as a synthetic resin or ceramic. The method comprises the preliminary step of masklessly treating the dielectric surface to selectively activate preselected areas thereof so that the dielectric surface in contact with a priming solution becomes catalytic, and thereby receptive to electroless metal deposition, selectively at those areas. The treated dielectric surface is contacted with an electroless plating solution to allow metal therefrom to auto-reductively deposit selectively at those catalized areas, thereby forming the pattern of metal desired on the dielectric surface.

Abstract: A polyolefin primer is coated on and bonded to a polyolefin surface. The primer is irradiated and an adhesive is bonded to the primer. The irradiated surface significantly enhances the final bonding between the polyolefin and the adhesive.

Abstract: The preparation of multilayer filament reinforced consolidated articles is found to be possible because of the unique properties of RF plasma sprayed deposits. Pursuant to this method, a first layer of plasma deposited foil is made with a rough upper surface. A layer of closely spaced aligned reinforcing filaments is positioned on the rough surface. A second foil of RF plasma deposited metal is formed in and on the layer of filaments. A second layer of filaments is positioned on the second foil and a third foil is formed in and on the second layer. The three foils are integrated because of the strong tendency of the RF plasma sprayed metal to penetrate through, wet the fibers, and bond to the layer underneath.

Abstract: The invention relates to an irradiation device which is employed in particular in an arrangement for cladding a filamentary body 5, and to a method of cladding such a filamentary body 5, which irradiation device comprises a light source 1 and at least one optical conductor 4 which is provided with a light-entrance window at a first end and a light-exit window at a second end, the light-entrance window being directed to the light source.A cylinder lens 6 is positioned between each light-exit window and the location of the object to be irradiated during operation of the device.Preferably, the first end of the optical conductor 4 is sealed into the wall of a lamp envelope and the cylinder lenses are provided in the wall of a mainly cylindrical body 7 through which a filamentary body 5 which is to be clad can be led.

Abstract: A process for forming a deposited film, which comprises introducing, into a film forming space for forming said deposited film on a substrate, compounds A-1 and B-1 respectively represented by following general formulae and employed as raw materials for said deposited film:R.sub.n M.sup.1.sub.m (A-1)A.sup.1.sub.a B.sub.b (B-1)and active species capable of effecting a chemical reaction with at least one of said compounds, thereby forming a deposited film on said substrate, wherein m is a positive integer equal to the valence of R or a multiple thereof, n is a positive integer equal to the valence of M.sup.1 or a multiple thereof, M.sup.1 stands for an element of the group III of the periodic table, R stands for a hydrogen atom (H), a halogen atom (X) or a hydrocarbon group, a is a positive integer equal to the valence of B or a multiple thereof, b is a positive integer equal to the valence of A.sup.1 or a multiple thereof, A.sup.

Abstract: A foamed plastics substrate has an image formed on its surface by differential ablation by a laser. A composition is applied to the surface in the shape of the image to be formed and has an ablation rate different to that of the foam. After irradiation of the surface, the image is formed in relief on the surface.

Abstract: A selective working method in which the surface to be worked of a workpiece is locally irradiated with energy beams and an electroless plating solution or an electroless etching solution is contacted with the irradiated workpiece surface, with the electroless plating solution or the electroless etching solution flowing continuously in the substantially same direction of as the direction of an irradiation of energy beams. The electroless plating of the electroless etching can be conducted selectively by this method. Above selective working method is best suited for the formation or correction (repair, filling up etc.) of micro-patterns on the workpiece such as metals, semi-conductors, insulators, etc.

Abstract: The invention relates to a process for the low pressure chemical vapor deposition (LPCVD) of metal silicide, especially molybdenum silicide, on a substrate at a low temperature. The walls of a LPCVD reactor which contains a heated pedestal for holding a substrate are cooled and the pedestal is heated so the substrate temperature reaches a desired level, depending on the metal silicide to be deposited. A metal halide and a silane or disilane are fed separately into the deposition chamber and mixed behind a small baffle plate at the entrance. The metal silicide is deposited on the substrate surface. It is preferred that the substrate be pre-treated with H.sub.2 plasma before deposition.

Abstract: Louvered plastic film can be more easily handled and installed by coating at least one surface with a solvent-free monomer composition and exposing the coating to ultraviolet radiation to polymerize the composition.

Abstract: Louvered plastic film can be more easily handled and installed by coating at least one surface with a solvent-free monomer composition and exposing the coating to ultraviolet radiation to polymerize the composition to an adhesive state, preferably a pressure-sensitive adhesive state.

Abstract: The invention provides a process for forming an electrical conductor pattern on desired areas of a substrate comprising the steps of applying a predetermined pattern of silver polymer ink on the substrate and at least partially curing it. A layer of silver solder paste is then applied over the cured polymer ink to a width larger than that of the ink. The solder paste is then reflowed and allowed to solidify, whereby the silver polymer ink becomes encapsulated in the reflowed silver solder to form the desired pattern of conductors which may then be covered with a layer of dielectric material comprising a cured non-conductive polymer ink.

Abstract: The method for the manufacture of printed circuit boards which have been imaged by means of a polymeric resist which comprises selectively catalyzing those areas not covered by the image by treating the imaged circuit board with a catalyst having a charge higher than the charge on the non-imaged areas and sufficiently lower than the charge on the resist image to cause the catalyst to be repelled therefrom, but sufficiently close to the charge on the non-imaged areas to cause adsorption of the catalysts thereon.

Abstract: A method is disclosed for producing fluorine-containing amorphous semiconductor material, preferably comprising amorphous silicon. The method includes depositing amorphous thin-film material onto a substrate while introducing xenon fluoride during the film deposition process.

Abstract: The frequency of a piezoelectric resonator is precisely adjusted using monomolecular layer(s) of a thermally stable, low stress, uniform insulating film deposited on the active area of the resonator. The method is particularly suitable for precisely adjusting the frequencies of high frequency (i.e., very thin) resonators, and the frequencies of lateral field resonators, without degrading stability.

Abstract: A coated stainless steel article and a method of preparing the article are disclosed. The coating is a plasma chemical vapor deposited coating, formed from a plasma of nitrous oxide, a silane, and an energy transfer agent (such as He, Ar). The resulting coating is adherent, corrosion resistant, and has a thickness sufficient to mask and cover the features of the stainless steel substrate, and to provide a pitting potential (in 3.5% NaCl) of greater than 600 millivolts, a J.I.S. 8502 (1982) versus a saturated calomel electrode a salt spray test rating in 5% NaCl-0.02% hydrogen peroxide of at least B.

Abstract: The method for the manufacture of printed circuit boards which have been imaged by means of a polymeric resist which comprises selectively catalyzing those areas not covered by the image by treating the imaged circuit board with a catalyst having a charge higher than the charge on the non-imaged areas and sufficiently lower than the charge on the resist image to cause the catalyst to be repelled therefrom, but sufficiently close to the charge on the non-imaged areas to cause adsorption of the catalysts thereon.

Abstract: An ophthalmic lens and a method for providing a thin coating thereon is disclosed. The coatings render the surfaces of the devices resistant to abrasion and have an SEB abrasion resistance to at least 20 psi. They are optically clear, aberration-free, and provide essentially exactly an optical surface having the desired surface configuration. The coating compositions employed contain reactive ethylenically unsaturated groups and are applied to a mold face and partially reacted. The coated mold is then used to cast the ophthalmic device.

Abstract: A laser induced direct writing pyrolysis of a refractory metal or metal silicide on substrates is described. Typical reactants comprise flowing WF.sub.6, MoF.sub.6 or TiCl.sub.4 with SiH.sub.4 and an inert gas, such as Argon. A preferable substrate surface is a polyimide film. The refractory metal film may comprise low resistivity W, M, or Ti, or silicides thereof, having a predetermined resistance depending on the relative ratio of reactants. The invention is useful, inter alia, for repair of defective circuit interconnects, and formation of interconnects or resistors on substrates.

Abstract: Opaquely pigmented coatings can be produced from lacquers based on monomer-free air-drying polyesters by means of UV radiation if hydroperoxides are additionally employed alongside UV initiators.

Abstract: An adhesive for electroless plating is composed of at least one kind of fine powders selected from either a cured heat resistant resin or an inorganic material and easily soluble in a predetermined solution and a heat resistant resin solution sparingly soluble in the predetermined solution by curing treatment. The adhesive for electroless plating in which the above fine powders are dispersed in the above uncured heat resistant resin solution, is coated on a circuit board, dried and cured to form an adhesive layer. When the above predetermined solution contacts with the surface of the adhesive layer, its surface is roughed to be formed a plating film having an excellent adhesiveness by electroless plating.