Abstract: An adapter with a heat dissipation layer applied in locations of high electric current and provided for using in high-current electrical appliances, the adapter is provided with a heat dissipation fan on one side or on two sides at the same time, the heat dissipation fan is activated by a small amount of electric power from the adapter, so that the heat dissipation fan is capable of performing heat dissipation function for the adapter, and a guide rod in the adapter is sleeved with an embossed heat dissipation layer, which makes the adapter's heat dissipation effect better, thereby preventing the adapter from deteriorating due to high heat, maintaining product stability, prolonging service life, and reducing work accidents.

Abstract: A control substrate includes a substrate, a power-supply circuit, a communication circuit, a first terminal block that includes a first wiring connector, a second wiring connector, and a third wiring connector, a second terminal block that includes a fourth wiring connector and a fifth wiring connector, a first pattern, a second pattern, a third pattern, a fourth pattern, a fifth pattern, a sixth pattern, a first switch that is provided in the third pattern and is capable of switching connection and disconnection between the second wiring connector and the communication circuit, and a second switch that is provided in the fifth pattern and is capable of switching connection and disconnection between the fourth wiring connector and the communication circuit.

Abstract: The present disclosure refers to methods and electronics used to test immersion cooling controllers. A representative method comprises operably connecting a simulator device to an immersion cooling controller. The simulator device is used to communicate one or more changes to the immersion cooling controller wherein the one or more changes relate to one or more sensed parameters of an immersion cooling system. The reaction of the controller to the one or more changes is compared to an expected reaction of the controller to determine whether the controller is functioning properly. The controller may be configured to control any parameter of an immersion cooling system including, but not limited to, temperature, water flow, pressure, fluid level, fluid purity, and any combination thereof.

Abstract: Cooling arrangement of data center configured for backup operation, the arrangement including an active cooling system having: fluid cooling systems. The arrangement further including an intake louvers assuming a closed position separating interior space of the data center from the exterior environment during normal mode of operation and an open position enabling free flow of outside air into the interior space during backup operation; exhaust louvers assuming a closed position separating interior space of the data center from the exterior environment and an open position enabling free flow of interior air out to the exterior environment; and controller configured to direct the intake louvers and exhaust louvers to assume the open position when electrical power supply to the active cooling system has been interrupted. The arrangement further includes a fluid system which functions as an open loop in the normal mode and a closed loop in the backup mode.

Abstract: A two-phase immersion cooling system for cooling electronics. The electronics are immersed in immersion tank filled with dielectric liquid. As liquid evaporates due to heat generated by the electronics, it enters a vapor passageway that leads the vapor to a condenser situated remotely from the immersion tank. Upon condensing at the condenser, the condensed liquid is directed to a resupply tank, wherein the condensed liquid cools. When the level of the dielectric liquid in the immersion tank drops below a set threshold, a pump is activated to deliver the condensed liquid from the resupply tank to the immersion tank. The immersion tank, vapor passageway and condenser are position inside a containment passageway. The containment passageway captures any vapor not entering the vapor passageway and direct such vapor to the condenser. The resupply tank may also be positioned within the containment passageway.

Abstract: An electric distribution module includes a plate bearing a main partition and lateral partitions that jointly delimit a plurality of housings, wherein the main partition has at least one channel, and wherein each lateral partition comprises at least one channel that is terminated by an opening leading into a housing that this lateral partition delimits and that communicates with a channel of the main partition, so to as to ensure, via these channels, independent ventilation of each housing and/or the routing and holding of control cables towards each housing.

Abstract: A data center and a data center cluster have plurality of immersion cooling systems and a plurality of coolant units that provide two-phase coolant to one or more of the plurality of immersion cooling systems. Each coolant unit dispatches and manages two-phase coolant to two or more of the plurality of immersion cooling systems. The coolant units can fill or empty an immersion tank of an immersion cooling system, and can empty or fill a coolant tank in the coolant unit. A single-phase cooling fluid cools the vapor phase of the two-phase coolant in each immersion cooling system. The coolant units are modular, with a common interface to other coolant units and to immersion cooling systems to create a scalable cooling system and data center.

Abstract: Disclosed is an immersion cooling unit including an immersion cell, defining an internal cavity. An electrical component is positioned in the internal cavity. A dielectric working fluid partially fills the internal cavity and at least partially immerses the electrical component. A condensing coil is positioned above the dielectric working fluid. The dielectric working fluid comprises at least one of 1,1,1,2,2,5,5,6,6,6-decafluoro-3-hexene, (HFO-153-10mczz), or 1,1,1,4,5,5,5-heptafluoro-4-trifluoromethyl-2-pentene, (HFO-153-10mzzy). Also disclosed is a method of cooling an electrical component, comprising partially immersing an electrical component in a working fluid; and transferring heat from the electrical component using the working fluid.

Abstract: A thermal module for cooling a plurality of component and cooling a bottom cover of a sealed chassis. A pair of fans are positioned in the chassis, wherein each fan has a first fan outlet directing a first portion of the airflow toward a first fin stack near a vent in the back cover, a second fan outlet for directing a second portion of the airflow to a second fin stack near a vent in a side cover, and a third fan outlet for directing a third portion of the airflow to a set of components in the chassis or a surface of the chassis. The size of each fan outlet and the size and impedance of the first fin stack and the second fin stack are configured to ensure the airflow is distributed according to a ratio based on cooling a set of components in the chassis and a bottom cover of the chassis.

Abstract: A method and system improve the cooling of computer power supply unit by eliminating a reverse flow of hot air caused by an imbalance in airflow between a power supply fan and a system fan. The method determines a correlation between a system fan speed and a heightened power supply fan speed that prevents the reverse flow of hot air into the power supply unit. During the operation of the power supply unit, the system fan speed is obtained and the heightened power supply fan speed is determined from the correlation. The power supply fan is then controlled using the heightened power supply fan speed setting.

Abstract: Electronic equipment (10) has multiple cooling fans (15) for sending air to a heat sink (30). The multiple cooling fans (15) generate airflow (Fh) passing through the heat sink (30) from a first side (H1) to a second side (H2) thereof. The heat sink (30) is arranged obliquely to a crosswise direction and a longitudinal direction of the electronic equipment (10). A sheathing member (40) has an air inlet opening (41i) formed obliquely to the crosswise and longitudinal directions along the first side (H1) of the heat sink (30).

Abstract: A coolant management unit for providing liquid cooling for backup battery unit (BBU) modules of an electronic rack includes a BBU return manifold, a BBU supply manifold, a balance loop, and a power bus. For example, a BBU supply manifold having a rack supply connector to receive cooling fluid from a rack supply manifold and a BBU supply connector to be connected to one of the BBU modules to distribute the cooling fluid. A BBU return manifold to be coupled to a rack return manifold, wherein the BBU return manifold is to receive vapor from the BBU modules. A balance loop connected to each of the BBU modules to establish a fluid connection amongst the BBU modules, such that a level of the cooling fluid in each of the BBU modules remains similar.

Abstract: The parallel assembly of rectifier modules includes a plurality of rectifier modules connected in parallel, a switch for switching-in and switching-out of the rectifier modules, an assembly frame, being provided therein with a switch accommodating space and a rectifier module accommodating space; a DC bus bar, being arranged at the top of the assembly frame; a plurality of groups of connectors, being fixed at one end close to the back side of the assembly frame; an AC copper bar, being fixed at one end close to the front side of the assembly frame; an extended copper bar, being fixed at one end close to the back side of the assembly frame.

Abstract: An airflow duct can be arranged at least in part in a zone alongside an electronics board mounted to a motherboard. The airflow duct can include an inlet end arranged to receive airflow into the airflow duct. A closed end wall can be arranged opposite the inlet end. A set of walls may extend from the inlet end to the closed end wall and include a top wall, a bottom wall, a first lateral side wall, and a second lateral side wall. Orifices can be included in the set of walls and can be arranged to direct airflow from within the airflow duct toward heat-producing components borne by the electronics board.

Abstract: Conditioning systems and methods for providing cooling to a heat load can include an evaporative cooler arranged in a scavenger plenum with a recovery coil downstream of the evaporative cooler. The conditioning systems can operate in various modes, including an adiabatic mode and an evaporative mode, depending on outdoor air conditions. The systems can operate in a blended mode between the adiabatic mode and the evaporative mode by varying the distribution of return water from the recovery coil into at least partially isolated sections of a storage tank, and selectively directing cold water from the evaporative cooler into the tank. The mix of warm and cold water exiting the tank can be varied to maintain the cold-water supply at or near a set point temperature for the heat load. In an example, the systems can include a pre-cooler in the plenum upstream of the evaporative cooler for pre-conditioning the scavenger air.

Abstract: The disclosure relates to the technical field of an electronic device, and provides a case and an electronic device. The case includes: a case body, which has a plurality of case sides, a cavity enclosed by the case sides and configured to accommodate the electronic device; a plurality of vents, which are disposed on at least part of the case sides and configured to ventilate between the case cavity and an external space; and a water retaining mechanism, which is on the inner wall of the case body and positioned at the vents.

Abstract: A thermal management device with electromagnetic (EM) shielding includes a fin pack with a plurality of channels. The fin pack has an upper and lower surface. The fin pack has a pack length, pack height, and pack width. The fin pack has fins are oriented connecting the upper surface to the lower surface. The plurality of channels extends from a first end toward a second end. A first channel of the plurality of channels is adjacent the upper surface, and a second channel of the plurality of channels is adjacent the lower surface.

Abstract: In one embodiment, a cooling system comprises an information technology (IT) cluster layer with multiple immersion tanks, each immersion tanks including electronic components submerged in a two-phase liquid coolant; and a cooling capacity layer that includes a vapor subsystem, a liquid subsystem, and a condensing cooler. The system further includes a distribution layer that include vapor lines for transmitting vapor from each of the immersion tanks to the vapor subsystem, and liquid lines for distributing liquid from the liquid subsystem to each immersion tank in the IT cluster layer. The two subsystems operate independently to maintain proper fluid level in the immersion tanks efficiently.

Abstract: Embodiments of an enclosure assembly to enhance cooling of a hydraulic fracturing direct drive unit (DDU) during operation are included. The enclosure assembly may include an enclosure body extending at least partially around an enclosure space to house the DDU for driving a fluid pump. The enclosure assembly may include one or more heat exchanger assemblies connected to the enclosure body for cooling a process fluid associated with one or more of the DDU and the fluid pump, and which may be configured to draw air into the enclosure space from and external environment, toward one or more radiator assemblies to cool the process fluid, and along an airflow path through the enclosure space. One or more outlet fan assemblies may be operative to discharge air from the enclosure space to the external environment to maintain a desired temperature of the enclosure space.

Abstract: A switchgear or control gear includes: at least one first compartment; at least one second compartment; a plurality of main switchgear or control gear components including a main busbar system, a three position linear or rotational movement disconnector, a circuit breaker, and at least a first part of an insulated cable connection; and a plurality of auxiliary switchgear or control gear components including a disconnector drive and a circuit breaker drive. The plurality of main switchgear or control gear components are housed in the at least one first compartment. The plurality of auxiliary switchgear or control gear components are housed in the at least one second compartment. When one or more of the plurality of main switchgear or control gear components is energized, the at least one first compartment is hermetically sealable or maintainable at an internal air pressure greater than ambient air pressure.