Abstract: Numerous examples are disclosed for verifying a weight programmed into a selected non-volatile memory cell in a neural memory. In one example, a circuit comprises a digital-to-analog converter to convert a target weight comprising digital bits into a target voltage, a current-to-voltage converter to convert an output current from the selected non-volatile memory cell during a verify operation into an output voltage, and a comparator to compare the output voltage to the target voltage during a verify operation.

Abstract: A memory apparatus and method of operation are provided. The apparatus includes memory cells connected to word lines including at least one edge word line and other data word lines. The memory cells are arranged in strings and are configured to retain a threshold voltage corresponding to data states. The strings are organized in rows and a control means is coupled to the word lines and the strings and identifies the at least one edge word line. The control means programs the memory cells of the strings in particular ones of the rows and associated with the at least one edge word line to have an altered distribution of the threshold voltage for one or more of the data states compared to the memory cells of the strings not in particular ones of the rows and not associated with the at least one edge word line during a program operation.

Abstract: Methods, systems, and devices for mitigating memory die misalignment are described. A memory system may receive a command to write data to a memory device including a memory die. The memory system may determine whether the data indicated by the command (e.g., a first set of data) satisfies a threshold size. If the first set of data satisfies the threshold size, the memory system may determine whether data currently in a write buffer aligns with a boundary of the memory die. For example, depending on the data currently in the buffer, adding the first set of data to the buffer may result in die misalignment for the first set of data. To mitigate die misalignment, the memory system may pad data (e.g., add dummy data) to the write buffer, such that the padding aligns the data with the die boundary.

Abstract: A nonvolatile semiconductor storage device includes first and second semiconductor layers extending in a first direction and spaced apart in a second direction, first and second bit lines extending in the second direction and respectively arranged on opposite sides of the semiconductor layers in the first direction, first and second source lines extending in a third direction and respectively arranged on opposite sides of the semiconductor layers in the first direction, a first memory string including first and second select transistors connected to the first bit line and the first source line, respectively, a second memory string including third and fourth select transistors connected to the second bit line and the second source line, respectively, a first select gate line connected to gates of the first and fourth select transistors, and a second select gate line connected to gates of the second and third select transistors.

Abstract: Methods, systems, and devices for techniques for parallel memory cell access are described. A memory device may include multiple tiers of memory cells. During a first duration, a first voltage may be applied to a set of word lines coupled with a tier of memory cells to threshold one or more memory cells included in a first subset of memory cells of the tier. During a second duration, a second voltage may be applied to the set of word lines to write a first logic state to the one or more memory cells of the first subset and to threshold one or more memory cells included in a second subset of memory cells of the tier. During a third duration, a third voltage may be applied to the set of word lines to write a second logic state to the one or more memory cells of the second subset.

Abstract: In a case of achievement of a neural network circuit using a plurality of nonvolatile memory cells, a technique capable of accurately reading information recorded in the plurality of nonvolatile memory cells is provided. A semiconductor device includes: a plurality of nonvolatile memory cells; a plurality of reference-current cells; and a sense amplifier comparing an electric current flowing in each of the plurality of nonvolatile memory cells and an electric current flowing in each of the plurality of reference-current cells. In this case, each cross-sectional structure of the plurality of reference-current cells is the same as each cross-sectional structure of the plurality of nonvolatile memory cells. The writing operation or the erasing operation is also performed to each of the plurality of reference-current memory cells when the writing operation or the erasing operation is performed to each of the plurality of nonvolatile memory cells.

Abstract: A memory device has a memory array of a plurality of memory cells arranged in a plurality of columns and a plurality of rows. The memory cells in each of the plurality of columns include first memory cells and second memory cells alternately arranged along a column direction of the plurality of columns. A first computation circuit is coupled to the first memory cells in each of the plurality of columns, and is configured to generate first output data corresponding to a first computation performed on first weight data stored in the first memory cells. A second computation circuit is coupled to the second memory cells in each of the plurality of columns, and is configured to generate second output data corresponding to a second computation performed on second weight data stored in the second memory cells.

Abstract: Memories, memory controllers, and computing systems and their methods of operation are disclosed. In some embodiments, a method of accessing a memory includes accessing a first bit line corresponding to a sense amplifier and accessing a second bit line corresponding to the sense amplifier. In some embodiments, a memory controller includes a second memory configured to store data of a second data type. In some embodiments, a method includes operating a memory in a second mode in response to receiving an input to change the operation of the memory from a first mode to the second mode.

Abstract: The present application provides a display panel, a display module, and a display device. A flexible substrate of the display panel includes a first flexible substrate and a second flexible substrate, and the first flexible substrate is provided with a first through-hole corresponding to a lighting path of an electronic component. Based on the first through-hole, light transmittance of the display panel is increased, so that electronic components such as a camera can be disposed below the display panel, and a narrow bezel design is realized.

Abstract: A memory controller that controls a memory device may include a model manager configured to obtain log information on use of the memory device for a predetermined period, and generate a regression model that predicts a lifespan of the memory device based on the log information, and a performance manager configured to determine a deterioration section in which performance of the memory device is deteriorated based on the regression model, and adjust a parameter value related to an operation of the memory device in the deterioration section.

Abstract: Transistors (N1 to N12) corresponding to drive transistors (PD1, PD2), access transistors (PG1, PG2), read drive transistor (RPD1), and read access transistor (RPG1) are formed in a lower portion of a cell. Transistors (P1, P2) corresponding to load transistors (PU1, PU2), respectively, are formed in an upper portion of the cell. The transistors (P1, P2) overlap the transistors (N3, N8), respectively, in plan view.

Abstract: [Problem] To provide a semiconductor storage device capable of reducing the load on a controller. [Solution] According to one embodiment, a semiconductor storage device 2 includes a memory cell array 110 including a plurality of memory cell transistors MT, a plurality of word lines WL connected to gates of the respective memory cell arrays 110, a voltage generation circuit 43 generating a voltage applied to each of the word lines WL, and a sequencer 41 controlling an operation of the memory cell array 110. The sequencer 41 repeats a loop including a program operation and a verify operation multiple times in a write operation. The sequencer 41 controls an operation of the voltage generation circuit 43 so that a rate increase in a voltage applied to a non-selected word line in the verify operation of a last loop is smaller than the rate increase in the voltage applied to the non-selected word line in the verify operation of a first loop.

Abstract: A memory apparatus and method of operation are provided. The apparatus includes memory cells connected to one of a plurality of word lines including at least one edge word line and a plurality of other data word lines. The memory cells are arranged in strings and configured to retain a threshold voltage corresponding to one of a plurality of data states. The memory apparatus also includes a control means coupled to the plurality of word lines and the strings. The control means is configured to identify the at least one edge word line. The control means is also configured to periodically apply a program voltage to the at least one edge word line to reprogram the memory cells associated with the at least one edge word line without erasing the memory cells associated with the at least one edge word line.

Abstract: Provided is a static random-access memory (SRAM) device.

Abstract: A system has been described that performs differential temperature compensation based on a differential between the temperature at time of programming and temperature at time of reading for a set of data. Differential temperature compensation is useful for bulk programming/reading (e.g., many pages of data) and/or programming/reading super pages of data (multiple pages residing on different memory die).

Abstract: A nonvolatile memory device includes a plurality of bit lines that is connected with a plurality of cell strings, a common source line that is connected with the plurality of cell strings, at least one dummy bit line that is provided between the common source line and the plurality of bit lines, a control logic circuit that generates at least one dummy bit line driving signal in response to a command from an external device, and a dummy bit line driver that selectively provides a first voltage to the at least one dummy bit line in response to the dummy bit line driving signal.

Abstract: Apparatuses and techniques are described for controlling a bit line pre-charge voltage in a program operation based on a number of bits per cell, with a goal to reduce peak current consumption. In one aspect, the ramp up of a bit line voltage to an inhibit level is optimized according to the number of bits per cell. The ramp up can involve increasing the bit line voltage from an initial level to a target voltage at a regulated rate, then increasing the bit line voltage from the target voltage to a final voltage at an unregulated rate. In one approach, the regulated ramp rate is less for single-level cell programming compared to multi-level cell programming. The target voltage can also be optimized based on the number of bis per cell.

Abstract: A semiconductor storage device includes a substrate and a memory cell array. The memory cell array is above the substrate in a first direction. The memory cell array includes first to third regions arranged in a second direction. The memory cell array comprises a first stack in the first and third regions, first and second semiconductor layers extending through the first stack in the first and third regions, respectively, a second stack in the second region, a first contact extending through the second stack, a fourth insulating layer extending in the first and second directions in the second region, and a fifth insulating layer extending in the first direction and a third direction in the second region. A distance from a bottom end of the fourth insulating layer to the substrate is different from a distance from a bottom end of the fifth insulating layer to the substrate.

Abstract: Provided herein may be a memory device and a method of operating the same. The memory device may include a plurality of memory cells, a peripheral circuit, and a control logic. The memory cells may be coupled to a plurality of word lines. The peripheral circuit may perform a memory operation on selected memory cells. The control logic may control the peripheral circuit, during the memory operation, to apply an operating voltage to a selected word line, among the plurality of word lines, coupled to the selected memory cells, a first pass voltage to target word lines adjacent to the selected word line among unselected word lines, based on whether the operating voltage is lower than or equal to a reference voltage, and a second pass voltage, having a lower level than the first pass voltage, to remaining unselected word lines, other than the target word lines.

Abstract: A method of forming a microelectronic device structure comprises exposing a silicon structure to an etching chemistry at a first bias voltage of greater than about 500 V to form at least one initial trench between sidewalls of features formed in the silicon structure. The method also comprises exposing at least the sidewalls of the features to the etching chemistry at a second bias voltage of less than about 100 V to remove material from the sidewalls to expand the at least one initial trench and form at least one broader trench without substantially reducing a height of the features. Related apparatuses and electronic systems are also disclosed.