Patents Examined by Michael J. Feely
-
Patent number: 11732083Abstract: A polyisocyanate resin can include from 25 wt % to 50 wt % of a first cycloaliphatic polyisocyanate and from 50 wt % to 75 wt % of a flexibilizing component based on a total weight of the polyisocyanate resin. The first cycloaliphatic polyisocyanate can have an NCO % of from 12 wt % to 20 wt % based on ISO 11909:2007. The flexibilizing component can include a linear aliphatic polyisocyanate having a number average isocyanate functionality of from 2 to 3 based on gel permeation chromatography and an isocyanate-terminated reaction product of a second cycloaliphatic polyisocyanate and an isocyanate-reactive material, the reaction product having a Tg of less than ?30° C. based on a Differential Scanning Calorimetry (2nd Heating) temperature scan from ?100° C. to 150° C. using 20° C./min heating and cooling ramps. The isocyanate-terminated reaction product and the linear aliphatic polyisocyanate can be present at a weight ratio of from 0.5 to 2.5.Type: GrantFiled: November 19, 2020Date of Patent: August 22, 2023Assignee: Covestro LLCInventors: Kurt E. Best, Daniel P. Wang, Joseph Kleer
-
Patent number: 11732125Abstract: Disclosed herein is a composition comprising: an epoxy-containing component, elastomeric particles in an amount of greater than 11% by weight to 25% by weight based on total weight of the composition; and a curing component activatable by an external energy source, the curing component comprising at least one guanidine having a D90 particle size of 25 ?m measured by dynamic light scattering. Also disclosed is the composition in an at least partially cured state. Also disclosed is a method for treating a substrate comprising applying the composition to a surface of a substrate; and applying an external energy source to cure the composition. Also disclosed are substrates comprising the composition. Also disclosed are substrates formed by the method of the present invention.Type: GrantFiled: December 10, 2018Date of Patent: August 22, 2023Assignee: PPG Industries Ohio, Inc.Inventors: Marvin M. Pollum, Jr., Joseph P. Kriley, Masayuki Nakajima, Ljiljana Maksimovic, Brian K. Rearick, Adam B. Powell, David J. Fortman, Loubna Pagnotti
-
Patent number: 11732154Abstract: The present invention provides a coating composition capable of forming a coating film having a good appearance and design of a coating film and having coating film properties such as scratch resistance with a good balance. Furthermore, the present invention provides a method for forming a multilayer coating film including forming a coating film using the coating composition of the present invention.Type: GrantFiled: November 30, 2018Date of Patent: August 22, 2023Assignee: NIPPON PAINT AUTOMOTIVE COATINGS CO., LTD.Inventors: Yasunori Miwa, Takuhiro Kakii, Takanori Inazumi, Katsumi Mizuguchi, Hiroshi Iida, Takuma Okada
-
Patent number: 11732085Abstract: A flame retardant epoxy resin composition for preparing a flame retardant fiber composite including: (a) at least one epoxy resin; (b) at least one flame retardant agent for improving the flammability performance of carbon fiber-reinforced epoxy composites; (c) at least one mold release agent; (d) at least one curing agent; and (e) at least one catalyst; a prepreg prepared using the above epoxy resin composition; and a flame retardant fiber composite prepared using the above prepreg.Type: GrantFiled: January 29, 2020Date of Patent: August 22, 2023Assignee: Dow Global Technologies LLCInventors: Bharati Balijepalli, David H. Bank, Michael A. Lowe
-
Patent number: 11725101Abstract: The present disclosure relates to rubber polymers of ethylene-glycidylmethacrylate-vinyl acetate polymer as modifiers in epoxy resins. In particular ethylene-glycidylmethacrylate-vinyl acetate rubber polymers comprising phthalic anhydride modified glycidyl methacrylate monomer units.Type: GrantFiled: February 26, 2021Date of Patent: August 15, 2023Assignee: ARLANXEO DEUTSCHLAND GMBHInventors: Martin Hoch, Susanna Lieber, Piming Ma, Qianqian Wang, Pengwu Xu
-
Patent number: 11718752Abstract: A resin composition includes an unsaturated C?C double bond-containing polyphenylene ether resin, a polyolefin and silica; in an X-ray diffraction analysis pattern of the silica as measured by reference to JY/T 009-1996, only one diffraction peak exists in a 2? ranging from 10° to 30°, and the diffraction peak has a full width at half maximum of 5.0° to 7.7°. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one of the properties including dissipation factor, resin filling property in open area, hole drilling limit value, and precision of hole position Cpk.Type: GrantFiled: June 29, 2021Date of Patent: August 8, 2023Assignee: ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.Inventors: Rongtao Wang, Ningning Jia
-
Patent number: 11702503Abstract: A curing agent and method for producing the same are provided, the method includes: esterification reaction: reacting a polyhydric alcohol with a polybasic acid anhydride to obtain an ester-based emulsifier (A); chain extension reaction: reacting an ester-based emulsifier (A) with a bifunctional epoxy resin to obtain a polymer intermediate (B); and reacting the polymer intermediate (B) with a polyamine compound to obtain a curing agent (C).Type: GrantFiled: August 31, 2020Date of Patent: July 18, 2023Assignee: NAN YA PLASTICS CORPORATIONInventors: Te-Chao Liao, Sen-Huang Hsu, Chung-Chi Su, Chuan Chou, Jui-Jung Lin
-
Patent number: 11702502Abstract: Disclosed is a polyurethane-modified epoxy resin composition capable of satisfying both high toughness and high elasticity. This epoxy resin composition is an epoxy resin composition, in which (A) a polyurethane-modified epoxy resin having a polycarbonate structure in the molecule and having a urethane modification rate of 20 to 60% by weight, (B) a non-polyurethane-modified epoxy resin that is liquid at 30° C., (C) a solid epoxy resin having a glass transition temperature or melting point of 50° C. or higher and (D) an amine-based curing agent that is dicyandiamide or a derivative thereof are as essential components, and 20.0 to 50.0% by weight of (A), 0.1 to 50.0% by weight of (B) and 0.1 to 50.0% by weight of (C) are contained relative to the total of (A) to (D).Type: GrantFiled: September 23, 2020Date of Patent: July 18, 2023Assignee: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.Inventor: Koichi Hattori
-
Patent number: 11697739Abstract: To provide a fluorinated ether composition for vapor deposition which can be used to form a vapor-deposited film excellent in frictional durability, and an article with a vapor-deposited film and a method for its production. This fluorinated ether composition for vapor deposition comprises a compound (A) having a poly(oxyperfluoroalkylene) chain and a hydrolyzable silyl group, and a partial condensate (B) of the compound (A), wherein the proportion of the partial condensate (B) to the total amount of the compound (A) and the partial condensate (B) is from 4 to 40 mass %.Type: GrantFiled: November 27, 2019Date of Patent: July 11, 2023Assignee: AGC Inc.Inventors: Kenji Ishizeki, Hideyuki Hirakoso
-
Patent number: 11697643Abstract: The present invention is directed to the use as a reactive component in the curing of compositions based on epoxy resins of a functionalized ?-angelica lactone (XOMAL) having the general formula: wherein: Ra is a C1-C30 alkyl, C3-C30 cycloalkyl, C6-C18 aryl or C2-C12 alkenyl group.Type: GrantFiled: October 18, 2021Date of Patent: July 11, 2023Assignee: Henkel AG & Co. KGaAInventors: Kenji Ito, Andreas Taden
-
Patent number: 11697183Abstract: A method of forming a CMP pad includes providing a solution of a block copolymer (BCP), where the BCP includes a first segment and a second segment connected to the first segment, the second segment being different from the first segment in composition. The method further includes processing the BCP to form a polymer network having a first phase and a second phase embedded in the first phase, where the first phase includes the first segment and the second phase includes the second segment, and subsequently removing the second phase from the polymer network, thereby forming a polymer film that includes a network of pores embedded in the first phase. Thereafter, the method proceeds to combining the CMP top pad and a CMP sub-pad to form a CMP pad, where the CMP top pad is configured to engage with a workpiece during a CMP process.Type: GrantFiled: June 27, 2019Date of Patent: July 11, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: An-Hsuan Lee, Ming-Shiuan She, Chen-Hao Wu, Chun-Hung Liao, Shen-Nan Lee, Teng-Chun Tsai
-
Patent number: 11691389Abstract: The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 ?m or less.Type: GrantFiled: December 2, 2020Date of Patent: July 4, 2023Assignee: RESONAC CORPORATIONInventors: Yuya Hirayama, Takayo Kitajima, Kenichi Tomioka, Keisuke Kushida, Minoru Kakitani, Hiroshi Shimizu
-
Patent number: 11692105Abstract: The present disclosure relates to a cathodically depositable aqueous electrodeposition coating material including at least one epoxide-amine adduct (a), at least one pigment and/or at least one filler (b), and at least one crosslinking agent (c), a fraction of at least 25 wt % of the crosslinking agent (c), based on the total weight of the crosslinking agent (c), being formed by at least one tris(alkoxycarbonylamino)-1,3,5-triazine; to a method for coating an electrically conductive substrate by cathodic electrodeposition coating using said electrodeposition coating material; to a substrate coated accordingly; and also to a use of a tris(alkoxycarbonylamino)-1,3,5-triazine in a cathodically depositable electrodeposition coating material for reducing or eliminating the sensitivity to disruption of the electrodeposition coating bath toward impurities present therein through phosphates and/or through other metal salts which have been carried into the electrodeposition coating bath as a result of pretreatment steType: GrantFiled: October 8, 2018Date of Patent: July 4, 2023Assignee: BASF COATINGS GMBHInventors: Egon Wegner, Oliver Johannpoetter, Tobias Blang
-
Patent number: 11692096Abstract: A surfactant comprising the reaction product of: (a) an epoxidised carboxylic acid ester; and (b) a compound including at least one reactive alcohol and/or amino functional group.Type: GrantFiled: July 2, 2019Date of Patent: July 4, 2023Assignee: LANKEM LTD.Inventors: John Adamson, Samuel Thomas Adamson
-
Patent number: 11685807Abstract: The present invention provides a resin composition containing an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a bonding agent containing the resin composition. Further, the present invention provides a cured product containing resin particles and a matrix resin, wherein the resin particles are a cured product of an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and the matrix resin is a cured product of an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a laminate having a substrate and the cured product.Type: GrantFiled: July 30, 2019Date of Patent: June 27, 2023Assignee: DIC CorporationInventors: Masato Otsu, Kazuo Arita
-
Patent number: 11680144Abstract: A self-adhesive prepreg comprising a fibre reinforcement layer having a first side and a second side, wherein the first side of the fibre reinforcement layer has been pre-impregnated with a self-adhesive resin composition. The self-adhesive may be used as a structural reinforcement and is especially adapted for direct bonding to oily steel or galvanized steel in the automotive, aerospace and other sheet metal fabrication industries.Type: GrantFiled: April 17, 2020Date of Patent: June 20, 2023Assignee: HEXCEL COMPOSITES LIMITEDInventor: Michael Rhodes
-
Patent number: 11674063Abstract: Disclosed are one-component epoxy resin adhesive compositions which include (a) one or more non-rubber-modified epoxy resins; (b) one or more latent epoxy curing agents; (c) one or more toughening agents; and (d) zinc oxide nanoparticles. The one-component epoxy resin adhesive compositions exhibit improved toughness of the adhesive as measured by its lap shear strength as well as improved environmental stability, i.e., corrosion protection, by addition of the zinc oxide nanoparticles when applied to metal substrates.Type: GrantFiled: December 7, 2018Date of Patent: June 13, 2023Assignee: DDP Specialty Electronic Materials US, LLCInventors: Felix Koch, Andreas Lutz, Beda Steiner, Cathy Grossnickel, Jeannine Flueckiger
-
Patent number: 11667809Abstract: This invention provides a coating composition that contains an aromatic adhesion promoter. Containers and other articles comprising the coatings and methods of making such containers and other articles are also provided. The invention further provides compositions including the adhesion promoter, which have utility in a variety of coating end uses, including, for example, valve and pipe coatings.Type: GrantFiled: August 24, 2018Date of Patent: June 6, 2023Assignee: SWIMC LLCInventors: Sebastien Gibanel, Benjamin Campagne, Marie Braillon-Girard
-
Patent number: 11667786Abstract: Provided are an encapsulating or filling composition for electronic devices and an electronic apparatus. The encapsulating or filling composition includes a curable material containing an epoxy group, a polymerization initiator, and a metal catalyst. The electronic apparatus includes a first substrate, an electronic device disposed on the first substrate, and one or more cured materials of the encapsulating or filling composition formed on the electronic device.Type: GrantFiled: March 16, 2021Date of Patent: June 6, 2023Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Wonmin Yun, Yohan Kim, Jongjin Park, Byoungduk Lee, Yunah Chung, Yoonhyeung Cho, Youngcheol Joo, Yongchan Ju
-
Patent number: 11661538Abstract: The present disclosure relates to a two-component polyurethane adhesive, based on a polyol component A and a polyisocyanate component B. The two-component polyurethane adhesive exhibits fast cure speed, good adhesion properties and good durability. The two-component polyurethane adhesive is developed for the adhesion adhesion of substrates, wherein the substrates are preferably selected from the group comprising sheet molding compounds (SMCs) and plastic substrates.Type: GrantFiled: June 25, 2019Date of Patent: May 30, 2023Assignee: Henkel AG & Co. KGaAInventors: Tingting Tang, Jie Liu