Abstract: A metal coated substrate with improved resistivity to cyclic temperature stress is provided. A substrate has at least one insulating layer and at least metal layer attached to at least one side of the insulating layer. The metal layer is at least 0.2 millimeters thick, and is weakened in places by openings formed in at least one border area.

Abstract: Infrared (IR) reflective radio frequency (RF) transparent coating materials are comprised of coated microspheres dispersed as discrete pigment particles in an IR and RF transparent film forming binder. Each microsphere is comprised of a dielectric core, a layer of IR reflective RF conductive material on the core, and an IR and RF transparent layer of insulating material coated over and encapsulating the reflective layer. The insulating layer prohibits transmission of currents between the conductive layers and the spheres are of sufficiently small size in relation to RF wavelengths as to permit passage of RF energy through the coating. The coated microspheres are visually colored, and being spherical, provide on a coated object a film or coating that is visually colored and highly diffuse, as well as being IR reflective and RF transparent.

Abstract: This invention provides a multilayer substrate suited for hybrid ICs.The multilayer substrate is formed from a plurality of layered insulating layers, at least one of which is provided with an inner-layer wiring space extending in the planer direction of the insulating layers and filled with a conductive wiring material. The inner-layer wiring space, which can be in the form of a strip, is connected via through holes to flip chip ICs, resistors, etc., so as to form a circuit.The inner-layer wiring composed of a wiring space extending in the planer direction and filled with a conductive wiring material has a larger cross-sectional area for the passage of electric current and is lower in electrical resistivity, in comparison with conventional wiring formed by printing.

Abstract: A laminate, adapted to be used as a supporting board for a printed circuit, is disclosed which comprises layers of an electrically non-conductive matrix material reinforced with unidirectionally (UD) oriented fibers with the layers comprising individual matrix material having different directions of orientation. The layers are stacked to form a laminate of crossing layers, and the laminate has a core plane relative to which the crossing layers are in mirror image relationship so that the laminate has orthotropic properties. The laminate comprises layers of adhesive material present at least between any pair of layers of UD-reinforced matrix material having different directions of orientation.

Abstract: Graphite is employed as a heat sink material, preferably with its c-planes perpendicular to the surface on which the heat-generating source is mounted at least in the portion in immediate contact with said source. The thermal conductivity of the graphite may be increased by heat treatment or by making it isotopically pure.

Abstract: The article includes a substrate which is composed of a single ply that contains both a structure for generating a viewable optically variable effect, such as a hologram, and carries an indicia receptive coating. The indicia receptive coating covers the single ply such that at least part of the optically variable effect is visible. The indicia receptive coating may receive printed indicia such as security indicia, alphanumeric character shapes, symbols, and bar codes. The article with the single ply that contains viewable optically variable effect and also carries the printed indicia, is more tamper resistant than previous identification documents. It is very difficult, if not impossible, to alter the printed indicia without also altering the structure that generates the viewable optically variable effect or vice versa.

Abstract: A substrate having an optically transparent EMI/RFI shield. A transparent substrate (10) has a thin film metallization pattern (20) on one surface, and some of the pattern is covered with an optically transparent EMI/RFI shield (32). The shield comprises a vapor deposited layer of indium-tin oxide on the substrate surface and on the metallization pattern. The indium-tin oxide is optically transparent. It is patterned to expose one portion (34) of the metallization pattern and to cover a second portion (32) of the metallization pattern. The shield is electrically connected to a part (26) of the metallization pattern that is covered, thus providing electrical shielding and transparency.

Abstract: An alignment layer for use in liquid crystals including a macromolecular material deposited on a glass substrate, the macromolecular material composed of main molecular chains which are, on the average, aligned in a first direction. A series of parallel microgrooves are formed in the macromolecular material and aligned perpendicular to the first direction, each microgroove being separated by a ridge having a triangular cross-section, and each ridge having first and second sides meeting at an apex, wherein the first side has a shorter length than the second side. As a result, disclination does not occur and sufficient reliability against external forces and heat may be obtained. In addition, numerous methods are disclosed for forming the alignment layer.

Abstract: A visually verifiable and machine-readable security thread having at least two security detection means located thereon, where a first security detection means comprises a machine-readable repeating pattern and where a second security detection means comprises visually verifiable metal-formed indicia. Such security threads are suitable for use with security documents, such as banknotes and the like, labels and any other documents or means of identification used for purposes which make the verification of the authenticity of each specimen desirable at least once in its lifetime.

Abstract: Proposed is an improved heat-sealable connector having aligned lines of an electroconductive paste formed by screen printing on the surface of a flexible substrate. Different from conventional heat-sealable connectors, the electroconductive lines are not formed directly on the surface of the substrate but the substrate surface is first provided with a layer of a solvent-absorptive material and the electroconductive lines are formed on the solvent absorptive layer by screen printing so that the screen-printed lines of the paste never cause running to broaden the line width by virtue of immediate absorption of the solvent in the paste into the solvent-absorptive layer to contribute not only to the productivity but also to the quality of the product connectors.

Abstract: A solder bonding metal layer which is formed on a circuit board comprises a metal layer having a mixture of first metal which is easily wetted with metals constituting the solder and which easily forms alloy or intermetallic compounds and of second metal which is not wetted easily with the above solder and not melted. In this case, a concentration gradient that the concentration of the first metal is high on the bonding surface may be formed in the metal layer. A circuit board having a solder bonding metal layer which keeps good bonding even after many times of repairs and improves the reliability is realized.

Abstract: A method for vibrationally damping an article that is subject to resonant vibrations comprises the steps of providing a vibration damper and applying the vibration damper to the article to damp the resonant vibrations. The vibration damper comprises an acrylate viscoelastic vibration damping material and an effective amount of hydrophobic silica. The invention also relates to vibration dampers that utilize the acrylate viscoelastic vibration damping material as well as articles that incorporate the vibration dampers.

Abstract: Layers of zirconium oxide and another ceramic, such as alumina or silicon carbide, are sequentially deposited on a support to form a nanolaminate containing a thin layer of polycrystalline metastable tetragonal zirconia deposited on the support. A process for making a nanolaminate material of the invention is carried out by sputter deposition. Zirconia is deposited on the chosen support by vacuum sputter deposition under conditions effective to form a thin layer of polycrystalline, metastable tetragonal zirconia on the support. A hard ceramic such as alumina is then deposited on the support by vacuum sputter deposition under conditions effective to form a thin layer of hard ceramic superposed on the zirconia layer.

Abstract: There is disclosed a method for adhering a flexible fibrous sheet (such as a canvas) to a semi-rigid thermoplastic resinous sheet (such as a polycarbonate or acrylic sheet). The method comprises the steps of contacting an edge surface of the flexible fibrous sheet with a thermosetting resin and allowing the resin to cure to yield a unified surface, applying an adhesive along of an edge surface of the semi-rigid sheet to yield an adhesive surface and contacting the unified surface of the flexible fibrous sheet with the adhesive surface of the semi-rigid sheet to adhere the flexible fibrous sheet to the semi-rigid sheet. The products made by this method are suitable for a variety of applications, including use as boat and dwelling enclosures.

Abstract: A transfer material supporting member is disclosed which contains at least a polymer represented by the formula (1) ##STR1## wherein each of R.sub.1 to R.sub.16 is a hydrogen atom, a halogen atom or an alkyl group, A is a divalent group, and each of X and Y is a copolymerization ratio. Also, an image forming device using the transfer material supporting member is disclosed.

Abstract: The printing roller according to the invention comprises a core cylinder and a sleeve of plastic. The sleeve is built up from a tubular base body composed of a fiber-reinforced thermoplastic material and the base body is coated on its outer surface with a layer, produced by plasma-spraying, of copper or a copper alloy.

Abstract: A delamination test chip comprises a semiconductor substrate and a plurality of layers stacked on the substrate. The delamination test chip is included in a die with one or more other chips. The die is packaged and subjected to environmental stress. The test chip includes an arrangement of conducting films and vias which enable the detection of a delamination and enable the identification of the particular layer at which the delamination occurs.

Abstract: This is a device and method of forming such, wherein the device has an amorphous "TEFLON" (TFE AF) layer. The device comprising: a substrate; a TFE AF 44 layer on top of the substrate; and a semiconductor layer 42 on top of the TFE AF 44 layer. The device may be an electronic or optoelectronic device. The semiconductor layer may be a metal or other substance.

Abstract: A device includes a ceramic substrate. A ceramic via is defined within the ceramic substrate at an actual location which differs from a designed desired location for the ceramic via. A minimal capture pad electrically communicates the actual location with the designed desired location. The minimal capture pad contains a ceramic via contact portion, a thin film stud contact portion, and a connecting portion; and each of the three is configured to be as small as permitted to limit the capacitances produced by the capture pad.

Abstract: A substrate for electronic components has a layer of material covering at least a portion of the substrate. Recesses are formed in a layer of material and located in a pattern relative to each other to form a predetermined temperature distribution across the layer of material. The layer of material can be formed as a resistive film for a heating resistor element. The shape, size and pattern of the recesses are selected to balance the thermal stress across the surface of the layer of material.