Abstract: A fluorine-containing epoxy resin for an electronic component represented by the following formula (E) wherein n is an integer of 0 or greater, an average value of n is 0.18 or smaller, and M is a group represented by the following formula (E1), a group represented by the following formula (E2), or a group represented by the following formula (E3) wherein Z is hydrogen or a C2-C10 fluoroalkyl group. The formula (E) being: the formula (E1) being: the formula (E2) being: the formula (E3) being: Also disclosed is a method for producing the fluorine-containing epoxy resin as well as a curable composition containing the fluorine-containing epoxy resin and a curing agent.

Abstract: A binder composition includes an epoxidized vegetable oil or a derivative thereof having an epoxy group content of 1 to 12 weight percent, based on the total weight of the epoxidized vegetable oil; a carboxyl-functionalized resin; and a liquid reactive diluent. A combined acid value of the carboxyl-functionalized resin and the liquid reactive diluent is 50 to 500. Uses of the binder composition, for example in composites, coatings, elastomer formulations, and adhesives are also disclosed.

Abstract: Provided is a curative part usable in a two-part curable composition. The curative part includes a liquid amine; a heterogeneous dispersant; and core-shell rubber particles having an elastomeric core and a (meth)acrylic shell. The core-shell rubber particles and the heterogeneous dispersant can be collectively shear-dispersed in the liquid amine such that the core-shell rubber particles are substantially non-aggregated and the curative part is phase-stable over a period of at least 3 months at ambient temperature. Advantageously, large amounts of core-shell rubber particles can thus be incorporated into a cured resin matrix, which can afford significantly enhanced impact performance.

Abstract: Disclosed herein is an adhesive composition comprising: an epoxy-containing component; and a blocked polyisocyanate curing agent comprising a blocking group derived from a blocking agent comprising an alpha-hydroxy amide, ester, or thioester, or a combination thereof. Also disclosed are methods for forming a bonded substrate with the adhesive composition. Also disclosed is an article comprising first and second substrates and the adhesive composition.

Abstract: The present invention relates to a template for a positioning, fixation, mobilization or immobilization device, wherein the template comprises a sheet of a thermoplastic material, wherein the thermoplastic material comprises between 3.0 and 95.0 wt. % of a poly-?-caprolactone polymer, preferably a poly-?-caprolactone homopolymer, and at least 5.0 wt. % of at least one second polymer material with a melting temperature of between 40 and 85° C., wherein the at least one second polymer material is selected from the group of one or more of a polyalkenamer or a thermoplastic linear polyurethane which contains as a polyol a poly ?-caprolactone or a polyester polyol, wherein the poly-?-caprolactone polymer and the second thermoplastic material are cross-linked.

Abstract: A binder used for manufacturing a composite product is prepared by combining i) Maillard reactants selected from: reducing sugar reactant(s) and nitrogen-containing reactant(s); curable reaction product(s) of reducing sugar reactant(s) and nitrogen-containing reactant(s); and combinations thereof; and ii) a resin; reactants of a resin; and combinations thereof.

Abstract: Provided is hollow resin particles having higher compressive strength and more excellent heat insulating properties and heat resistance than before. The hollow resin particles each having one or two or more hollow portions, wherein a number average particle diameter is from 0.1 ?m to 9.0 ?m, a void ratio is from 70% to 99%, and an amount of the volatile organic compound contained is 5% by mass or less.

Abstract: An epoxy resin, comprising an epoxy compound having two or more mesogenic structures, and having a loss tangent of 1 or more at 35° C. before curing.

Abstract: An insulation system of a current-carrying conductor of an electric machine. The insulation system comprises a thermally curable resin including a polymer resin matrix and a nanoparticulate filler. A mica paper or mica tape is impregnated with the thermally curable resin. The thermally curable resin comprises nanoparticulate filler, the total quantity of nanoparticulate filler being at least 0.1 wt % and not more than 0.5 wt %.

Abstract: A cured product of a resin composition according to the present invention includes at least silsesquioxane. When the average thermal expansion coefficient of the cured product at 30 to 200° C. is expressed as ?1 [K?1], at least one of requirements ?1/?2?10 and (?1??2)2×108?0.4 is satisfied, where a reference value ?2 is 350×10?6 [K?1] or less. In the cured product, an absorbance derived from a siloxane bond, an absorbance derived from a hydrocarbon group, and an absorbance derived from a hydroxy group are respectively expressed as Ia, Ib, and Ic, the absorbances being determined by attenuated total reflection using a Fourier transform infrared spectrophotometer. In this case, requirements 0.09?Ia/Ib?3.0 and 0.04?Ic/Ib?1.0 are satisfied.

Abstract: The invention provides a method of improving the corrosion resistance of a metal substrate. The method comprises: (a) electrophoretically depositing on the substrate a curable electrodepositable coating composition to form a coating over at least a portion of the substrate, and (b) heating the substrate to a temperature and for a time sufficient to cure the coating on the substrate. The electrodepositable coating composition comprises a resinous phase dispersed in an aqueous medium, the resinous phase comprising: (1) an ungelled active hydrogen-containing, cationic salt group-containing resin electrodepositable on a cathode; (2) an at least partially blocked polyisocyanate curing agent; and (3) a pigment component comprising an inorganic, platelike pigment having an average equivalent spherical diameter of at least 0.2 microns. The electrodepositable coating composition demonstrates a pigment-to-binder ratio of at least 0.5. The coating composition contains less than 8 percent by weight of a grind vehicle.

Abstract: Described herein is a 2K solvent borne coating system. The coating system includes an epoxy component (A), including: i) an epoxy resin; ii)—a solvent; iii)—at least one compound of formula (I): [(ER)x(R?O)y(HO)z(R?)t(SiO(4-x-y-z-t)]m??(I) and/or oligomer or polymer compounds of the compound of formula (I), and iv)—optionally, at least one non-catalytic additive; and an acid resin component (B), including: an carboxylic acid resin; a solvent; optionally, at least one catalyst; and optionally, at least one additive. Also described herein are a 2K coating composition, a method to coat an automotive substrate with the composition, and a scratch and mar resistant coated surface of the 2K coating composition.

Abstract: The present application discloses a composition, an adhesive film including the composition and a chip packaging structure. The composition includes epoxy resin, a surfactant, a curing agent and filler, wherein the surfactant is selected from a modified hexafluoropropylene compound. The surfactant in the composition is the modified hexafluoropropylene compound, the modified hexafluoropropylene compound is lower in surface energy, good in water resistance and oil resistance and capable of effectively lowering the surface tension of the composition, and therefore, when being used for preparing the adhesive film, the composition is higher in coating wettability. In, addition, the composition has stronger chemical cleaning resistance, and in a process that a residual solder flux obtained in a soldering process of a chip is cleaned, a chip protection film prepared from the composition has stronger cleaning resistance to an alkaline solution so as not to be easy to fall off.

Abstract: An ultraviolet (UV)-resistant nanocomposite coating may include a polyaniline (PANI)/graphene oxide (GO) nanocomposite. The PANI/GO nanocomposite may include GO nanosheets that may be coated with PANI. The PANI/GO nanocomposite may be dispersed into a binding matrix.

Abstract: This invention relates to a two-part epoxy based composition, comprising a first part comprising at least one epoxy resin; a second part comprising at least one epoxy resin curing agent, and at least one acrylamide compound containing a hydrogen atom bound to the nitrogen atom in the acrylamide structure. The two-part epoxy based composition according to the present invention exhibits excellent adhesion strength to low surface tension substrates, such as stainless steel and PVC.

Abstract: Non-woven fiberglass veils, and laminates made therefrom, comprising: a plurality of glass fibers; a resin component; a fire-retardant component; and a particulate component, the particulate component comprising inorganic particles having a refractive index higher than a refractive index of the fire-retardant component and an average particle size of from about 0.1 to about 0.5 ?m; wherein the fire-retardant component and the particulate component are present in a combined amount of from about 50% to about 90% by weight, based on the total weight of the veil, and wherein the fire-retardant component and the particulate component are present in a ratio by weight of from about 95:5 to about 50:50; are described.

Abstract: The present application relates to a high refractive-index composition, a high refractive-index film and a method for producing a high refractive-index film. The present application provides a composition that a high refractive-index film can be produced with a simple coating process and low cost, and a high refractive-index film having a uniform thickness and easy thickness control or molding, as well as having high chemical stability and easy control of physical properties such as transparency or heat resistance, can be produced, a high refractive-index film using the same and a method for producing a high refractive-index film.

Abstract: Solvent free epoxy system that includes: a hardener compound H comprising: a molecular structure (Y1—R1—Y2), wherein R1 is an ionic moiety Y1 is a nucleophilic group and Y2 nucleophilic group; and an ionic moiety A acting as a counter ion to R1; and an epoxy compound E comprising: a molecular structure (Z1—R2—Z2), wherein R2 is an ionic moiety, Z1 comprises an epoxide group, and Z2 comprises an epoxide group; and an ionic moiety B acting as a counter ion to R2. In embodiments, the epoxy compound E and/or the hardener H is comprised in a solvent-less ionic liquid. The systems can further include accelerators, crosslinkers, plasticizers, inhibitors, ionic hydrophobic and/or super-hydrophobic compounds, ionic hydrophilic compounds, ionic transitional hydrophobic/hydrophilic compounds, biological active compounds, and/or plasticizer compounds. Polymers made from the disclosed epoxy systems and their methods of used.

Abstract: Provided are a photosensitive resin composition in which the progress of cyclization reaction is fast and storage stability over time is excellent, a heterocyclic ring-containing polymer precursor, a cured film, a laminate, a method for producing a cured film, and a semiconductor device, using the photosensitive resin composition. The photosensitive resin composition includes a heterocyclic ring-containing polymer precursor selected from a polyimide precursor and a polybenzoxazole precursor, and a solvent, in which a solid content of the photosensitive resin composition has an amine value of 0.0002 to 0.0200 mmol/g.

Abstract: The invention provides resin- and mineral oil-free pressure-sensitive adhesive compositions, comprising 55%-100% by weight of a copolymer of propylene and one or more further monomers selected from the group composed of ethylene and 1-olefins having 4 to 20 carbon atoms, wherein the copolymer has been prepared with the aid of metallocene catalysts and is characterized by a. a melt viscosity at 170° C. of 20 to 8000 mPas (DIN 53019); b. a density of 0.84 to 0.90 g/cm3 (23° C., ISO 1183); c. a glass transition temperature of less than ?30° C. (DIN EN ISO 11357-2:2014); and d. a flow point, measured according to ASTM D97, of less than 50° C., which due to their permanently tacky properties are suitable as pressure-activated pressure-sensitive adhesives.