Patents Examined by Michael J. Feely
  • Patent number: 11230642
    Abstract: The one-part moisture-curable urethane composition of the present technology includes: a urethane prepolymer (A) having an isocyanate group; at least one type of compound (B) selected from the group consisting of an aliphatic isocyanate compound and a modified product of the aliphatic isocyanate compound; and a monoalcohol compound (C) having a hydroxy group, the monoalcohol compound (C) being blended in an amount such that the amount of the hydroxy group in the monoalcohol compound (C) is from 0.025 to 0.4 mol per 1 mol of the isocyanate group in the urethane prepolymer (A).
    Type: Grant
    Filed: June 12, 2017
    Date of Patent: January 25, 2022
    Inventor: Kiminori Araki
  • Patent number: 11225583
    Abstract: Provided herein is an aqueous polymer dispersion including A) a polymer synthesized from monomers including a) 1.0 to 90% by weight of at least one alkyl (meth)acrylate; b) 0.1 to 10% by weight of at least one ethylenically unsaturated acid or vinyl monomer with latent ionic groups; c) 0 to 5.0% by weight of at least one monoethylenically unsaturated monomer having at least one keto or aldehyde group; d) 1.0 to 90% by weight of at least one vinyl ester of saturated aliphatic monocarboxylic acid in which the carboxyl groups are attached to tertiary and/or quaternary carbon atoms; e) 0 to 20% by weight of at least one vinyl aromatics; and f) 0 to 20% by weight, based on the total amount of monomers for the synthesis of polymer A), of at least one hydroxyalkyl (meth)acrylate. Also included herein is an ink anchorage primer that enhances ink bonding.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: January 18, 2022
    Assignee: BASF SE
    Inventors: Li Li, Jian Feng Xia
  • Patent number: 11208522
    Abstract: Lactide-based random polyester polyols for use in polyurethane compositions are disclosed. The polyester polyols have an OH value in the range of greater than 400 mg KOH/g up to 1100 mg KOH/g and are the reaction product of at least one polycarboxylic acid, at least one lactide, and one or more polyalcohols. The polyester polyols can be formulated into the B-side of a two part polyurethane composition to obtain a polyurethane having improved hardness and solvent resistance and a low VOC content. The polyurethane composition is particularly suitable for polyurethane coating applications.
    Type: Grant
    Filed: January 6, 2020
    Date of Patent: December 28, 2021
    Assignee: Stepan Company
    Inventors: Michael Edward O'Brien, Jeffrey R. Janos, Scott Yin
  • Patent number: 11198781
    Abstract: This disclosure pertains to novel polyvinyl chloride compositions containing polyvinyl chloride resins, polycarbonate resins and copolyester resins. More particularly, the present disclosure pertains to polyvinyl chloride compositions including admixtures of polycarbonates and high glass transition temperature (Tg) copolyesters to increase the Tg and the heat distortion temperature under load (HDTUL) of the polyvinyl chloride compositions.
    Type: Grant
    Filed: June 15, 2020
    Date of Patent: December 14, 2021
    Assignee: Eastman Chemical Company
    Inventors: Robert Erik Young, Mark Allan Treece, Michael Eugene Donelson
  • Patent number: 11198782
    Abstract: This disclosure pertains to novel polyvinyl chloride compositions containing polyvinyl chloride resins, polycarbonate resins and copolyester resins. More particularly, the present disclosure pertains to polyvinyl chloride compositions including admixtures of polycarbonates and high glass transition temperature (Tg) copolyesters to increase the Tg and the heat distortion temperature under load (HDTUL) of the polyvinyl chloride compositions.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: December 14, 2021
    Assignee: Eastman Chemical Company
    Inventors: Robert Erik Young, Mark Allan Treece, Michael Eugene Donelson
  • Patent number: 11198754
    Abstract: Heat-curing epoxy resin compositions are characterized by high impact strength, good storage stability, and a low curing temperature. The epoxy resin compositions are suitable for use as a construction shell adhesive and for producing structural foams. They can already be cured in so-called bottom-baking conditions. Furthermore, it has been found that the use of an accelerator of the formula (Ia) or (Ib) results in an increase of the impact strength of heat-curing epoxy resin compositions.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: December 14, 2021
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Andreas Kramer, Jürgen Finter, Karsten Frick, Urs Rheinegger, Jan Olaf Schulenburg
  • Patent number: 11198676
    Abstract: In order to provide a novel phenyl imidazoline compound having an aminomethyl group, a novel phenyl tetrahydropyrimidine compound having an aminomethyl group, or the like, a compound according to the present invention or a salt thereof is represented by the following formula (1): wherein R1 and R2 each independently represent hydrogen or a substituent selected from the group consisting of an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, a hydroxyl group, an amide group, and a halogen atom; and n is an integer of 1 or 2.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: December 14, 2021
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Yutaka Kanbara, Emi Nakano
  • Patent number: 11186705
    Abstract: A low-dust composite building product is provided. The low-dust composite building product includes a binder system comprising one or more of a thermoset resin, a diluent, and a hardener; and a low-dust filler material comprising filler particles that have been pre-coated with a coating agent comprising one or more of the thermoset resin, the diluent, and the hardener from the binder system.
    Type: Grant
    Filed: September 16, 2019
    Date of Patent: November 30, 2021
    Assignee: THE EUCLID CHEMICAL COMPANY
    Inventors: Benjamin Veres, Fred Tuchscherer, Bradley Nemunaitis, Jeffrey Ohler
  • Patent number: 11186691
    Abstract: One purpose of the present invention is to provide an epoxy resin composition which is for obtaining a fiber-reinforced composite material that combines heat resistance with tensile strength on a high level. Another purpose is to provide: a fiber-reinforced composite material obtained using this epoxy resin composition; and a molded article and a pressure vessel both containing the fiber-reinforced composite material. The present invention has the following configuration in order to achieve the above purposes. Namely, the epoxy resin composition includes the constituent element [A]: An epoxy resin including an aromatic ring and having a functionality of 2 or higher and the following constituent element [B]: An amine-based hardener, and is characterized in that a cured object obtained by curing the epoxy resin composition has a rubber-state modulus of 10 MPa or less when evaluated for dynamic viscoelasticity and the cured object has a glass transition temperature of 95° C. or higher.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: November 30, 2021
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Ayumi Mori, Noriyuki Hirano, Masayuki Miyoshi
  • Patent number: 11186692
    Abstract: One purpose of the present invention is to provide an epoxy resin composition which is for obtaining a fiber-reinforced composite material that combines heat resistance with tensile strength on a high level. The other purpose is to provide: a fiber-reinforced composite material obtained using this epoxy resin composition; and a molded article and a pressure vessel both containing the fiber-reinforced composite material. The present invention has the following configuration in order to achieve the above purposes. Namely, the epoxy resin composition includes the constituent element [A]: An epoxy resin including an aromatic ring and having a functionality of 2 or higher and the following constituent element [B]: An acid anhydride-based hardener, and is characterized in that a cured object obtained by curing the epoxy resin composition has a rubber-state modulus of 10 MPa or less when evaluated for dynamic viscoelasticity and the cured object has a glass transition temperature of 95° C. or higher.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: November 30, 2021
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Ayumi Mori, Noriyuki Hirano, Masayuki Miyoshi
  • Patent number: 11186670
    Abstract: The present application discloses a polyol system for preparing polyurethane comprising: i) at least one active chain extender having at least two groups that can react with an isocyanate, wherein at least one group that can react with an isocyanate is free primary —NH2 group; ii) at least one active chain extender having three groups that can react with an isocyanate, wherein at least one group that can react with an isocyanate is free primary —OH group, and iii) at least one polyether polyol starting from an amine. The polyol system according to the present disclosure is phase-stable without layering and capable of releasing mold quickly after reacting with an isocyanate to produce polyurethane.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: November 30, 2021
    Assignee: COVESTRO INTELLECTUAL PROPERTY GMBH & CO. KG
    Inventors: Erika Zhu, Ling Shi, Hua Lu, Jun Li, Chenxi Zhang
  • Patent number: 11186675
    Abstract: The disclosure describes an epoxy resin composition and a transformer including the same. The epoxy resin composition according to an embodiment of the present invention includes an epoxy resin having a glycol-based functional group in a main chain, a filler, a curing agent, and an imidazole-based catalyst, and the transformer according to an embodiment includes an insulated conductor wound in multiple layers in a vertical direction; a semi-conductive layer which is provided on the insulated conductor and disperses a concentrated electric field; and an insulator which is casted on the insulated conductor and the semi-conductive layer and forms an outer shape of the transformer, and the insulator consists of the epoxy resin composition including the epoxy resin having the glycol-based functional group in the main chain, the filler, the curing agent, and the imidazole-based catalyst.
    Type: Grant
    Filed: June 4, 2018
    Date of Patent: November 30, 2021
    Assignee: LSIS CO., LTD.
    Inventors: Sang-Eon Kim, Wook-Dong Cho, Heon-Seop Song, Tae-Yun Kang, Han-Gil Kim, Hyeon-Jeong Choi
  • Patent number: 11180622
    Abstract: A thermoplastic polymer-based composite material and a preparation method thereof are provided. The thermoplastic polymer-based composite material is obtained by impregnating a reinforcing material with a mixture or an oligomer of an epoxy resin, a bisphenol A/F, and a catalyst and then performing an in-situ polymerization. The thermoplastic polymer-based composite material is less expensive to produce, has an optimal impregnation effect, excellent secondary processing performance, high heat resistance, desirable mechanical properties and excellent overall performance.
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: November 23, 2021
    Assignees: CHANGZHOU BAMSTONE COMPOSITES CO., LTD., WUHAN UNIVERSITY OF TECHNOLOGY
    Inventors: Jun Wang, Junjie Zou, Xiaoli Yang, Wei Liu
  • Patent number: 11168237
    Abstract: Adhesion promoters, Curable compositions containing the adhesion promoters, cured compositions that are formed from the curable compositions, and articles containing the cured compositions are provided. The adhesion promoter has at least one epoxide group and a plurality of hydrolyzable silyl groups. The curable compositions include an adhesion promoter, an epoxy resin, and a curing agent for the epoxy resin that has at least two amino groups that are primary and/or secondary amino groups.
    Type: Grant
    Filed: June 12, 2019
    Date of Patent: November 9, 2021
    Assignee: 3M Innovative Properties Company
    Inventors: Hae-Seung H. Lee, Jay S. Schlechte
  • Patent number: 11161975
    Abstract: A curable resin composition including components (A), (B), (C) and (D) below: component (A): a bisphenol epoxy resin with a softening point of 80° C. or more, component (B): a bisphenol epoxy resin which is liquid at 25° C., component (C): a bi- or more-functional (meth)acrylate compound, and component (D): a curing agent.
    Type: Grant
    Filed: June 20, 2019
    Date of Patent: November 2, 2021
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Hisaya Ushiyama, Nao Deguchi, Kenichi Watanabe, Juichi Fujimoto
  • Patent number: 11142610
    Abstract: Provided is a resin composition that has satisfactory impregnability into reinforcing fibers due to low viscosity and small viscosity increase even in an impregnation process performed for a long time. The resin composition being suitable as a matrix resin for a fiber-reinforced composite material for producing a cured molded article that has toughness and fatigue resistance. The resin composition for a fiber-reinforced composite material includes an epoxy resin, an acid anhydride-based curing agent, an imidazole-based curing accelerator, a radically polymerizable monomer, and a radical polymerization initiator as essential components, has a viscosity at 25° C. that falls within a range of 50 mPa·s to 800 mPa·s as measured by an E-type viscometer, and exhibits a viscosity increase ratio of 200% or less after 8 h at 25° C., wherein 50% by mass or more of the acid anhydride-based curing agent is an alicyclic acid anhydride having no olefinic unsaturated bond.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: October 12, 2021
    Assignee: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    Inventors: Kyohei Kano, Yuichi Taniguchi
  • Patent number: 11130835
    Abstract: A liquid epoxy resin composition is provided. In preferred embodiments, the liquid epoxy resin composition is free of bisphenol A, bisphenol F, and bisphenol S, including epoxides thereof, and is useful in preparing a polyether polymer having utility in coating compositions, including, e.g., coating compositions for use on food or beverage containers.
    Type: Grant
    Filed: November 3, 2016
    Date of Patent: September 28, 2021
    Inventors: Richard H. Evans, Benjamin J. Webster, Robert M. O'Brien, Jeffrey Niederst
  • Patent number: 11124646
    Abstract: To provide a heat-dissipating resin composition, and cured product thereof, which can effectively transmit heat generated from a heat-generating part such as a semiconductor element or the like with a high heating value to an object such as a substrate, heat sink, shield can lid, housing, or the like, and reduce defects such as contact failure of a relay or connector, or the like. A heat-dissipating resin composition of an embodiment of the present disclosure includes: component (A): epoxy resin; component (B): curing agent for epoxy resin; component (C): (meth)acrylic oligomer with weight average molecular weight of 10,000 or less; and component (D): heat conductive particles.
    Type: Grant
    Filed: July 24, 2017
    Date of Patent: September 21, 2021
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventor: Kohichiro Kawate
  • Patent number: 11116211
    Abstract: A functionalized polyurethane polymer is provided, the polymer defined by the formula where each R? is independently derived from a diisocyanate, where each R? represents the soft segment of the polymer, where n is the number of repeat units within the soft segment of the polymer, where m is the number of repeating mer units in the polymer, where each E is a pendant-functionalized amide unit chain extender, wherein the nitrogen atom of the amide group is part of the polymer backbone. A method for preparing the polymer is also provided.
    Type: Grant
    Filed: June 12, 2019
    Date of Patent: September 14, 2021
    Assignee: The University of Akron
    Inventors: Abraham Joy, Chao Peng, Zhuoran Li, Nicholas Nun, Apoorva Vishwakarma
  • Patent number: 11104793
    Abstract: A molding material that enables acquirement of a fiber-reinforced composite material which has excellent demoldability from a mold and excellent surface appearance, which contaminates a mold surface after molding less, and which has excellent mechanical properties and heat resistance; and a fiber-reinforced composite material which has excellent demoldability from a mold and surface appearance, which contaminates a mold surface after molding less, and which has excellent mechanical properties and heat resistance, are provided. A molding material of the present invention includes a component (A): an epoxy resin; a component (B): an epoxy resin curing agent; a component (C): a compound that has a solubility parameter of 11.2 or less and a melting point of 115° C. or lower; and a reinforcement fiber.
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: August 31, 2021
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Akira Oota, Masahiro Ichino, Takuya Teranishi, Yusuke Watanabe, Natsumi Mukouzaka