Patents Examined by Megha Mehta
  • Patent number: 8016182
    Abstract: A wire loop includes a wire connecting a first bonding point and a second bonding point therethrough, wherein an additional wire loop is formed after wire bonding at the second bonding point without cutting the wire and the additional wire loop is bonded to the second bonding point or to the vicinity thereof while part of the wire is crushed.
    Type: Grant
    Filed: May 10, 2005
    Date of Patent: September 13, 2011
    Assignee: Kaijo Corporation
    Inventors: Mizuho Shirato, Hiromi Fujisawa, Tadahisa Akita
  • Patent number: 7997470
    Abstract: A transducer is provided that comprises a horn that is configured to transmit vibrations along its length during operation in the form of an oscillatory waveform, such oscillatory waveform having a plurality of vibration nodal points. An ultrasonic generator is coupled to one end of the horn and a bonding tool is coupled to an opposite end of the horn for performing bonding operations. A first flange structure is located along the length of the horn at a first vibration nodal point for mounting the transducer, and a second flange structure is located along the length of the horn at a second vibration nodal point for mounting the transducer, such that the second flange structure is separated from the first flange structure by a distance of at least two consecutive vibration nodal points.
    Type: Grant
    Filed: November 24, 2006
    Date of Patent: August 16, 2011
    Assignee: ASM Technology Singapore Pte Ltd
    Inventors: Hing Leung Marchy Li, Boon June Edwin Yeap, Ka Shing Kenny Kwan, Man Chan, Yam Mo Wong
  • Patent number: 7988030
    Abstract: In a conventional wave soldering bath, the bottom surface of a bath body in a position which is below the inlet of a duct underwent erosion by molten solder and had a hole formed therein, causing molten solder to be spilled out from the hole. The cause of erosion of the bottom surface of the bath body is a vortex (T) of molten solder formed below the duct inlet accompanying rotation of an impeller pump (10), and the vortex rubs the bottom surface of the bath body. In the present invention, a shielding member (14) is installed between the duct inlet (12) and the bottom surface (13) of the bath body such that the vortex is prevented from affecting the bottom surface.
    Type: Grant
    Filed: March 7, 2006
    Date of Patent: August 2, 2011
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Mitsuo Zen, Hirokazu Ichikawa
  • Patent number: 7975898
    Abstract: A joining method includes melting a hot melt joining material provided between a board and a component to be joined to the board; and reducing the pressure of the ambient atmosphere of the hot melt joining material and tilting the board while the hot melt joining material is in a molten state.
    Type: Grant
    Filed: December 21, 2009
    Date of Patent: July 12, 2011
    Assignee: Fujitsu Limited
    Inventor: Tetsuji Ishikawa
  • Patent number: 7971769
    Abstract: A weld stack includes a horn having a weld end, a polar mount adapted to receive a portion of the horn therein, a first adjustment ring coupled to the polar mount at a pre-determined distance from the weld end of the horn, and a second adjustment ring coupled to the polar mount adjacent the first adjustment ring, wherein the second adjustment ring includes a fine adjustment device for adjusting a relative position of the first adjustment ring and the second adjustment ring.
    Type: Grant
    Filed: November 2, 2009
    Date of Patent: July 5, 2011
    Assignee: GM Global Technology Operations LLC
    Inventors: Edgar M. Storm, Paul F. Spacher
  • Patent number: 7931184
    Abstract: An apparatus for induction friction solid state welding a body having a work piece receiving bore. A stationary chuck is provided for securing a first tubular workpiece in the bore. A moving chuck is provided for securing a second tubular workpiece in bore. An induction heating coil is movable between an operative position and a stored position. An expandable cylinder moves the moving chuck toward and away from the stationary chuck. A torque transmission collar is used to rotate the moving chuck.
    Type: Grant
    Filed: September 18, 2007
    Date of Patent: April 26, 2011
    Assignee: Spinduction Weld, Inc.
    Inventors: David Lingnau, Colin McDonald
  • Patent number: 7874475
    Abstract: A method for the planar joining of components of semiconductor devices involves coating the components with diffusion materials on their upper sides and rear sides, respectively. Subsequently, the components to be joined one on the other are introduced into a reducing atmosphere. The components are aligned and a compressive pressure is exerted on the aligned components. While heating up the components to be joined in the reducing atmosphere to a diffusion joining temperature, isothermal solidification takes place, the diffusion joining temperature lying below the melting temperature of the forming diffusion joint of the joined material.
    Type: Grant
    Filed: December 7, 2006
    Date of Patent: January 25, 2011
    Assignee: Infineon Technologies AG
    Inventors: Khalil Hosseini, Joachim Mahler, Edmund Riedl, Ivan Galesic, Konrad Roesl
  • Patent number: 7866534
    Abstract: There is provided a conductive ball mounting apparatus. The conductive ball mounting apparatus includes: a conductive ball mounting mask disposed to oppose a substrate having a plurality of pads coated with an adhesive flux, the conductive ball mounting mask having a plurality of ball mounting through holes for mounting each of conductive balls on each of the plurality of pads, the plurality of ball mounting through holes being arranged to oppose to the plurality of pads; and a conductive ball supplying unit for moving or removing the conductive balls on the conductive ball mounting mask by sucking an air on an upper surface side of the conductive ball mounting mask. The conductive ball mounting mask includes through portions formed to block passing of the conductive balls.
    Type: Grant
    Filed: July 2, 2008
    Date of Patent: January 11, 2011
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Hideaki Sakaguchi, Kiyoaki Iida, Mitsutoshi Higashi
  • Patent number: 7841505
    Abstract: A wire clamp includes a pair of clamp arms at a predetermined distance from each other to define an interval therebetween for a bonding wire, a clamp body coupled to the clamp arms, the clamp body configured to adjust the predetermined distance between the clamp arms with respect to a process to be performed, a clamping section in each clamp arm, the clamping section having concave portions facing the interval between the clamp arms, the concave portions being configured to contact the bonding wire when the clamp arms are brought close together, and at least one abrasion prevention member in each clamping section, the abrasion prevention members being configured to prevent abrasion during contact with the bonding wire.
    Type: Grant
    Filed: February 10, 2009
    Date of Patent: November 30, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-Soo Lee, Ki-Taik Oh, Jung-Hyeon Kim
  • Patent number: 7828190
    Abstract: In an ultrasonic mounting apparatus, a pressing shaft coupled with a voice coil motor to apply a load on a part to be mounted is placed independently from components including a bonding tool, ultrasonic horn, transducer, and horn support member. The components can move coaxially with the pressing shaft which is an application axis of a driving force. Abutting position of the bonding tool and pressing shaft is brought into coincidence with a node of a standing wave generated in the bonding tool.
    Type: Grant
    Filed: April 6, 2009
    Date of Patent: November 9, 2010
    Assignee: TDK Corporation
    Inventors: Yuji Saito, Tomomi Asakura, Mitsuyoshi Makida, Toru Mizuno, Toshinobu Miyagoshi
  • Patent number: 7815094
    Abstract: A method of manufacturing a cylindrical body, comprising the step of forming the cylindrical body by bending a plate-like work having first projected finger to fourth projected finger at four corned parts and allowing the end faces thereof to abut on each other, wherein the main surface of the cylindrical body on the side where sags are present is formed in an outer peripheral wall surface and the rear surface thereof on the side where the burrs are present is formed in an inner peripheral wall surface, and a first projected part is formed of the first projected finger and the third projected finger and a second projected part is formed of the second projected finger and the fourth projected finger. After the cylindrical body is held by friction stir welding devices, the probe of a friction stir welding tool is buried from the direction of either of the first projected part and the second projected part, and scanned in the direction of the other of the second projected part and the first projected part.
    Type: Grant
    Filed: December 5, 2003
    Date of Patent: October 19, 2010
    Assignee: Honda Motor Co., Ltd.
    Inventors: Shunsuke Sunahara, Haruo Machida, Yuu Igarashi, Tadashi Goto, Toshimasa Koshimizu, Hideo Nakamura, Satoru Morita, Taisei Wakisaka, Kei Kuriyama
  • Patent number: 7810704
    Abstract: A method for joining component bodies of material over bonding regions of large dimensions by disposing a plurality of substantially contiguous sheets of reactive composite materials between the bodies and adjacent sheets of fusible material. The contiguous sheets of the reactive composite material are operatively connected by an ignitable bridging material so that an igniting reaction in one sheet will cause an igniting reaction in the other. An application of uniform pressure and an ignition of one or more of the contiguous sheets of reactive composite material causes an exothermic thermal reaction to propagate through the bonding region, fusing any adjacent sheets of fusible material and forming a bond between the component bodies.
    Type: Grant
    Filed: April 15, 2008
    Date of Patent: October 12, 2010
    Assignee: Nanofoil Corporation
    Inventors: Alan Duckham, Jesse E. Newson, Michael V. Brown, Timothy Ryan Rude, Omar M. Knio, Ellen M. Heian, Jai S. Subramanian
  • Patent number: 7806312
    Abstract: A method and structure is disclosed for detaching a chip from a substrate that delays the delivery of shear force to the chip until the connectors attaching the chip to the substrate are soft enough that the delivery of shear force will not damage the chip's connectors. More particularly, the shear force is created by a bimetallic disk that, when heat is applied, is transformed into shearing force. The shearing force is delayed by a delaying device until the connectors connecting the chip to the substrate are soft enough that the application of shear force will separate the chip from the substrate without damaging the chip's connectors. The delaying device includes a physical gap that may be adjusted to control when the shear force is applied to the chip.
    Type: Grant
    Filed: October 23, 2006
    Date of Patent: October 5, 2010
    Assignee: International Business Machines Corporation
    Inventors: Lannie R. Bolde, James H. Covell, Mark W. Kapfhammer
  • Patent number: 7802714
    Abstract: A machine for butt welding of pipes can be used in different branches of industry and construction when welding of tubular parts having different configurations and purposes. The machine increases the accuracy of pipe alignment during clamping and reduces frictional losses by using a special mechanism for aligning and clamping the pipes being welded. The improvement makes it possible to improve the quality of welded joints, labor productivity and reliability of machine operation.
    Type: Grant
    Filed: March 11, 2009
    Date of Patent: September 28, 2010
    Assignee: E.O. Paton Electric Welding Institute of the National Academy of Sciences of Ukraine
    Inventors: Sergey I. Kuchuk-Yatsenko, Vladimir S. Kachinsky, Boris A. Galyan, Nikolay I. Koval, Alexander P. Miroshnichenko, Vadim Y. Ignatenko, Andrey N. Levchuk
  • Patent number: 7798387
    Abstract: A rotational tool retaining member unit 37 is mounted at one end portion thereof to a FSW gun body 26. The rotational tool retaining member unit 37 is provided at the other end thereof with a fitting hole 61 and a plurality of mounting passages 60 which are formed on a peripheral surface thereof such that the mounting passages 60 open on the opposite side of the one end portion and are spaced apart from each other in the circumferential direction. A mounting member unit 38 has a plurality of pin members 67. The mounting member unit 38 is mounted to the rotational tool retaining member unit 37 in such a manner that the pin members 67 are moved from the openings to the tip end portions of the mounting passages 60 and fitted thereinto. A rotational tool 33 is inserted into the mounting member unit 38. The rotational tool 33 has one end portion thereof a tie-in portion which is fitted to the fitting hole of the retaining means.
    Type: Grant
    Filed: November 21, 2008
    Date of Patent: September 21, 2010
    Assignee: Kawasaki Jukogyo Kabushiki Kaisha
    Inventors: Masato Fukushima, Kazumi Fukuhara
  • Patent number: 7780057
    Abstract: A soldering apparatus has a conveyor which conveys an electronic circuit board, a fluxer which applies a flux having water as a solvent to a surface of the electronic circuit board to be soldered, a first heating device which heats the electronic circuit board, a water removal device which removes water attached to the electronic circuit board, a second heating device which heats the electronic circuit board to maintain the electronic circuit board at a temperature at which the flux exerts its activating action, a flow soldering bath in which molten solder is attached to the electronic circuit board, and a cooler. The water removal device includes a gas blowing portion having a first jig which blows a gas to an electronic component disposition surface, and a drawing portion having a second jig which draws water from the surface to be soldered.
    Type: Grant
    Filed: December 18, 2008
    Date of Patent: August 24, 2010
    Assignee: Panasonic Corporation
    Inventors: Arata Kishi, Kimiaki Nakaya, Kenichiro Suetsugu
  • Patent number: 7766214
    Abstract: The invention provides a friction stir welding method of forming a weld portion having an excellent fatigue property in the case of welding a weld material by using a friction stir welding method. The invention provides a friction stir welding method structured such as to insert a tool provided in such a manner that a pin-shaped probe protrudes to an end surface of a columnar member to a weld material in a state of being rotated, and move the tool in a state of being rotated, thereby welding two or more weld materials in accordance with a friction stirring, in which a cavity portion is provided in a part of a weld portion of the weld material, a member is formed in the cavity portion, and the weld material is welded by the friction stirring. In accordance with the invention, since an unwelded portion is not formed near the cavity portion, a notch effect is reduced, and it is possible to form the weld member which is excellent in the fatigue property.
    Type: Grant
    Filed: January 19, 2007
    Date of Patent: August 3, 2010
    Assignee: Hitachi, Ltd.
    Inventors: Seung Hwan Park, Satoshi Hirano
  • Patent number: 7757927
    Abstract: Two structural components, such as a gas turbine rotor hub and a rotor blade, are integrally joined to each other by friction welding, particularly linear friction welding. For this purpose, each component is provided with a joining surface and at least one of the two components is provided with a groove next to the respective joining surface. The groove extends fully or partly around the respective joining surface and serves for reducing stress in a normal and radial direction of the respective joining surface, whereby a more uniform heating of the joining zone is achieved and joining faults are avoided or at least reduced during the friction welding.
    Type: Grant
    Filed: June 8, 2006
    Date of Patent: July 20, 2010
    Assignee: MTU Aero Engines GmbH
    Inventor: Joachim Bamberg
  • Patent number: 7754141
    Abstract: Disclosed is a method for manufacturing an ultrasonic horn for transporting ultrasonic energy to an operating location.
    Type: Grant
    Filed: January 21, 2009
    Date of Patent: July 13, 2010
    Assignee: Kimberly-Clark Worldwide, Inc.
    Inventor: Norman R. Stegelmann
  • Patent number: 7745757
    Abstract: A welding apparatus is provided for carrying a welding gun across or past a surface for making welds. The apparatus may include one or more rolling components, such as wheels for example, that do not substantially plastically deform as a result of contacting or being in close proximity to recently completed welds or preheated joints and provide adequate traction to move the apparatus across or past the surface. A portion of the contact surface of the rolling component may be configured with a given surface roughness to provide sufficient traction.
    Type: Grant
    Filed: September 11, 2006
    Date of Patent: June 29, 2010
    Assignee: Lincoln Global, Inc.
    Inventors: Edward A. Enyedy, Jeff Klein