Abstract: A server information handling system may include a processor; a network interface device (NID); a power source; a vertical backplane for providing electrical and data coupling to a plurality of hard disk drives (HDDs) operatively coupled to the vertical back plane; a plurality of vent holes formed through the vertical backplane; and an acoustic dampening device including a duct extension protruding away from the plurality of vent holes formed through the vertical backplane; the duct extensions to acoustically separate a fan system of the server information handling system from the plurality of HDDs within the information handling system server by mitigation of acoustic energy transmission generated by airflow through the plurality of vent holes.

Abstract: An electronic device according to an embodiment of the disclosure may include a housing including a front plate, a back plate disposed to the opposite side of the front plate, and a side member surrounding a space between the front plate and the back plate, wherein at least a part of the back plate is constructed of a conductive material, and the side member includes an opening, a touch screen display disposed between the front plate and the back plate, a female connector disposed inside the opening, constructed to house a meal connector an external male connector, and including a plurality of pins, a Printed Circuit Board (PCB) disposed inside the space and including a ground plane, a circuit electrically coupled to the ground plane and/or mounted thereon to cut off leak current from the PCB, a first conductive path constructed between the circuit and a first point of at least part of the back plate, and a second conductive path constructed between at least one of the pins and a second point of at least part

Abstract: A thermally maintainable built-in storage tray structure can include a case main frame body; a storage unit tray is positioned within the case main frame body, and wherein the storage united is configured to be positioned at a front end of a server together with a mainboard and a PCI_E and the storage unit tray is moveably connected to the case main frame body and is capable of be pulling out of the case main frame body; a middle flip rack provided at a middle part and a rear flip rack provided at a rear part of the storage unit tray, the middle flip rack and the rear flip rack are hinged to the storage unit tray.

Abstract: A thermal management system that include an electronic circuit boards having at least two circuit boards with a space in between and further includes one or more air tubes or conduits. The electronic circuit board and air tubes are configured for drawing air into the space to facilitate cooling of the electronic circuit board concurrent with cooling of a heat sink of a heat pump connected with the electronic circuit board. The system can further include a partition to isolate airflow from the heat sink from airflow through the electronics circuit board, and can further include one or more interface components for maintaining isolation and control of air flow, improving air intake and/or supporting auxiliary components.

Abstract: An electronic device includes a fan assembly that draws air (including heated air) away from components and forces the air out of the electronic device. The fan assembly includes a guide vane located in the fan housing. Subsequent to air entering the fan assembly via the fan inlets, the guide vane is designed to direct the air to a fan outlet. Further, the guide vane is designed and positioned in the fan assembly to limit or prevent flow separation that may cause the heated air to recirculate and may also cause increased turbulence leading to elevated acoustic noise. Furthermore, the guide vane may include a tapered region to allow the heated air to readily flow over the guide vane to limit or prevent a vortex from occurring within the fan assembly. Using the guide vane, the fan assembly drives more air at the same fan speed and lowers noise generation.

Abstract: Conditioning systems and methods for providing cooling to a heat load can include an evaporative cooler arranged in a scavenger plenum with a recovery coil downstream of the evaporative cooler. The conditioning systems can operate in various modes, including an adiabatic mode and an evaporative mode, and a blended mode between the adiabatic mode and the evaporative mode, depending on environmental conditions. The blended mode can be enabled by a fluid transmission and retention device fluidically connected to the inlet and outlet of the evaporative cooler, the recovery coil outlet, and the heat load. The fluid transmission and retention device can variably distribute the cooling fluid exiting the recovery coil and the cooling fluid exiting the evaporative cooler to one or both of the heat load and the evaporative cooler inlet. In an example, the fluid transmission and retention device includes a manifold. In another example, the fluid transmission and retention device includes one or more tanks.

Abstract: A computer host system includes a housing and at least one of a top expansion frame and side expansion frames. The housing includes a front panel, a rear panel, a top panel, and side panels. The top panel and the side panels are detachably installed respectively on top and both sides of the front and rear panels. The top expansion frame is installed on top of the front and rear panels to expand an accommodating space at a top portion of the housing. The side expansion frames are installed on both sides of the front and rear panels and used to expand an accommodating space on both sides of the housing. The top expansion frame has a same cross-sectional shape as the top portion of the housing, and the side expansion frame has a same cross-sectional shape as a side of the housing.

Abstract: A closed cold pool system is disclosed. The closed cold pool system may include a first closing assembly, a cabinet assembly and a second closing assembly. The first closing assembly is provided on a front side of the cabinet assembly to form a first closed cold aisle, and the second closing assembly is provided on a rear side of the cabinet assembly to form a second closed cold aisle. The cabinet assembly may include a power distribution cabinet, an in-row air conditioner and a main device unit that are provided side by side. The in-row air conditioner may include a front air supply opening, a rear air supply opening and a top air return opening. The front air supply opening is communicated with the first closed cold aisle, and the rear air supply opening is communicated with the second closed cold aisle.

Abstract: An air-duct module for a server comprises a main body that includes an upper wall and a plurality of side walls extending downwardly away from the upper wall. The main body further includes a plurality of channel walls extending from the upper wall and defining a cable-routing channel located within the main body. The cable-routing channel receives an electronics cable that extends across the main body. The air-duct module has an air passage for guiding air across a heat exchanger within the server. The air-duct passage is defined by the upper wall, the plurality of side walls, and at least some of the plurality of channel walls.

Abstract: A disclosed system includes (1) at least one hardware component mounted to a drawer of a chassis, (2) a fan module capable of generating airflow to cool the hardware component, and (3) an extensible airduct coupled between the hardware component and the fan module such that, when the drawer of the chassis is opened, the extensible airduct stretches out to lengthen a distance between the hardware component and the fan module and, when the drawer of the chassis is closed, the extensible airduct contracts to shorten the distance between the hardware component and the fan module. Various other apparatuses, systems, and methods are also disclosed.

Abstract: A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. Advantageously, a pH indicator is employed to monitor the dielectric fluid.

Abstract: An isolated vibration assembly for a computing device includes a top assembly having a top plate. The assembly further includes a base assembly having a base plate that is generally parallel to and offset from the top plate. A partition assembly is positioned generally perpendicularly between the top plate and the bottom plate, with two partition plates defining an internal space. A plurality of vibration isolators is attached in an interspersed manner to one or more surfaces of the top plate, the base plate, or the two partition plates. A computing device is removably installed within the internal space, generating vibrations that are reduced when passing through the plurality of vibration isolators.

Abstract: A combined liquid and air cooling system is provided over a printed circuit board (PCB) of an electronic device, where the PCB includes an integrated circuit package including an application specific integrated circuit (ASIC) die and a plurality of high bandwidth memory (HBM) modules located proximate the ASIC die, and the combined liquid and air cooling system includes a liquid cooling system located over the integrated circuit package and an air cooling system integrated with the liquid cooling system and a portion of the PCB. The system operates in a normal mode, where both liquid and air cooling systems provide cooling to components of the PCB, and a fail-safe mode, where the liquid cooling system is not operating (e.g., due to a detected condition) but the air cooling system operation is adjusted such that it provides sufficient cooling to PCB components which facilitates continuous operation of the electronic device.

Abstract: A circuit board structure includes a carrier and a patterned circuit layer. The patterned circuit layer is disposed on the carrier, and the patterned circuit layer has at least one fluid channel therein. The fluid channel has a heat absorption section and a heat dissipation section relative to the heat absorption section. A heat source is electrically connected to the patterned circuit layer, and the heat absorption section is adjacent to the heat source. The heat generated by the heat source is transferred from the patterned circuit layer to the heat absorption section of the fluid channel, and is transferred from the heat absorption section to the heat dissipation section for heat dissipation.

Abstract: A cooling device including a container to which at least one heating element is thermally connected, a primary refrigerant, and a condensation tube through which a secondary refrigerant flows, wherein a container inner surface area increasing portion is formed on an inner surface of the container to which the heating element is thermally connected, and a plate-shaped member is provided, that includes a shielding portion that is located above the container inner surface area increasing portion in a direction of gravity and below the condensation tube in the direction of gravity, with at least a part of the shielding portion not immersed in the primary refrigerant in a liquid phase, and the plate-shaped member includes a support portion extending from the shielding portion, in a part of a periphery along an orthogonal direction to the direction of gravity, of the container inner surface area increasing portion.

Abstract: A tray for accommodating electronic components is disclosed. The tray has a body that defines a storage space for accepting electronic components in a side-by-side configuration. The body also defines a first airflow channel for guiding airflow from the storage space towards the outside of the body. The body has air inlets and air outlets for providing fluid communication with the storage space. The component bodies of the electronic components are configured to at least partially define a second airflow channel in the storage space for guiding, in use, the airflow from the air inlets to the air outlets, and has been selected for increasing a surface area of the first electronic component being in contact, in use, with the airflow in the storage space.

Abstract: An information handling system may include a chassis, a cable channel formed within the chassis, and a sleeve within the cable channel and configured to minimize airflow recirculation in the chassis via the cable channel, the sleeve comprising a cable passage opening for passage of a cable and an obstruction configured to create a seal at the cable passage opening in the absence of the cable from the cable passage opening, such seal restricting airflow through the cable passage opening.

Abstract: Modular heat sinks are provided that support configurations using combinations of cooling and expansion card components, whereby the expansion card may support coupled devices. Heat sinks may include a fin set that is permanently fixed to the heat sink and a second fin set that can be decoupled from a location on the heat sink base. The second fin set can instead be replaced on the heat sink base by an expansion card connector, such as a M.2 expansion card connector. In some embodiments, an expansion card connector also includes a fin set, with the expansion card connector fastened on top of that fin set. The fin set to which the expansion card connector is fastened may include multiple tiers of fins of different heights that may conform to the space available to the heat sink, thus maximize cooling capabilities of the heat sink while also supporting an expansion card.

Abstract: A system to improve cooling of rack mounted components may include a first rack mounted component including a first motherboard, the first motherboard having a first edge and a second rack mounted component disposed above the first rack mounted component; the second rack mounted component having a second motherboard having a first edge, wherein the second motherboard is similar to the first motherboard. The second motherboard may be disposed above the first motherboard, and wherein the second motherboard is angled with respect to the first motherboard so that the first edge of the second motherboard is non-aligned with the first edge of the first motherboard. In addition, the first motherboard may be arranged horizontally in a first plane and the second mother board may be arranged horizontally in a second plane that is parallel to the first plane.

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a first housing, a second housing, where the second housing includes a fan, an inlet, and actuators, and a hinge, where the hinge rotatably couples the first housing to the second housing. When the first housing is rotated over the inlet, the actuators lower the inlet to create a gap between the inlet and the first housing. In some examples, the inlet includes slats and when the first housing is rotated over the inlet, a distance between each of the slats increases from a first distance to a second distance.