Patents Examined by Kam F. Lee
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Patent number: 5431987Abstract: A noise filter used in a signal transmission or power supply circuit and the like for suppressing noise passing therethrough comprises a first spiral electrode formed on an insulating substrate and a second spiral electrode formed over the first spiral electrode by way of a dielectric layer. The noise filter could also include a dielectric layer formed over the first spiral electrode and the insulating substrate with the second spiral electrode formed in such a manner to partly overlap with the first spiral electrode. Preferably, a high purity semiconductor substrate having a large bulk resistance is used as the insulating substrate.Type: GrantFiled: November 1, 1993Date of Patent: July 11, 1995Assignee: Susumu OkamuraInventor: Takeshi Ikeda
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Patent number: 5429859Abstract: A unitized multilayer circuit structure including a plurality of planar dielectric insulating layers stacked in laminar fashion to form a substrate having sides, and at least one alignment groove formed in one side of the substrate.Type: GrantFiled: May 24, 1994Date of Patent: July 4, 1995Assignee: Hughes Aircraft CompanyInventor: Brian D. Young
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Patent number: 5427841Abstract: A laminated structure (1) comprising a substrate (3) and a polymer layer (5) is provided. The polymer layer consists of conductive areas (7) having a sheet resistance of maximally 1000 .OMEGA./sqaure. The adjacent parts of the polymer layer are substantially non-conductive and have a sheet resistance which is a factor of 10.sup.6 higher. An electrodeposited metal layer (9), for example of copper, is present on the conductive areas (7).A simple method of photochemically generating the conductive pattern (7) which can be reinforced in an aqueous metal-salt solution by electrodeposition of a metal layer (9) is also provided and most preferably the conductive pattern is inter alia, the patterned exposure of a layer of 3,4-ethylene dioxythiophene or polyaniline. The method can very suitably be used for the manufacture of metal patterns on insulating substrates, such as printed circuit boards.Type: GrantFiled: February 28, 1994Date of Patent: June 27, 1995Assignee: U.S. Philips CorporationInventors: Dagobert M. De Leeuw, Cornelius M. J. Mutsaers, Maurice M. J. Simenon
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Patent number: 5425992Abstract: A coated wire comprising:(i) an electrical conductor coated with(ii) a mixture of (a) two linear copolymers of ethylene and one alpha-olefin having 3 to 8 carbon atoms, the first ethylene copolymer having a density of about 0.900 to 0.930 gram per cubic centimeter and a melt index of about 0.1 to about 5 grams per 10 minutes and the second ethylene copolymer having a density of 0.931 to about 0.950 gram per cubic centimeter and a melt index of about 0.1 to about 5 grams per 10 minutes, and for each 100 parts by weight of the first ethylene copolymer, there are about 15 to about 100 parts by weight of the second ethylene copolymer, and (b) for each 100 parts by weight of component (a), there are about 65 to about 150 parts by weight of a mixture comprising huntite and hydromagnesite in a weight ratio of about 2:1 to about 1:1.Type: GrantFiled: July 27, 1994Date of Patent: June 20, 1995Assignee: Nippon Unicar Company Ltd.Inventors: Takeshi Tachikawa, Katsuhiro Horita
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Patent number: 5425982Abstract: A multi-layer wiring structure for a semiconductor device comprises: a first insulating interlayer formed on a semiconductor substrate on which a semiconductor element is formed; an elongated lower wiring layer extending on the first insulating interlayer and connected to the semiconductor element; a second insulating interlayer formed to cover the first insulating interlayer and the lower wiring layer; a first via hole formed through the second insulating interlayer to reach the lower wiring layer; a blocking conductive layer formed to fill the first via hole; connecting to the lower wiring layer and extending over a first area on the second insulating interlayer; a third insulating interlayer formed to cover the second insulating interlayer and the blocking conductive layer; a second via hole formed through the third insulating interlayer to reach the blocking conductive layer; and an elongated upper wiring layer filling the second via hole to connect the upper wiring layer to the blocking conductive layerType: GrantFiled: September 13, 1993Date of Patent: June 20, 1995Assignee: Nippon Steel CorporationInventor: Tatsuya Hara
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Patent number: 5424141Abstract: Processes for transfer of design and kite therefore are easily used to transfer images on objects, including fine materials such as silk. The recipient materials remain pliable. Kits containing components for use in the processes of the invention may be prepared for use with any transfer materials. Fabric that has been decorated by the processes of the invention can be sewed, washed, and dried without releasing the image transferred thereto.Type: GrantFiled: July 27, 1992Date of Patent: June 13, 1995Inventor: Marjorie Croner
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Patent number: 5422151Abstract: A wrapping material comprising a sheet of material such as paper, cellophane, foil, or man-made organic polymer film and a cling material such as polyethylene secured to a portion of the sheet of material. The cling material connects to the sheet of material and/or itself as the wrapping material is wrapped about an item thereby securing the sheet of material about the item. A method of wrapping an item such as a floral arrangement, Easter basket or a gift container by wrapping the item with the wrapping material.Type: GrantFiled: December 7, 1990Date of Patent: June 6, 1995Assignee: Highland Supply CorporationInventors: Donald E. Weder, William F. Straeter, Joseph G. Straeter, Franklin J. Craig, Wilma M. Donnelly, Jack W. Redditt
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Patent number: 5422187Abstract: A vapor phase corrosion inhibitor-desiccant composite comprising silica gel granules coated with a vapor phase corrosion inhibitor component. The corrosion inhibitor component is selected from a formulation comprising anhydrous molybdates such as ammonium dimolybdate, sodium molybdate and amine molybdates mixed with benzotriazole and sodium nitrate, or from a formulation comprising amine benzoates, amine nitrates and benzotriazole. The composites can be impregnated into foam, extruded with polyolefin films which can additionally be laminated with metallized second film, or encapsulated in an air-permeable container. The corrosion inhibitor formulations have vapor pressures which provide ongoing corrosion protection for susceptible articles situated favorably with respect to the composite.Type: GrantFiled: October 14, 1993Date of Patent: June 6, 1995Assignee: Cortec CorporationInventors: Boris A. Miksic, Joseph M. Foley, Tsi-Zong Tzou
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Patent number: 5419947Abstract: Non-reciprocal circuit elements, wherein a plurality of ceramic green sheets having given electrode films with pattern shapes formed respectively on them are collectively fired and integrated into one dielectric basic plate after they have been adhered under pressure by lamination. A plurality of electrode films with pattern shapes are laminated within one dielectric basic plate, so that the internal circuit which includes the central electrode, the matching circuit and so on are disposed with microwave, with the result that they can be smaller in size, higher in performance and easier to manufacture.Type: GrantFiled: April 19, 1993Date of Patent: May 30, 1995Assignee: Murata Mfg. Co. Inc.Inventors: Hiroki Dejima, Takahiro Joudo, Keiji Okamura, Takashi Kawanami, Takashi Hasegawa, Katsuyuki Ohara
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Patent number: 5418058Abstract: An article of manufacture is provided including a substrate having an oxide surface layer and a selective thin film of a cyclodextrin derivative chemically bound upon said substrate, said film is adapted for the inclusion of a selected organic compound therewith. Such an article can be either a chemical sensor capable of detecting a resultant mass change from inclusion of the selected organic compound or a chemical separator capable of reversibly selectively separating a selected organic compound.Type: GrantFiled: October 4, 1993Date of Patent: May 23, 1995Assignee: The Regents of the University of CaliforniaInventors: DeQuan Li, Basil I. Swanson
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Patent number: 5413860Abstract: A coated material comprising (a) a solid dielectric or semi-conductive substrate which is (b) partially or completely coated on at least one surface with a silicate in which a crystalline charge transfer complex is incorporated. The material can be used as an antistatic or electrically conductive material, preferably in the form of screens or picture tubes provided with an antistatic finish.Type: GrantFiled: July 9, 1993Date of Patent: May 9, 1995Assignee: Ciba-Geigy CorporationInventors: Ernst Minder, Walther Hofherr
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Patent number: 5411790Abstract: A signal input sheet having a cover film made of a soft material at its surface, its repetitive writing durability is improved to obtain a signal input sheet having a good feeling and writing condition, and a high durability. A hard film layer 18 harder than a sheet 10 and cover film 15 is set between the sheet 10 made of a soft material and the cover film 15 located at the upper side and slightly harder than the sheet.Type: GrantFiled: February 26, 1993Date of Patent: May 2, 1995Assignee: Toppan Moore Co., Ltd.Inventors: Kiichiro Ogawa, Hiroshi Yamada, Youzou Nouno, Yasuo Kagami
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Patent number: 5407730Abstract: A physical variable sensor with a processor circuit that can be used for any of a number of different applications. The variable sensor is compact and inexpensive to produce. The variable sensor comprises first, second and third substrates. On the second substrate is mounted a sensor component and a first processor circuit to convert the output of the sensor component to a standard electrical signal. A second processor circuit is provided on the third substrate. The second processor circuit includes an amplifier circuit, a digital fuzzy microprocessor and a luminous element to transmit an optical signal to the exterior. A solar cell can be provided on the first substrate to supply energy to the circuits. The first and third substrates are common to all types of sensors, and by modifying the second substrate different sensors to measure different types of variables can be produced.Type: GrantFiled: July 22, 1993Date of Patent: April 18, 1995Assignee: Omron CorporationInventor: Koichi Imanaka
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Patent number: 5407738Abstract: A minute structure for showing colors by reflection and interference of natural light includes a plurality of fin portions and a central portion for uniting the fin portions. The fin portions are aligned in a first direction and positioned such that the adjacent fin portions are spaced from each other so as to define therebetween a void space which is filled with air. Each fin portion has a first width defined in a second direction which is perpendicular to the first direction and a second width defined in the first direction. The void space has a third width which is defined in the first direction. The central portion has a fourth width defined in the second direction. The first width of each fin portion is three times or more larger than the fourth width of the central portion. The third width of the void space ranges from 0.02 .mu.m to 0.4 .mu.m. The second width of each fin portion is not less than 0.02 .mu.m. A refractive index of each fin portion ranges from 1.2 to 1.8.Type: GrantFiled: June 21, 1993Date of Patent: April 18, 1995Assignee: Nissan Motor Co., Ltd.Inventors: Hiroshi Tabata, Kinya Kumazawa, Junichi Takimoto
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Patent number: 5403674Abstract: The invention provides a conductor comprising a reaction-sintered body of a conductive nitride produced from a powder of at least one metal selected from Ti, Zr, V, Nb, Ta, Cr, Ce, Co, Mn, Hf, W, Mo, Fe, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Yb, Lu, Th and Ni, and a process for producing such conductor by heating a molding containing a metal powder in a nitriding gaseous atmosphere containing no CO gas.Type: GrantFiled: September 9, 1993Date of Patent: April 4, 1995Assignee: Hitachi, Ltd.Inventors: Yoshiyuki Yasutomi, Tadahiko Miyoshi, Masahisa Sobue, Nobuyuki Yamashita, Hiroshi Nagase, Kiyohiko Tanno, Shoji Arimoto, Fumio Jooraku
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Patent number: 5403648Abstract: A contact sensitive substrate for electronic equipment comprising a plurality of touch pads and respective associated leads defining an array of touch positions on a front (in use) face of the substrate.Type: GrantFiled: April 28, 1993Date of Patent: April 4, 1995Assignee: Varintelligent (BVI) LimitedInventors: Yiu S. Chan, Goon N. Lee, York Liao, Ying M. Poon
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Patent number: 5401584Abstract: A deactivatable electronic theft detection marker is made from a strip or ribbon of high magnetic permeability strip or ribbon and then high magnetic coercivity material is deposited on the strip or ribbon by electroplating.Type: GrantFiled: September 10, 1993Date of Patent: March 28, 1995Assignee: Knogo CorporationInventors: Arthur J. Minasy, Peter Y. Zhou, Thomas P. Solaski, Edward J. Callaghan
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Patent number: 5399424Abstract: A method for manufacturing a fibrillated pultruded electronic component includes the steps of providing a rod comprising a plurality of conductive fibers embedded in a matrix material, the rod having a first end and a second end. The rod is rotated and a liquid is sprayed onto the rod at a distance from the first end of the rod. The matrix material is abraded away from between the fibers of the rod. The fibers of the rod are then cut. A disk is formed which has a plurality of conductive fibers embedded in a matrix material. However, the ends of the disk include only the conductive fibers and not the matrix material. This enables the ends of the disk to have a fibrillated brush-like structure which is particularly well suited for low energy electronic/microelectronic signal level circuitry typified by contemporary digital and analog signal processors.Type: GrantFiled: June 7, 1993Date of Patent: March 21, 1995Assignee: Xerox CorporationInventors: Heiko Rommelmann, Allen J. Thompson
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Patent number: 5399416Abstract: A laminate comprising (a) a carrier having a heat conductivity of at least 10 W/mK and a thickness of 10 to 100 .mu.m, and (b) a dielectric adhesive layer which is applied to at least one surface of said substrate and which contains a heat-conductive filler and has a thickness of 5 to 500 .mu.m and a heat conductivity of 1 W/mK. The flexible laminate, or a dielectric and self-supporting adhesive film which contains a heat-conductive filler and has a heat conductivity of at least 1 W/mK, is suitable for removing heat from leadframes which have electrically insulated contact surfaces for electrical and electronic components and which are encapsulated with a synthetic resin moulding material, typically dual-in-line plastic packages, by bonding the rear sides of the contact surfaces to the leads.Type: GrantFiled: November 30, 1993Date of Patent: March 21, 1995Assignee: Ciba-Geigy CorporationInventor: Patrice Bujard
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Patent number: 5397674Abstract: A radiation sensitized paper having a polyester film, a coating layer which contains a water-soluble or water-dispersible resin and is formed on a surface of the polyester film, a resin layer which is formed on the coating layer and a fluorescent material layer which is formed on the resin layer, in which adhesion of the fluorescent material layer is good.Type: GrantFiled: December 17, 1992Date of Patent: March 14, 1995Assignee: Diafoil Hoescht Company LimitedInventors: Yoshihide Ozaki, Satoshi Otonari, Masahiro Kita