Patents Examined by Michael Datskovsky
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Patent number: 6850410Abstract: Described is an Advanced Technology Attachment (ATA) disk drive module for use in a data storage system having an enclosure with slots constructed to receive Fibre Channel disk drive modules. The ATA disk drive module comprises an ATA disk drive, an adapter board connected to the ATA disk drive, and a carrier assembly including spaced apart carrier sleds mounted to the ATA disk drive and to the adapter board. The spaced apart carrier sleds have mechanical dimensions that enable the carrier assembly to slide into an enclosure slot constructed to receive a Fibre Channel disk drive module. The adapter board provides an electrical interface and a mechanical interface between the ATA disk drive and a midplane of the enclosure when the carrier assembly is inserted in the enclosure slot and the ATA disk drive module is plugged into the midplane.Type: GrantFiled: March 27, 2003Date of Patent: February 1, 2005Assignee: EMC CorporationInventors: Douglas E. Peeke, C. Ilhan Gundogan, Matthew Borsini, Maida Boudreau
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Patent number: 6847523Abstract: A computer system having electronic components housed in a central unit having a protective enclosure and a cover. The cover is moveable to provide access to electronic components housed in the central unit. The cover allows access to certain electronic components and prevents access to other electronic components.Type: GrantFiled: September 17, 2002Date of Patent: January 25, 2005Assignee: Hewlett-Packard Development, L.P.Inventors: Kenneth B. Frame, Gregory C. Franke
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Patent number: 6847521Abstract: An information handling system includes a first module including first alignment members and a second module including second alignment members for engagement with the first alignment members. A PCB is retained on the first module to provide a structural member for the first module, to maintain dimensional accuracy of the first module, and to accurately position the first alignment members for alignment with the second alignment members.Type: GrantFiled: January 3, 2003Date of Patent: January 25, 2005Assignee: Dell Products L.P.Inventors: Christopher Beall, Laurent A. Regimbal
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Patent number: 6845014Abstract: An add-on cartridge structure for electronic devices having a housing formed from upper and lower case sections. The upper case is typically made from plastic and has a conductive layer formed on inside surfaces, while the lower case is made from a metallic material such as aluminum. A wall-like mating member is disposed on an outer edge of the lower case, and mates with the sides of the upper case to form a nearly rectangular cross section housing. The double conductive layer formed by the outside surface of the mating member and the inside surface of the upper case prevents leakage of electromagnetic radiation from the cartridge. Furthermore, high frequency noise is prevented by grounding both the signal ground of the printed circuit board and the frame ground at multiple locations. The conductive layer has a surface break caused by a through-hole through which the printed circuit board plug protrudes to the outside.Type: GrantFiled: December 3, 2003Date of Patent: January 18, 2005Assignee: Seiko Epson CorporationInventors: Kenichi Wakabayashi, Chitoshi Takayama, Tadashi Shiozaki
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Patent number: 6836409Abstract: A device for dissipating heat produced by circuitry such as the circuitry associated with an optical transponder includes a plurality of heat dissipating regions. Each heat dissipating region includes a heat sink that is thermally coupled with at least one component. Each heat sink is at least partially thermally isolated from other heat sinks to mitigate heat flow from high-power components to heat sensitive components. Further, all of the heat sinks associated with the circuit package are electrically coupled to provide electromagnetic shielding. A thermally insulative and electrically conductive gasket is employed to couple adjacent heat sinks.Type: GrantFiled: May 1, 2003Date of Patent: December 28, 2004Assignee: Nortel Networks LimitedInventors: Guy A. Duxbury, Balwantrei V. Mistry, Donald J. Lentz
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Patent number: 6833993Abstract: A multichip package mainly includes a substrate, a first chip disposed on the lower surface of the substrate by flip-chip bonding, at least one second chip and a heat spreader disposed on the upper surface of the substrate. A plurality of solder balls are formed at the periphery of the first chip on the lower surface of the substrate wherein the solder balls electrically connected to the first chip or the second chip.Type: GrantFiled: March 3, 2003Date of Patent: December 21, 2004Assignee: Advanced Semiconductor Engineering, Inc.Inventor: Meng Jen Wang
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Patent number: 6831838Abstract: A system and method for attaching multiple electrical components to a heat sink is disclosed. The apparatus includes a pair of spacers for each component. The spacers define a uniform distance between a circuit board and a base of a heat sink. Each spacer is secured to the circuit board and determines a distance from a base of the component to the circuit board. The heat sink is attached to the assembly by a plurality of threaded fasteners that extend through the circuit board, through a center space of the spacers and into threaded recesses of the heat sink.Type: GrantFiled: May 14, 2003Date of Patent: December 14, 2004Assignee: Illinois Tool Works Inc.Inventor: Martin J. Boyce
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Patent number: 6831836Abstract: A heat sink comprises a side including a structural member defining a distance between a heat generating structure and the second side of the heat sink.Type: GrantFiled: February 25, 2003Date of Patent: December 14, 2004Assignee: Intel CorporationInventors: Rakesh Bhatia, Eric DiStefano
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Patent number: 6826040Abstract: A laptop computer includes a liquid crystal display (LCD) device and a host. The host has a cover and a base that snap fit with each other. The LCD device is pivotally connected to the base by a hinge. The host is easily maintained or upgraded without disassembling the LCD device, and can be directly tested after having been maintained or upgraded.Type: GrantFiled: December 23, 2002Date of Patent: November 30, 2004Assignee: First International Computer Inc.Inventor: Cheng Hsien Wang
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Patent number: 6826047Abstract: A cool air-supplying device for a computer system. The computer system includes a computer apparatus and the computer apparatus includes a housing. The cool air-supplying device includes a casing connected to the housing of the computer system. The casing has an intake vent for receiving air and an outlet vent for outputting air. The cool air-supplying device further includes a thermoelectric cooler for cooling refrigerantwithin a heat pipe, the heat pipe installed inside the casing for transferring refrigerant cooled by the thermoelectric cooler to the outlet vent. A first fan installed at one end of the heat pipe transfers air cooled by the heat pipe to the housing of the computer system via the outlet vent.Type: GrantFiled: May 15, 2003Date of Patent: November 30, 2004Assignee: Uniwill Computer CorporationInventors: Yu Chen, Wen-Shiang Hung, Chih-Hsien Chen, Young-Kwang Sheu
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Patent number: 6826056Abstract: Systems for mounting data storage devices to a chassises are provided. A representative system includes a filler carrier that incorporates a bezel. The bezel including a first snap configured to move between a latched position and an unlatched position. In the latched position, the snap facilitates secure mounting of the filler carrier to a chassis by forming an interference fit with the chassis. In the unlatched position, the snap facilitates removal of the filler carrier from the chassis. The bezel of the filler carrier can be formed as a monolithic structure. Other systems and devices also are provided.Type: GrantFiled: June 4, 2003Date of Patent: November 30, 2004Assignee: Hewlett-Packard Development Company, L.P.Inventors: Brian S. Tsuyuki, Pete Capano, Darrel W. Poulter, Herbert J. Tanzer
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Patent number: 6822858Abstract: A disk drive mounting system for isolating a disk drive assembly from machine vibration and shock. In one embodiment, the system includes a suspension frame and a disk drive assembly mounted to the frame using biased vibration isolation members, such as springs, which are each substantially aligned through the center of mass of the disk drive assembly. Accordingly, vibrational forces can be transmitted through the center of mass of the disk drive assembly. Preferably, the disk drive assembly includes a mounting chassis which holds a hard disk drive and includes openings through which damping bumpers can extend. In this embodiment, the bumpers each have a base portion and an extension portion, the extension portion extending through the openings in the mounting chassis to limit the transfer of shock to the disk drive. The bumpers can be attached to the suspension frame and/or to a protective cover for the assembly.Type: GrantFiled: June 26, 2002Date of Patent: November 23, 2004Assignee: Siemens Energy & Automation, Inc.Inventors: Thomas L. Allgeyer, James J. Kemp, Clifford A. Leighty, Jeff J. Noe
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Patent number: 6822854Abstract: A keyboard comprising a left and a right keyboard portion which are intended to be operated on a respective operation side by a left hand and right hand, respectively, wherein the operation side (7, 8) of each keyboard portion (5, 6) includes an angle in the range of about 60-150 degrees with a horizontal plane, the keyboard (1) being provided with left and right supporting means (13, 14; 15) for supporting the left and right hand, respectively, during operation of the respective keyboard portion (5, 6), the supporting means (13, 14; 15) being arranged to permit during use a substantially horizontal displacement of the hands supported thereon relative to the respective keyboard portion (5, 6).Type: GrantFiled: July 17, 2002Date of Patent: November 23, 2004Inventors: Johannes Wilhelmus Paulus Te Maarssen, Vineet Shankar
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Patent number: 6822868Abstract: A heat sink with integrated electronics having a cavity with one or more facing sides. Hybrid circuits are housed in the cavities. A bottom portion seals the housing and has a row of pins is provided for interconnecting the circuits housed in the separate cavities to an external device, thereby allowing the integration of different types of circuits in a single, fully enclosed, yet partitioned, housing.Type: GrantFiled: February 26, 2002Date of Patent: November 23, 2004Assignee: Delphi Technologies, Inc.Inventors: David P. Buehler, Daniel A. Lawlyes
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Patent number: 6822861Abstract: An active cooling system for the CPU of a computer having computer slots and motherboard, the cooling system including a card arranged to sit in a computer slot coupled to the motherboard and powered directly from mains via the computer slot, the card including a hot air outlet passage from inside the computer to outside the computer; a cooling-CPU unit including a thermoelectric component (TEC) couplable to mains for power supply, a cold side heat sink coupled to the TEC and in thermally conductive contact with a part of the CPU, a hot side heat sink coupled to the TEC, and a fan distanced from the hot side heat sink for pulling heated air from the hot side heat sink.Type: GrantFiled: November 19, 2002Date of Patent: November 23, 2004Assignee: Active Cool Ltd.Inventor: Ronen Meir
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Patent number: 6822866Abstract: An AC drive which can be applied to any power using device and in particular is a medium voltage AC drive. In a preferred embodiment, a multilevel AC drive topology is implemented, with the drive including a plurality of inverters and converter electrically coupled through electrical buses and physically coupled through their respective modular bases, and sharing a common cooling system connected to the respective heat exchangers of each component. The AC drive generally is made up of a plurality of inverter modules, which are connected to a converter module, and with each of the above components packaged in a relatively small unit having a cooling apparatus.Type: GrantFiled: November 2, 2001Date of Patent: November 23, 2004Assignee: SMC Electrical Products Inc.Inventors: Oliver Fearing, Geraldo Nojima, Lyle T. Keister
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Patent number: 6819551Abstract: A computer enclosure includes a base (10), and a hood (20) pivotably attached to the base. The base includes a bottom wall (12), and a pair of side walls (14) extending from the bottom wall. A pair of posts (120) extends upwardly from front corners of the bottom wall. Each post defines a guiding groove (124) therein. The hood includes a top cover (22), a pair of side panels (24) extending from the top cover, and a pair of pivot mechanisms (28). Each pivot mechanism includes a pivot pin (286) movably received in the guiding groove of the corresponding post.Type: GrantFiled: April 22, 2002Date of Patent: November 16, 2004Assignee: Hon Hai Precision Ind. Co., Ltd.Inventor: Yun-Lung Chen
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Patent number: 6819554Abstract: The present invention can be embodied as a case for securing a notebook computer with video display to a vehicle center hump in a position for viewing. The case comprises a containing enclosure having a top part, a bottom part, and a surrounding sidewall configured to contain the notebook computer. A plurality of straps are coupled at one end to opposing side locations of the case, and include an anchoring member at an opposing end of each of the plurality of straps for anchoring the case in a stable position at the center hump, such that the notebook computer may be removably secured within the case in a position for viewing the video display.Type: GrantFiled: November 13, 2002Date of Patent: November 16, 2004Assignee: Hewlett-Packard Development Company, L.P.Inventor: James J. Juneau
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Patent number: 6816375Abstract: A new heat sink apparatus and method that simplify the assembly of the heat sink and thermal stud. The new heat sink assembly uses a spring retainer that, in most cases, can use existing socket mounting screws. A spring clip presses a thermal stud against the back of an electrical device package. The present invention is especially useful for attaching a spatial light modulator to a printed circuit board since it provides a simple, reliable heat sink without blocking the light path to and from the device.Type: GrantFiled: August 1, 2002Date of Patent: November 9, 2004Assignee: Texas Instruments IncorporatedInventor: Satyan Kalyandurg
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Patent number: 6816372Abstract: A method, system, and apparatus are disclosed for handling fluid flow in a computer system for suppressing noise and heat, and, in addition, for enhancing external cable management for use with the computer system.Type: GrantFiled: January 8, 2003Date of Patent: November 9, 2004Assignee: International Business Machines CorporationInventors: Cary Michael Huettner, Jeffrey L. Justin, Michael Desmond O'Connell, Kenneth Robert Peters, Gregory Scott Vande Corput