Abstract: Adaptable spring force clamping apparatus and methods are disclosed. In one embodiment, an apparatus includes at least one elongated member adapted to be positioned proximate to a surface of a work piece. The elongated member includes first and second end portions adapted to be secured to substantially prevent movement of the elongated member relative to the surface. A plurality of pressure applying devices are operatively attached to the elongated member, each pressure applying device including a contact member moveable relative to the elongated member and adapted to engage the surface of the work piece, and a resilient member operatively coupled to the contact member and to the elongated member.

Abstract: A connecting material can form a detachable connecting structure. According to the connecting material, a connecting portion between a certain object and another object can be more readily formed, and the certain object can be more readily detached from the another object after formation of the connecting portion. The connecting material comprises a solder material and a hydrogen storage metal material which is able to occlude hydrogen, and which is in the form of particles dispersed in the connecting material.

Abstract: A method and structure are provided for implementing a column attach coupled noise suppressor for a solder column structure of the type used to join a substrate to a circuit card. The electrical noise suppressor structure includes a plurality of elongated through openings that are arranged in a predefined pattern. The elongated through openings have electrically conductive sidewalls and are electrically connected together. The predefined pattern of the elongated, electrically conductive through openings corresponds to a layout of solder columns. The solder columns are attached at one end to either a substrate or a circuit card and are inserted through the elongated through openings of the electrical noise suppressor structure, spaced apart from the electrically conductive sidewalls. Then the solder columns are attached at the other end to the other one of the substrate or circuit card.

Abstract: In a friction stir welding method of manufacturing a piston for a variable capacity swash plate type compressor, the welder is shifted from the welded portions to a predetermined position while maintaining contact between the welder and one of the piston members. After finishing the friction stir welding, a hole is not formed in the welded portions of the piston members to improve durability of the welded portions. The piston members are elastically supported by support rollers to align the central axial lines of the piston members with the axial line of the chuck, even though the diameters of the piston members differ.

Abstract: A method and structures are provided for implementing an impedance-controlled coupled noise suppressor for a differential interface solder column array used to join a substrate to a circuit card. The impedance-controlled coupled noise suppressor structure includes a plurality of elongated through openings that are arranged in a predefined pattern with one or more of the through openings receiving a differential signal pair of solder columns. The elongated through openings have electrically conductive sidewalls and are electrically connected together. The predefined pattern of the elongated, electrically conductive through openings corresponds to a layout of solder columns. The solder columns are attached at opposite ends to a substrate and a circuit card. An electrical connection is provided between the impedance-controlled coupled noise suppressor structure and an image return current path of the circuit card.

Abstract: An apparatus for friction stir welding, a weld tool for friction stir welding, and a method for making a weld tool for friction stir welding are presented. The weld tool comprises a tungsten-based refractory material. A method for manufacturing an article, where the method comprises providing the apparatus for friction stir welding, and the article produced by this method are also presented.

Abstract: The invention relates to a method of manufacturing and coating heat transfer parts for a heat exchanger such as tubes in an automobile radiator. The tubes are coated with brazing material by thermal spraying, such as plasma deposition or wire-arc deposition. The coating is then melted by application of heat to braze the tubes to the fins and to the headers to complete the formation of the heat exchanger.

Abstract: A resistive bonding tool tip comprising a resistive material with a resistance low enough to prevent a discharge of a charge to a device being bonded and high enough to avoid current flow large enough to damage the device being bonded is disclosed.

Abstract: A liquid prime mover can be used to position a component on a substrate. For example, a liquid material can be provided on the substrate adjacent the component such that the component has a first position relative to the substrate. A property of the liquid material can then be changed to move the component from the first position relative to the substrate to a second position relative to the substrate. Related structures are also discussed.

Abstract: A friction welding tool for friction welding can be controlled with respect to measuring accuracy based upon the temperature in the weld zone. This is attained by determining the temperature values of the weld zone by way of a temperature sensor, which is arranged with its measuring point in the pin of the stir welding tool.

Abstract: Method for welding objects having limited backside access to a cavity behind a region to be welded. The method includes inserting a fugitive backing material in an installation state into a first portion of the cavity proximate the region to be welded and then transforming the fugitive backing material to a rigid state. The method further includes forming a weld in the region and then transforming the fugitive backing material to a removable state and removing the fugitive backing material from the cavity. The method may also include placing a pre-formed weld backing in the cavity and filling the cavity with a fugitive backing material. The method further includes transforming the fugitive backing material to a rigid state, forming a weld, and transforming the fugitive backing material to a removable state. The method may further include removing the fugitive backing material and removing the pre-formed weld backing from the cavity.

Abstract: A semiconductor die having multiple solder bumps, each having a diameter less than about 100 microns, and the method for making such a die are described. The pitch between the solder bumps is less than 100 microns. A thermal solder jet apparatus is utilized to deposit solder material to form the solder bumps. The apparatus includes a print head having a plurality of solder ejection ports. Each ejection port has an associated gas ejection conduit connected to a chamber containing one or more hydride films for producing hydrogen gas. The hydrogen gas is utilized to force the ejection of the solder material from the ejection port. A controller controls and choreographs the movements of the movable substrate and movable drive so as to accurately deposit material in desired locations on the semiconductor dies.

Abstract: A method of manufacturing a friction plate including a plurality of frictional material segments which are punched into a predetermined shape, and a core plate onto which the plurality of frictional material segments are annularly bonded, comprising step of punching out the frictional material segment in such manner that an edge portion thereof along the predetermined shape is given a punching load earlier than the other portions thereof in the process of punching.

Abstract: A bondhead is provided that comprises a bondhead body for holding a bonding tool, such as an ultrasonic transducer, and a bondhead actuator coupled to the bondhead body for moving the bonding tool with respect to a bonding surface. A wire clamping device, which may comprise a wire clamp holder and a wire clamp, is movable relative to the bondhead body for feeding a bonding wire to the bonding tool. A wire clamping device actuator is operative to move the wire clamping device relative to the bondhead body for improved control of the feeding of bonding wire to the bonding tool.

Abstract: The invention relates to a roll-bonded titanium sheet (6), a shaped component manufactured therefrom (10) and a method for manufacturing the titanium sheet (6) and the shaped component (10). In order to achieve a high-temperature-resistant shaped component (10), a titanium sheet (2) is roll-bonded at least on one side with aluminium foil (4) whose thickness (d) is small compared with the thickness (D) of the titanium sheet (2). As a result of heat treatment of the roll-bonded titanium sheet (6), the aluminium and titanium from the adjoining region are converted to an aluminium-titanium alloy. The outer titanium-aluminium-alloy layer of the titanium sheet (6) thus formed is converted by contact with oxygen into a titanium-aluminium-mixed oxide layer which gives the titanium sheet (6) good corrosion protection. The forming of the shaped component (10) preferably takes place before the heat treatment for alloy formation because the roll-bonded titanium sheet (6) is then still slightly deformable.

Abstract: A system and method for reflowing lead-free solder to interconnect a plurality of electronic components to a substrate is disclosed. The system includes an oven for preheating the substrate and the plurality of electronic components disposed thereon, and a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder.

Abstract: The present invention provides a structure, apparatus, and method for wire bonding in which a first wire bond is formed between first and second components, a second wire bond is formed between the second component and a third component such that the second wire bond is in electrical communication with the first wire bond, wherein the first and second wire bonds are connected to said first and second components, respectively, using ball bonding.

Abstract: In one aspect the invention provides a friction welded component and a method of manufacture for such a component, comprising friction welding a reinforcement element (10) at an end cross-section thereof to a surface of a thin walled member (12) with an interlayer member (14) interposed between the reinforcement element and the surface of the thin walled member. The thin walled member and/or the interlayer are preferably of the same or similar material and the thickness of the thin walled member is preferably less than or equal to 6 mm and more preferably in the range 0.5 to 2 mm with the diameter of the reinforcement element being greater than 10 times the thickness of the thin walled member. The invention finds particular application in the fabrication of bosses to gas turbine aero-engine casings and fabricated nozzle components, for example.

Abstract: In an ultrasonic bonding method that bonds a material to a bonding surface by the application of ultrasonic vibration, both side faces of the material in the direction of ultrasonic vibration are clamped by an application member that applies a predetermined ultrasonic vibration, and by a clamping member. The clamping member is synchronously vibrated by ultrasonic vibration transmitted through the material from the application member, and the material is bonded to the bonding surface while being pressed against the application member and against the bonding surface. In this method, high bonding quality can be achieved by efficiently transmitting ultrasonic vibration from the application member to a material to be bonded, and the material can be prevented from tilting, cracking, chipping, or the like without being subjected to a special working operation, for example, forming of a chamfered portion.

Abstract: A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip at an end thereof. The working tip includes an annular chamfer formed at an inner portion of the end of the working tip, the inner annular chamfer having an angle of less than about 60 degrees. The inner annular chamfer is coupled to a lower portion of a cylindrical passage formed in the bonding tool.