Abstract: A titanium alloy strip has a reduced cross section in the central region of the strip. By concentrating heat in this central region the process of bonding laser devices to a substrate is greatly improved. Furthermore, the present invention allows for the possibility of removing the laser device from the substrate without destroying the laser device.

Abstract: A system (10) and method (30) for precisely depositing a solder compound onto a substrate (18). The system (10) generally includes a receiving member (20) having a rotatable portion (21) adapted to receive a planar substrate (18), a horizontal member (12) for depositing solder balls (11) on the substrate (18), and a contact member (14), located between the receiving member (20) and horizontal member (12). The contact member comprises an aligner plate (14) having a pair of stoppers (15) protruding therefrom. Advantageously, pivotable portion (21) of the system (10) establishes the planarity of the substrate (18), with respect to the horizontal mount (12) allowing for the solder balls (11) to be mounted thereon, preventing the substrate (18) from being slightly misaligned, warped, and/or tilted.

Abstract: A capillary holder for mounting a capillary onto a horn is provided that comprises a mounting hole formed in the horn that has a first width along a first axis that is smaller than a width of the capillary and a second width along a second axis perpendicular to the first axis that is larger than the width of the capillary. In particular, the mounting hole is configured such that application of a flexion force to reduce the second width simultaneously expands the first width so as to fit the capillary when the first width is larger than the width of the capillary, and removal of said flexion force contracts the first width whereby to grip the capillary using an elastic force of the horn.

Abstract: A stencil used for printing solder paste on a contact pad of a printed wiring board has interior surfaces that define one or more apertures through the stencil. Those interior surfaces are coated with a material, such as parylene, having a lower surface tension than the interior surfaces absent the coating. The stencil can also have one or more reverse-tapered apertures passing there through, wherein the apertures have a variable cross-section that is larger at the fill side of the stencil (i.e., where solder paste enters the apertures) than at the board side of the stencil (i.e., where the stencil contacts the contact pad of the printed wiring board). Solder paste can be printed through the aperture(s) of the stencil onto contact pads on a printed wiring board.

Abstract: A joint between one or more structural members and an associated method are provided. The joint includes a friction weld joint or other connection between faying surfaces of the members, and an exothermically reacted sealant disposed in an interface defined by the faying surfaces. The exothermic reaction of the sealant in the interface can be initiated before, during, or after joining the structural members such that the sealant at least partially seals the interface. The sealant can fill the spaces between the structural members to prevent the entry of chemicals, moisture, debris, and other substances, thereby reducing the likelihood of corrosion of the joint or structural members at the interface. Further, the sealant can form a bond with the structural members, thereby increasing the strength of the connection between the members.

Abstract: The machine is adapted to supply, manipulate and position steel strip, fed from a coil, so as to bring it into gapped relationship beneath the side wall of a partly constructed, elevated tank. This is done so that the strip can be welded to the side wall to add a course. It is the objective to ensure that the tank wall is plumb (vertical) and in radius (both as to curvature and relative to the center of the tank) and that the width of the gap is optimized, at the weld point. The machine comprises a ‘floating’ main frame or platform suspended on a mobile undercarriage by four pivotally mounted cylinders. The cylinders are independently responsive to instruments monitoring the elevation, levelness and plumbness of the tank wall and the width of the gap. The main frame carries the coil and carries the strip and the tank wall in the vicinity of the weld point.

Abstract: A method for checking the quality of a wedge bond between a wire loop and a connection point on a substrate, whereby the wire loop was formed by means of a capillary of a Wire Bonder, is characterised by the following steps: Placing the capillary at a side of the wire loop and next to the wedge bond, whereby the tip of the capillary is located below the level of the wire loop. Moving the capillary parallel to the surface of the substrate and orthogonally to the wire loop until the wedge bond tears away from the connection point or the wire breaks, and simultaneously measuring a signal that is a measure for a force exerted by the capillary on the wire loop, and Determining the maximum of the measured signal.

Abstract: A process and an apparatus for applying a brazing material to a metallic structure, especially a honeycomb body, include bringing the metallic structure into contact with a pulverulent brazing material in such a way that the brazing material at least partially adheres to the metallic structure. The metallic structure and/or the brazing material are made to vibrate, at least when they are in contact.

Abstract: A complimentary self-locking wire bond structure and technique is introduced, where the bonding force is focused at the tip of the bond wire and a barb-type construction is utilized to enhance the durability and reduce the insertion forces. The end of wire bond has an “arrowhead” or similar functioning fastener such that the force is focused to a point that pierces the bond pad in a local area. The bond pad may be self-healing, such that the bond pad is made to close over and seal or lock the barb into the underpad layer below the pad, while making electrical contact with the wire bond at the bond pad surface. The bond pad may have a cushioning layer or cavity below it to dampen the piercing force of the pointed barb. A thin metal pad may also be formed over the compliant underpad layer for force absorption.

Abstract: An aluminum plate 12 having a purity of 99.5% or more, preferably 99.9% or more, is caused to contact at least one side of a ceramic substrate 10 of aluminum nitride or alumina to be heated at a temperature of 620 to 650° C. in an inert gas to bond the aluminum plate 12 directly to the ceramic substrate 10.

Abstract: The present invention relates to improvements in forming and transferring solder bumps for use in mounting integrated circuit substrates on chip carrier packages. A mold having cavities for the solder bumps is held in contact with a substrate and a compressible device. As the temperature is increased to melt the solder in the cavities, at an appropriate time and temperature, the compressible device is caused to decompress resulting in the mold separating from the substrate and leaving formed solder bumps on the contacts on the substrate. Various mechanisms are described to cause the force holding the mold and substrate together to decrease.

Abstract: An improved water soluble protective paste and a method for protecting metal circuits and pads on the surface of an electronic board during the manufacturing steps. A densifier is added to the paste making it easier and more efficient the dispensing of the paste. After deposition the layer is dried until a solid protective film is obtained. An additional advantage obtained by the present invention is that the protective layer can be deposited also by means of an offset printing process, avoiding the use of the stencil and of the screening steps. Screening process is a labourious operation which requires very sophisticated equipment and a very high precision in the design of the stencil. Because of these requirements, screening is an expensive process. On the other hand offset printing is a very simple, cheap and reliable method. In addition, the film forming properties allow the material to create a protective film even with a thin deposited film.

Abstract: Method for assembling a semiconductor device having fatigue-resistant interconnection fillet provides a semiconductor chip with at least one solder bump comprising an alloy of tin and lead with a melting temperature higher than the solder paste used. Further, a solder paste (preferably binary) is provided, which comprises tin and about 2.5 weight percent silver, and has a melting temperature of about 221° C. The solder bump is brought in contact with the solder paste, the bump is partially immersed in the paste, and thermal energy is supplied to reflow the solder paste at about 235° C. The amount of energy and time after the reflow of the paste is controlled so that the molten paste dissolves a pre-determined amount of the solder bump (lead and tin) to form a ternary alloy of about eutectic composition (about 1.62 weight % Ag, 36.95 weight % Pb, 61.43 weight % Sn) without melting the solder bump.

Abstract: A method for coating and an associated assembly including such a coating are provided. The assembly includes a workpiece defining a weld portion, such as a friction weld joint and a heat affected zone. A coating is disposed on the weld portion to at least partially cover the weld portion, thereby providing enhanced corrosion resistance to the workpiece.

Abstract: A brazing filler metal sheet is prepared. The brazing filler metal sheet includes a brazing filler metal layer, a sticking material layer, and a released paper. The brazing filler metal layer includes a brazing filler metal. A coating material layer is laminated on the brazing filler metal layer. The coating material layer includes a mixture of coating material particles and a binder. As the coating material particles, MCrAlY particles and abrasive particles are used. The coating material layer is then dried, and the brazing filler metal sheet is cut (step S4), and adhered to a rotor blade. The rotor blade is heated, to melt the brazing filler metal. The brazing filler metal diffuses due to the heat treatment holding process. A solidified layer is then formed by cooling. This solidified layer is subjected to blasting to allow the cubic boron nitride particles to protrude.

Abstract: We have discovered a method of producing a complex-shaped aluminum alloy article, where welding has been employed to form the article, where an anodized aluminum coating is produced over a surface of the article including the weld joint, and where the anodized aluminum coating is uniform, providing improved performance over that previously known in the art for welded articles exposed to a corrosive plasma environment.

Abstract: A method utilizing a stabilizing jig structure for positioning and supporting the assembly of an elongate structural beam and a beam-end mounting component during weld attachment of that mounting component to an end of the beam. This method includes the steps of (a) applying, through a positionally shiftable first biasing element, a first yieldable biasing force which urges the beam-end mounting component relatively toward the associated beam end, and (b) applying, through a positionally shiftable second biasing element, a second yieldable biasing force which urges the beam-end mounting component relatively toward the first biasing element.

Abstract: A capillary has a face surface 13 formed at the tip end thereof so that the face surface 13 inclines toward the center thereof so as to have a tapered shape, and has a through hole 11 formed therethrough so as to permit wire to be placed therethrough so that the through hole 11 has an opening 12 at the center of the face surface 13. The inclination angle ? of the face surface 13 relative to the plane perpendicular to the axis of the capillary and including the opening 12 of the through hole 11 is in the range from 4° to 15°, and the height h of the face surface 13 along the axis of the capillary is equal to or greater than the thickness of the wire 2.

Abstract: Preparation of a weld between a structural I-beam end and a beam-to-column attaching end component wherein no beam flange material is removed to participate in the creation of a weld trough. Instead, the space for a weld trough is created in the end component, and this trough is prepared with enough all-over length to establish run-on and run-off regions for molten weld material, which regions extend laterally outwardly from the opposite transverse ends of a flange. Full-section welds between a beam's flanges and the attaching end component are achieved without the need to use any run-on and run-off tabs, and also without the need to employ any traditionally-used backing bars.

Abstract: A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and the leveling squeegee to approach the pan surface of a transfer unit on going and returning paths. Consequently, the stirring squeegee stirs a viscous fluid put on the transfer unit on the going path of the transfer unit and the leveling squeegee uniformly flattens the viscous fluid stirred on the going path to have a predetermined thickness on the returning path of the transfer unit, thereby forming a flat viscous fluid transfer surface on the transfer unit. By immersing the terminal portion of the electronic component in the viscous fluid transfer surface, the viscous fluid is transferred to the electronic component and the electronic component is then mounted in a predetermined mounting position.