Abstract: Nonlinear optical materials comprising porous glass, the pores of which contain a semiconductor material and a polymer.

Abstract: The invention relates to a light metal oxide-based amorphous electrical conductor which comprises an amorphous ternary composition consisting of alumina, boria, and an oxide of a light metal selected from Group IA and IIA of the Periodic Table of Elements. Amorphous conductors of the present invention can be produced by forming an aqueous composition comprising a source of light metal ions, a source of alumina and a source of boria to form a homogeneous gel, drying the gel to form a superifically dry solid, and calcining the dry solid at a sufficiently high temperature to form an amorphous ternary composition as described above. The conductor is used as an element of a moisture and/or a high temperature sensor.

Abstract: Stable microemulsion cleaning compositions are described which, in the absence of opacifying component, appear clear to the eye, and which are especialy useful for cleaning surfaces having oily or greasy soils thereon, which comprise synthetic organic detergent, water, co-surfactant of a described type, and perfume (or equivalent hydrocarbon). The detergent composition may be concentrated and may be employed as is, or it may be in dilution with water, in the form of a similarly clear and stable microemulsion. In process aspects of the invention both the concentrated and the diluted compositions may be employed to remove oily and greasy stains from substrates, such as normally shiny bathroom fixture and floor and wall surfaces, including tiles, by a "spray and wipe" process, which leaves the surface shiny, with minimal or no rinsing needed. When the invented compositions are acidic they are also useful for removing lime scale and soap scum from hard surfaces.

Abstract: A semiconducting mixture which is curable with the aid of silanes includs the following parts by weight:a) 70 to 80 parts of a first copolymer of ethylene, or of ethylene and another olefin, with an ester taken from the group constituted by ethyl acrylate, vinyl acetate, and butyl acetate, with only a fraction lying in the range 60% to 75% of the copolymer being grafted with the aid of silanes;b) 30 to 40 parts of a second copolymer of acrylonitrile and butadiene having about 40% by weight of acrylonitrile;c) 40 to 60 parts of conducting carbon black of the quality satisfying the standard ASTM D 2515-68;d) 15 to 20 parts of monocrystaline wax; ande) 1 part of a phenolic antioxidant.

Abstract: Monolayer or multilayer systems containing compounds of the formula I ##STR1## in which X is S or Se, R.sup.1 is C.sub.1 --C.sub.30 alkyl, --CF.sub.3, --O--R.sup.3, --S--R.sup.3 or --CO--O--R.sup.3, R.sup.2 is hydrogen, C.sub.1 --C.sub.30 alkyl, --CF.sub.3, --O--R.sup.3 or --CO--O--R.sup.3, and R.sup.3 is C.sub.1 --C.sub.30 alkyl or partially or perfluorinated C.sub.1 --C.sub.30 alkyl, are described.Electrically conductive layers which are suitable, for example, for the production of electrically conductive coatings can be prepared from the layer systems by doping with electron acceptors.

Abstract: A composition which comprises a matrix polymer and, distributed therein, a particulate conductive filler. At least some of the filler particles are composed of a conductive polymer composition and/or the matrix comprises a sintered polymer. The matrix polymer and the filler particles and the method of distributing the particles are such that the particles maintain their identity in the matrix. For example, the particles are preferably highly cross-linked so that they have a hot modulus of at least 250 psi if the composition is prepared by melt extrusion or another process involving a high degree of shear; or a low-shear process such as sintering can be used. Preferably the matrix polymer is capable of coating the filler particles; for example, the matrix polymer and the filler polymer may be chemically similar. The invention is particularly useful for preparing compositions which have high resistivities, e.g. 1000 ohm.cm or more, and which can be prepared with a high degree of reproduceability.

Abstract: Described herein is an improved process for electroplating a conductive metal layer to the surface of a nonconductive material comprising the following steps:(a) preparing a liquid dispersion of carbon black comprised of:(1) carbon black particles having an average particle diameter of less than about 3.

Abstract: A non-electrification polymeric composite material composed of a tetrafluoroethylene/fluoro(alkyl vinyl ether) copolymer containing 4% by weight or more fluoro(alkyl vinyl ether) and an electrically conductive material.This non-electrification polymeric composite material is suitably used in a holder for holding a semiconductor substrate, or the like.

Abstract: A composition which comprises a matrix polymer and, distributed therein, a particulate conductive filler. At least some of the filler particles are composed of a conductive polymer composition and/or the matrix comprises a sintered polymer. The matrix polymer and the filler particles and the method of distributing the particles are such that the particles maintain their identity in the matrix. For example, the particles are preferably highly cross-linked so that they have a hot modulus of at least 250 psi if the composition is prepared by melt extrusion or another process involving a high degree of shear; or a low-shear process such as sintering can be used. Preferably the matrix polymer is capable of coating the filler particles; for example, the matrix polymer and the filler polymer may be chemically similar. The invention is particularly useful for preparing compositions which have high resistivities, eg. 1000 ohm.cm or more, and which can be prepared with a high degree of reproduceability.

Abstract: A tray for an integrated circuit comprising a thermosetting resin compound comprising 20 to 180 parts by weight of a filler with a water absorption of 0.45% or less and 15 to 45 parts by weight of electroconductive carbon black added to 100 parts by weight of a thermosetting resin with a water adsorption of 0.45% or less, desirably with 5 to 15 parts by weight of an acrylonitrile-butadiene type rubber, said tray having a surface resistance of 10.sup.2 to 10.sup.6 .OMEGA., a water absorption of 0.45% or less than a glass transition temperature of 150.degree. C. or higher.

Abstract: Disclosed is an electrically conductive composite polymer film formed from an organic matrix and conductive charges. The matrix is a polymer obtained from a filmogenic macromolecular latex and the conductive charges consist of a conductive polymer diffused in the matrix. The invention can be applied to microwave absorbent layers.

Abstract: Disclosed herein are cathodic electrocoat compositions which contain electroconductive pigments. These pigments are light in color, and can be added at higher pigment to binder ratios for improved edge coverage. More specifically, the electroconductive pigments are a two-dimensional network of antimony-containing tin oxide crystallites which exist in a unique association with amorphous silica or with a silica-containing material.

Abstract: The invention refers to an electrically conducting, preferably magnetic fluid, which contains magnetic particles, dispersed in a carrier fluid by means of a dispersant. The fluid is characterized therein that it also contains an electrolyte, which is held in solution by means of one or more complex-forming substances known as ligands.

Abstract: A fixed chip resistor or a thick-film electrical resistor provided in circuit boards and the like and, an electrical resistor obtained by sintering in a non-oxidizing atmosphere, resistance pastes for producing an electrical resistor and a method for making such resistors. The aforesaid objects are achieved by the provision of an electrical resistor obtained using at least one molybdate belonging to the following groups (A) and (G) and glass,(A) Molybdates of alkaline earth metals,(B) Molybdate of zinc,(C) Molybdate of elements, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu, and complex molybdates of two or more of said elements,(D) Molybdates of aluminum(E) Molybdates of elements zirconium and hafnium, and complex molybdates thereof,(F) Molybdates of elements niobium and tantalum, and complex molybdates thereof, and(G) Molybdates of manganese.

Abstract: There is disclosed a conductive thermoplastic resin composition which comprises:(a) 30 to 86% by weight of a thermoplastic aromatic polycarbonate,(b) 2 to 15% by weight of a high density polyethylene having a density of 0.945 to 0.970 g/cm.sup.3 and a melt flow rate of 0.1 to 30 g/10 min,(c) 5 to 20% by weight of a glass fiber having an average diameter of 3 to 15 .mu.m and an average length of 0.05 to 10 mm,(d) 5 to 20% by weight of a carbon fiber having an average diameter of 3 to 20 .mu.m and an average length of 0.03 to 15 mm, and(e) 2 to 15% by weight of a conductive carbon black.

Abstract: A paste including a thermally conducting solid filler, a nonaqueous liquid carrier and a stabilizing dispersant. The pastes are highly concentrated, of low viscosity, electrically resistive, highly thermally conducting and stable. The pastes are easily applicable to electrical and electronic devices and may be removed therefrom with common solvents to access components where necessary.

Abstract: A thick film low-end resistor composition comprising an admixture of finely divided particles of (a) silver, palladium, an alloy of palladium and silver, or mixtures thereof; (b) an admixture of (1) glass having a softening point of 350.degree. to 500.degree. C., which when molten is wetting with respect to the other solids in the composition, and (2) glass having a softening point of 550.degree. to 650.degree. C.; and (c) 5-20% by volume, basis total solids, of sub-micron particles of RuO.sub.2, all of (a) through (c) being dispersed in (d) an organic medium.

Abstract: A compliant thermally conductive, preferably dielectric, compound that enhances the power dissipation capability of high-powered electrical components such as bipolar VLSI semiconductor chips. The compound has chemically stable thermal conduction and viscosity properties; is not subject to phase separation during use and may be applied in small gaps to maximize thermal conduction. The compound preferably comprises a liquid carrier having thermal filler particles dispersed therein and a coupling agent having a functionality which is reactive with the calcined surface of the thermal filler particles, and a functionality having preferential wetting of the thermal filler particles over self-condensation. Additional additives such as fumed silica and polyisobutylene enhance the phase stability and resistance to thermo-mechanical shear force degradation of the thermally conductive compound encountered during functional usage, e.g., fluctuating power cycles.

Abstract: The invention relates to intrinsically electrically conductive polymers, preferably oligomers, which, in the oxidized form, are completely soluble in dipolar aprotic solvents at room temperature and which contain structural units which are derived from at least one monomer of the formula (I) ##STR1## in which R.sup.1 is a C.sub.1 -C.sub.2 -alkoxy group or --O(CH.sub.2 CH.sub.2 O).sub.n CH.sub.3 with n=1 to 4 and R.sup.2 is a hydrogen atom, a C.sub.1 -C.sub.12 -alkyl group, a C.sub.1 -C.sub.12 -alkoxy group or --O(CH.sub.2 CH.sub.2 O).sub.n CH.sub.3 with n=1 to 4, or R.sup.1 and R.sup.2 together are --O(CH.sub.2).sub.m --CH.sub.2 or --O(CH.sub.2).sub.m --O-- with m=1 to 12. The invention also relates to a process for the preparation of these polymers by electrochemical polymerization of at least one monomer of this formula (I) in the presence of a conductive salt, the anode having a specific surface area of at least 0.01 m.sup.

Abstract: A method for producing a circuit board involves printing a U.V. curable ink onto a substrate in a desired circuit pattern and curing the ink by exposing it to a pulsed U.V. source or subjecting the circuit pattern prepared from a U.V. curable ink containing magnetite particles to a magnetic field to move the magnetite particles to the upper surface of the U.V. curable ink. Other embodiments include circuit boards made in accordance with these methods and the use of the U.V. curable ink as a shielding composition for enclosures housing electronic equipment.