Patents Examined by Kyung S. Lee
  • Thin film resistor (TFR) formed in an integrated circuit device using TFR cap layer(s) as an etch stop and/or hardmask
    Patent number: 11508500
    Abstract: A method is provided for forming a thin film resistor (TFR) in an integrated circuit (IC) device. A TFR film is formed and annealed over an IC structure including IC elements and IC element contacts. At least one TFR cap layer is formed, and a TFR etch defines a TFR element from the TFR film. A TFR contact etch forms TFR contact openings over the TFR element, and a metal layer is formed over the IC structure and extending into the TFR contact openings to form metal contacts to the IC element contacts and the TFR element. The TFR cap layer(s), e.g., SiN cap and/or oxide cap formed over the TFR film, may (a) provide an etch stop during the TFR contact etch and/or (b) provide a hardmask during the TFR etch, which may eliminate the use of a photomask and thereby eliminate post-etch removal of photomask polymer.
    Type: Grant
    Filed: October 15, 2020
    Date of Patent: November 22, 2022
    Assignee: Microchip Technology Incorporated
    Inventors: Paul Fest, Jacob Williams, Josh Kaufman
  • Zinc oxide varistor ceramics
    Patent number: 11501900
    Abstract: Provided according to embodiments of the invention are varistor ceramic formulations that include zinc oxide (ZnO). In particular, varistor ceramic formulations of the invention may include dopants including an alkali metal compound, an alkaline earth compound, an oxide of boron, an oxide of aluminum, or a combination thereof. Varistor ceramic formulations may also include other metal oxides. Also provided according to embodiments of the invention are varistor ceramic materials formed by sintering a varistor ceramic formulation according to an embodiment of the invention. Further provided are varistors formed from such ceramic materials and methods of making such materials.
    Type: Grant
    Filed: November 11, 2020
    Date of Patent: November 15, 2022
    Assignee: RIPD Intellectual Assets Ltd.
    Inventors: Mirjam Cergolj, Sa{hacek over (s)}a Rustja Kosec, Sodec Jo{hacek over (z)}ef, Andrej Pirih
  • Strain gauge
    Patent number: 11499877
    Abstract: A strain gauge includes a flexible substrate; and resistors each formed of a Cr composite film. The resistors include a first resistor and a second resistor that are formed on one side of the substrate, and include a third resistor and a fourth resistor that are formed on another side of the substrate. The first resistor, the second resistor, the third resistor, and the fourth resistor constitute a Wheatstone bridge circuit.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: November 15, 2022
    Assignee: MINEBEA MITSUMI Inc.
    Inventors: Eiji Misaizu, Shigeyuki Adachi, Kosuke Kitahara, Toshiaki Asakawa, Atsushi Kitamura
  • PTC-effect composite material, corresponding production method, and heater device including such material
    Patent number: 11495375
    Abstract: A co-continuous mouldable polymeric composite with PTC effect has a matrix that comprises at least two immiscible polymers (HDPE, POM), and an electrically conductive filler (CB) in the matrix. At least one of said immiscible polymers is high-density polyethylene (HDPE), and at least one other of said immiscible polymers is polyoxymethylene (POM).
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: November 8, 2022
    Assignee: ELTEK S.P.A.
    Inventor: Marco Pizzi
  • Resistive material, resistor, and manufacturing method of resistive material
    Patent number: 11495374
    Abstract: A resistive material for sensing current contains particles having an electrically insulating property and a metal body having a three-dimensional network enclosing the particles, and a ratio of the metal body to the whole of the resistive material is 30 vol % or more and 80 vol % or less.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: November 8, 2022
    Assignee: KOA Corporation
    Inventors: Shuhei Matsubara, Keishi Nakamura
  • Sensor having a pressing resilience
    Patent number: 11486771
    Abstract: A sensor for measuring a parameter at a measurement point of a surface by means of direct contact. The sensor includes a sensor element arranged movably in the sensor and a spring element that can resiliently absorb an application force with which sensor element is pressed against the measurement point.
    Type: Grant
    Filed: September 18, 2018
    Date of Patent: November 1, 2022
    Assignee: TDK Electronics AG
    Inventors: Clemens Rogge, Carsten Dehoff
  • Shunt resistor
    Patent number: 11488750
    Abstract: A manufacturing method of shunt resistor according to the present invention includes a step of calculating a difference between an initial resistance value and a desired resistance value as a resistance value to be adjusted, a step of providing a plurality of recess forming members capable of forming recesses each having a characteristic size in the surface of a resistive alloy plate, a recess determining step of determining the size and the number of the recesses necessary to be formed at the surface of the resistive alloy plate, and a recess forming step of forming the recesses according to the size and the number determined in the recess determining step by using the corresponding recess forming members.
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: November 1, 2022
    Assignee: Suncall Corporation
    Inventors: Hiroya Kobayakawa, Kenji Murakami
  • Thermometer with improved response time
    Patent number: 11480476
    Abstract: The present disclosure relates to a method for manufacturing an apparatus for determining and/or monitoring temperature of a medium comprising method steps as follows: arranging a sensor element in a sensor head, producing a vacuum in an internal volume of the sensor head, introducing at least one fill material into at least a portion of the internal volume of the sensor head, and closing the sensor head. The present invention relates, moreover, to a correspondingly manufactured apparatus.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: October 25, 2022
    Assignee: Endress+Hauser Wetzer GmbH+Co. KG
    Inventor: Dietmar Saecker
  • Heat utilizing device
    Patent number: 11480477
    Abstract: A heat utilizing device is provided in which the thermal resistance of the wiring layer is increased while an increase in electric resistance of the wiring layer is limited. Heat utilizing device has thermistor whose electric resistance changes depending on temperature; and wiring layer that is connected to thermistor. A mean free path of phonons in wiring layer is smaller than a mean free path of phonons in an infinite medium that consists of a material of wiring layer.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: October 25, 2022
    Assignee: TDK Corporation
    Inventors: Shinji Hara, Naoki Ohta, Susumu Aoki, Eiji Komura, Akimasa Kaizu
  • High voltage resistor arrangement, electrode arrangement having such a high voltage resistor arrangement, method for manufacturing a high voltage resistor arrangement and ionization
    Patent number: 11477876
    Abstract: A high voltage resistor arrangement has a rod-shaped supporting substrate made of electrically insulating material and a plurality of individual resistors and/or discrete capacitors spaced apart from each other in the longitudinal direction of the supporting substrate, wherein at least one conductive path extending in the longitudinal direction of the supporting substrate is formed on the supporting substrate which is galvanically connected to the individual resistors and/or discrete capacitors, and wherein the individual resistors and/or discrete capacitors are realized as SMD components soldered directly onto the supporting substrate by means of solder pads.
    Type: Grant
    Filed: May 11, 2020
    Date of Patent: October 18, 2022
    Assignee: GEMA SWITZERLAND GMBH
    Inventors: Felix Mauchle, Michael Nagel
  • On-chip resistor trimming to compensate for process variation
    Patent number: 11476018
    Abstract: An amplifier receives an input and a feedback. A first transistor controlled by the amplifier output is coupled between a supply node and the feedback. A second transistor controlled by the amplifier output is coupled to the supply node and generates a bias current. A trimmed resistor coupled between the feedback and ground includes, for trimming resolution of N-bits, where X+Y=N: M resistors, where M=2X?1, each having a resistance equal to R*(2Y)*i, i being an index having a value ranging from 1 to 2X?1, a first of the M resistors having a resistance of R*2Y, a last of the M resistors having a resistance of R*2Y*(2X?1); and M switches associated with the M resistors. Each of the M resistors is between a first node and its associated one of the M switches. Each of the M switches couples its associated one of the M resistors to a second node.
    Type: Grant
    Filed: July 26, 2021
    Date of Patent: October 18, 2022
    Assignee: STMicroelectronics International N.V.
    Inventors: Mohit Kaushik, Anil Kumar
  • Force sensing resistor (FSR) with polyimide substrate, systems, and methods thereof
    Patent number: 11465041
    Abstract: A force sensing resistor (FSR) that is constructed with a first substrate made of polyimide disposed underneath a second substrate that is resistive and flexible. A handheld controller for an electronic system may include the FSR having a first substrate made of polyimide. The FSR may be mounted on a planar surface of a structure within the controller body, such as a structure mounted within a handle of the controller body, and/or a structure that is mounted underneath at least one thumb-operated control that is included on a head of the controller body. The FSR may be configured to measure a resistance value that corresponds to an amount of force applied to an outer surface of the handle and/or an amount of force applied to the at least one thumb-operated control.
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: October 11, 2022
    Assignee: Valve Corporation
    Inventors: Ian Campbell, Cheang Tad Yoo, Lawrence Yang, Jeffrey Walter Mucha
  • Resistor manufacturing method and resistor
    Patent number: 11462343
    Abstract: An object is to provide a resistor manufacturing method and a resistor capable of suppressing variation in the thickness of a thermally conductive layer intervening between a resistive body and electrode plates. The method of manufacturing the resistor according to the present invention includes a step of forming an uncured first thermally conductive layer on a surface of a resistive body, a step of curing the first thermally conductive layer, a step of laminating an uncured second thermally conductive layer on a surface of the first thermally conductive layer, and a step of bending electrode plates respectively disposed at both sides of the resistive body, curing the second thermally conductive layer, and performing adhesion between the resistive body and the electrode plates via the first thermally conductive layer and the second thermally conductive layer.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: October 4, 2022
    Assignee: KOA CORPORATION
    Inventors: Yuichi Abe, Seiji Karasawa, Michio Kubota, Yoji Gomi, Koichi Minowa
  • Strain gauge
    Patent number: 11460359
    Abstract: A strain gauge includes a flexible substrate; and resistors each formed of a Cr composite film. The resistors include a first resistor and a second resistor that are formed on one side of the substrate, and include a third resistor and a fourth resistor that are formed on another side of the substrate. The first resistor, the second resistor, the third resistor, and the fourth resistor constitute a Wheatstone bridge circuit.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: October 4, 2022
    Assignee: MINEBEA MITSUMI Inc.
    Inventors: Eiji Misaizu, Shigeyuki Adachi, Kosuke Kitahara, Toshiaki Asakawa, Atsushi Kitamura
  • Temperature sensor and device equipped with temperature sensor
    Patent number: 11460353
    Abstract: Provided are: a temperature sensor capable of ensuring reliability and improving thermal responsiveness; and a device equipped with such a temperature sensor. The present invention is provided with: a surface-mounted heat sensitive element (10) having at least a pair of electrode parts (12a), (12b); lead parts (22a), (22b) that are electrically connected to the pair of electrode parts (12a), (12b) by welding; a holder (21) that holds and fixes the lead parts (22a), (22b); and an insulation coating part (23) that insulates at least a portion of the lead parts (22a), (22b) and the heat sensitive element (10). The lead parts (22a), (22b) are tabular metal plates and are formed of a metallic material having a melting point of not more than 1300° C.
    Type: Grant
    Filed: April 18, 2018
    Date of Patent: October 4, 2022
    Assignee: SEMITEC Corporation
    Inventor: Takaaki Hirabayashi
  • Surface-mounted resistor
    Patent number: 11456094
    Abstract: A highly reliable surface-mounted resistor, which prevents a problem of disconnection between an electrode and a terminal of a chip resistor when heating during mounting, is disclosed. The surface-mounted resistor includes a chip resistor comprising a plate-shaped substrate, a resistance body formed on an upper surface of the substrate, and an electrode connected the resistance body and drawn from the upper surface of the substrate to a lower surface via an end surface, a plate-shaped lead terminal connected to the electrode of the chip resistor, the plate-shaped lead terminal being fixed to the electrode of the substrate on the lower surface side, and an exterior member covering an entire chip resistor and a part of the lead terminal.
    Type: Grant
    Filed: February 16, 2021
    Date of Patent: September 27, 2022
    Assignee: KOA CORPORATION
    Inventors: Daigo Hayashi, Jun Ito, Yuko Tezuka
  • Operating device for a motor vehicle, method for operating a motor vehicle with the aid of the operating device, control unit, and motor vehicle
    Patent number: 11451228
    Abstract: An operating device for a motor vehicle, having a touch-sensitive operating element with a frame element and a central region. The touch-sensitive operating interface has a predetermined operating region at each of at least two predetermined touch positions for activating an operating function assigned to the respective operating region. The operating element is arranged to be displaceable at least partially along a translation axis that intersects the operating interface. The operating device has only one detection element, which is arranged facing an inner side of the touch-sensitive operating element that faces away from the touch-sensitive operating interface, and which is arranged to detect a displacement of each operating region along the translation axis.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: September 20, 2022
    Assignee: Audi AG
    Inventors: Jacques Hélot, Joris Mertens, Maximilian Mitwalsky, Clemens Volz, Günther Seitz, Ulrich Müller, Tobias Hopf
  • Method for fastening a contact element in an electrical component, and electrical component having a contact element
    Patent number: 11450457
    Abstract: In a method for fastening a contact element (5, 6) in an electrical component (1), a contact element (5, 6) is arranged on a contact surface (3, 4) of a base body (2) of the component (1) and a laser beam (18) is directed onto a region (16, 17) of the contact element (5, 6) in such a way that the base body (2) is not located in the beam direction (24) of the laser beam (18). The contact element (5, 6) is partially melted by the laser beam (18), so that the molten material (7, 8) wets the contact surface (3, 4) and produces fastening of the contact element (5, 6) on the contact surface (3, 4).
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: September 20, 2022
    Assignee: TDK Electronics AG
    Inventors: Thomas Stendel, Jan Ihle, Gerald Kloiber, Thomas Bernert
  • Strain sensor resistor
    Patent number: 11443877
    Abstract: A strain sensor resistor includes: a resistive element (thin-film strain-resistive layer) formed nearly at the center of an upper surface of an insulation substrate to be a base; and front surface electrodes layered and formed on either end part of the resistive element and electrically connected to the resistive element. The entire upper part of the resistive element and a part of the front surface electrodes are covered by a protective film (protective coating). Moreover, back surface electrodes electrically connected to the front surface electrodes are formed on either lower end part of the insulation substrate, and end surface electrodes are formed on either longitudinal end surface of the insulation substrate. The strain sensor resistor has a tip shape solder mountable on a circuit board etc. using the back surface electrodes.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: September 13, 2022
    Assignee: KOA Corporation
    Inventors: Homare Kaneko, Natsumi Shiobara, Yasushi Hiroshima
  • Thin-film resistors with flexible terminal placement for area saving
    Patent number: 11424054
    Abstract: An apparatus including a dielectric layer; and a set of thin-film resistors arranged in a row extending in a first direction on the dielectric layer, wherein lengths of the set of thin-film resistors in a second direction substantially orthogonal to the first direction are substantially the same, wherein the set of thin-film resistors includes a first subset of one or more thin-film resistors with respective terminals spaced apart by a first distance, and wherein the set of thin-film resistors includes a second subset of one or more thin-film resistors with respective terminals spaced apart by a second distance, the first distance being different than the second distance.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: August 23, 2022
    Assignee: QUALCOMM INCORPORATED
    Inventors: Harikrishna Chintarlapalli Reddy, Alvin Leng Sun Loke