Abstract: A method of determining a trajectory of an arc motion of a wire used in the formation of a wire loop is provided. The arc motion is between a first point and a second point of the trajectory. The method includes: (1) defining a pivot point with respect to the first point and the second point; (2) determining a plurality of data points for generating the trajectory, each of the data points including a radius value and an angle value as a function of time, each of the angle values being between (a) a first angle defined by the pivot point and the first point, and (b) a second angle defined by the pivot point and the second point; and (3) converting the plurality of data points into trajectory data that may be used by a wire bonding machine.

Abstract: The present invention relates to a device and method for brazing a heat pipe assembly with copper-silver alloy filler rings to improve heat dissipation efficiency of a heat pipe. The device comprises a brazing furnace and a conveyor. The brazing furnace comprises an open ended passage with a multi-stage brazing heater and cooler. The conveyor comprises an input bracket assembly, an output bracket assembly and a steel mesh belt. The method comprises steps of (A) providing multiple heat pipe components, (B) assembling the heat pipe components to form heat pipe assemblies, (C) injecting mixed gas, (D) turning on the multi-stage brazing heater and cooler, (E) placing the heat pipe assemblies on the conveyor, (F) brazing the heat pipe assemblies to form heat pipes, (G) cooling the heat pipes and (H) removing the heat pipes from the conveyor.

Abstract: Provided is a method and apparatus for mounting a plurality of electronic components. The method comprises mounting a first electronic component on a substrate; forming a mask on the substrate to expose the first electronic component and a region of the substrate on which a solder paste is to be applied; forming a guide on a portion of the mask disposed around the first electronic component; applying the solder paste onto the substrate by using a squeezer contacting a portion of the mask disposed around the region of the substrate on which the solder paste is to be applied; removing the guide and the mask; and mounting a second electronic component on the solder paste.

Abstract: A bond head assembly for use with a bonding machine includes a wire bonding tool and a link mechanism coupled between the wire bonding tool and the wire bonding machine. The link mechanism includes a frame, a plurality of arm links pivotably connected to the frame, and a tool support member supporting the wire bonding tool and pivotably connected to each of the arm links.

Abstract: The invention is a welding tool used in a friction-stir welding apparatus for welding a plurality of members to be welded. The welding tool includes: a tool holder having a front end and a base end, the base end being held by the friction-stir welding apparatus so as to be driven to rotate and move by the friction-stir welding apparatus; and a welding unit of a wear resistant material adapted to be removably mounted on the front end of the tool holder, the welding unit mounted on the front end of the tool holder being immersed into a part of the members to be welded during a friction-stir welding.

Abstract: Some embodiments include an apparatus comprising a spray head to spray a substrate, the substrate having a region to be sprayed and a region to be masked, the two regions separated by a boundary, and a mask having channels, the mask located between the spray head and the substrate. In an embodiment, the mask further has a lip to prevent flux overspray from falling onto a substrate below. In an embodiment, flux overspray removal is assisted with a vacuum system. Other embodiments are described and claimed.

Abstract: A wire bonding machine includes (1) a support structure for supporting a work piece and (2) a pre-heat structure for supporting the work piece during a pre-heat operation. The pre-heat structure is moveable with respect to the support structure.

Abstract: An integrated circuit is wire bonded in a manner such that there is consistent RF performance from integrated circuit package to integrated circuit package. Bond distances within the integrated circuit are measured, each corresponding to a wire bond to be formed. An area under a hypothetical wire bond profile is calculated as a function of the bond distances, a baseline wire length, and a baseline loop height. A wire is bonded across a given one of the bond distances to form a given one of the wire bonds. A wire bond profile for the given wire bond is provided having an area thereunder that is substantially equal to the calculated area.

Abstract: A method for joining component bodies of material over bonding regions of large dimensions by disposing a plurality of substantially contiguous sheets of reactive composite materials between the bodies and adjacent sheets of fusible material. The contiguous sheets of the reactive composite material are operatively connected by an ignitable bridging material so that an igniting reaction in one sheet will cause an igniting reaction in the other. An application of uniform pressure and an ignition of one or more of the contiguous sheets of reactive composite material causes an exothermic thermal reaction to propagate through the bonding region, fusing any adjacent sheets of fusible material and forming a bond between the component bodies.

Abstract: A method for bonding two components together including the steps of providing a first component, providing a second component, and locating a first eutectic bonding material between the first and second component. The first eutectic bonding material includes at least one of germanium, tin, or silicon. The method further includes the step of locating a second eutectic bonding material between the first and second component and adjacent to the first eutectic bonding material. The second eutectic bonding material includes gold. The method further includes the step of heating the first and second eutectic bonding materials to a temperature above a eutectic temperature of an alloy of the first and second eutectic bonding materials to allow a hypoeutectic alloy to form out of the first and second eutectic bonding materials. The method includes the further step of cooling the hypoeutectic alloy to form a solid solution alloy bonding the first and second components together.

Abstract: Welding wire feeders are disclosed for providing welding wire and electrical power to a welding torch in a welding system, in which an input is provided including an input connector integrated into a switching device of the wire feeder or coupled thereto directly or through a short cable. The input connector includes a cavity to receive wire from a power source cable with a clamping device being provided for selectively clamping the cable wire to the connector or releasing the wire therefrom using only simple tools.

Abstract: An improved placing method and placing apparatus are provided for placing conductive balls in a predetermined pattern onto a base unit. In the placing method for placing balls having conductivity in a predetermined pattern onto one surface of the base unit, an arrangement member has one surface, another surface opposite to the one surface of the arrangement member and positioning openings, wherein the positioning openings are arranged corresponding to the pattern such that the openings are through from the one surface to the another surfaces of the arrangement member so that the balls are inserted therein. The another surface of the arrangement member is positioned opposite to the one surface of the base unit. The arrangement member has two or more line members of which the core axes are substantially aligned.

Abstract: The invention concerns a method for mounting a semiconductor chip with bumps on one surface onto a substrate location of a substrate, whereby the bumps are brought into contact with corresponding pads on the substrate location. Reference marks are attached to the bondhead that enable measurement of the actual position of the semiconductor chip as well as measurement of the actual position of the substrate location in relation to a system of coordinates defined by the reference marks. Positional displacement of the individual components of the assembly machine caused by thermal influences can be compensated without perpetual calibration procedures having to be carried out.

Abstract: The disclosed method & apparatus are for forming a fluid connection or tap through the wall of a pipeline, particularly intended for “hot tapping” of subsea pipelines. The method comprises fitting a connecting piece having a mounting surface which extends around the tap location and at least partially over the tap location and a connecting wall (2h) which surrounds the tap location to provide an opening adapted for subsequent connection of a conduit to complete a fluid connection. The connecting piece is bonded to the pipeline by friction stitch welding performed inside said opening. The material at the tap location is removed (AC indicates after cutting) to define an aperture and provide said fluid connection surrounded closely by the weld between the connecting piece and the wall.

Abstract: Resin-impregnated carbon fiber composites containing metal inserts. Carbon fibers or a carbon fiber preform are bonded to a metal structural member. Once the carbon fiber-metal bond is established, the fiber-metal assembly or hybrid preform is impregnated with resin, to form an article in which bonding between the metal structural member and the composite remainder of the article is greatly enhanced. In a process embodiment, a metal insert, e.g. a steel insert, is provided in contact with particulate carbide-forming metal, e.g. titanium, and with carbon fiber segments. Then an electric current is passed through the carbide-forming metal particles and carbon fibers to heat them to a temperature above the melting point of the carbide-forming metal. This initiates an exothermic reaction, which forms liquid phase metal carbide. Subsequently the liquid phase metal carbide is cooled and solidified, thereby bonding the carbon fiber segments to the metal insert.

Abstract: An apparatus for selective rework for surface mount components. A shield assembly encloses a circuit board on which Surface Mount Technology (SMT) modules are soldered. The shield assembly includes a top shield member having an opening over an SMT module to be removed from the circuit board, and a bottom shield member having an opening exposing the solder mount of the SMT module to be removed. An intermediate shield member is located in the opening in the top shield member and extends through the opening to the circuit board and surrounds the SMT module to be removed. A spring loaded mechanism is positioned over the intermediate shield member and grips the SMT module to be removed. The spring loaded mechanism applies removal force for removing the SMT module from the circuit board when heat is applied causing the solder holding the SMT module to the circuit board to reflow.

Abstract: A friction stir welding apparatus (120) brings end faces (1, 2) of a plate material (W1), having fingers (7a through 7d) at corners thereof, into abutment against each other to form a hollow cylindrical body (W2), and friction-stir-welds the end faces (1, 2) to each other. The apparatus includes a base (122), a first support device and second support device which are mounted on the base (122), a support core (32) spaced from the base (122) by the first support device and the second support device, for insertion into the hollow cylindrical body (W2) and for supporting the hollow cylindrical body (W2), and a first gripping member (238) and a second gripping member (268) disposed on the support core (32) for gripping respective protrusions (8, 9), which are formed when the fingers (7a through 7d) are held in abutment against opposite ends of abutting regions of the hollow cylindrical body (W2), and which extend along a joining direction.

Abstract: A conveyor for guiding and conveying a plurality of sheet-shaped thin plates in rows arranged side by side to a welding position at which ends of the adjacent thin plates are butted and welded to each other, includes a plurality of conveying paths, which are adjacent to each other, having different conveying surfaces which are placed on a same horizontal plane, and a guide unit disposed between the adjacent two conveying paths for guiding the thin plates on one of the conveying paths with respect to another one thereof toward the welding position. Each of the conveying paths is composed of a plurality conveying rollers, and the guide unit includes guide rollers each having a guide surface for guiding the thin plate on the one of the conveying paths in a state that the thin plate on the one conveying path is partially depressed with respect to the another one of the conveying path.

Abstract: The present invention is directed to a pipe section and a connector that are adapted to be welded together, wherein each of the pipe and connector have inner and outer beveled surfaces and the joint is comprised of an angular alignment land. In one embodiment, an outer beveled surface on the pipe and an inner beveled surface on the connector cooperate to define the angular alignment land. In yet another illustrative embodiment, the inner beveled surface of the connector and the outer beveled surface of the pipe have a bevel angle of approximately 30 degrees, while the outer beveled surface of the connector and the inner beveled surface of the pipe have a beveled angle of approximately 45 degrees.

Abstract: The present invention provides a device to weld metallic elements. The device is an endothermic connector that comprises a chassis that is assembled by joining two equal halves around the end of a metallic rod with an assembling nut and a pressure nut. The chassis also accommodates a metallic cable, on contact with the metallic rod's end, with an external adapter that adjusts to the chassis with a third nut. The third nut, in the cavity defined by its internal diameter, houses the inferior part of a portable unit that contains a detonator and a mixture of an explosive powder with electrolytic metal particles. The ignition of the explosive powder increases the temperature, melting the metal particles, which in liquid state, migrate to the chassis' intermediate portion, wherein, as they solidify, weld the rod's end with the cable.