Abstract: An anisotropic conductive adhesive for anisotropic conductive connection of an electronic component to a wiring board under no pressure or a low pressure is prepared by dispersing conductive particles in a binder resin composition. A metal flake powder having a major axis of 10 to 40 ?m, a thickness of 0.5 to 2 ?m, and an aspect ratio of 5 to 50, is used as the conductive particles, the minor axis of the metal flake power being, in a length, 10 to 50% of the major axis. The amount of the conductive particles contained in the anisotropic conductive adhesive is 5 to 35 mass %.

Abstract: A method of manufacturing a tampon includes transporting a web of material in a machine direction. The web of material has a base web and an absorbent web. The absorbent web has a free end and a bonded end wherein the bonded end is bonded to the base web. At least the free end of the absorbent web of the web to is controlled to inhibit movement of the absorbent web relative to the base web. The web of material is cut into discrete web segments while controlling at least the free end of the absorbent web. The discrete web segments is bonded to a substrate.

Abstract: A method of manufacturing a concave connector substrate includes: a step of preparing a guide substrate having a guide/holding region that guides a plate-shaped connector to a connection position and a cut portion; a step of arranging and aligning two wiring substrates, each having wiring lines and through hole connection portions that are electrically connected to the wiring lines, with both surfaces of the guide substrate, and applying an adhesive to a predetermined region of the guide substrate to bond the wiring substrates to the guide substrate; a step of bending a portion of the wiring substrate toward the inside of the cut portion of the guide substrate and bringing the wiring lines disposed in the bent portion into pressure contact with the inside of the cut portion; and a step of removing a section inside the cut portion to form the guide/holding region.

Abstract: A method of manufacturing an implantable electrical lead body MRI used in such applications as cardiac pacing, electrical nerve stimulation and intracardiac defibrillation applications that is biocompatible upon implantation in an animal and compatible with a magnetic resonance imaging scanner for the purpose of diagnostic quality imaging is disclosed. The method involves a relatively rigid first substrate layer, a conductive coil layer being precisely placed over the first substrate layer, a relatively soft second substrate layer over the conductive coil layer and a relatively rigid third substrate layer over the second substrate layer.

Abstract: Temperature switchable adhesives formed by combining a pressure sensitive adhesive, which does not exhibit temperature switchable properties, with a crystallizable oil are described. These temperature switchable adhesives exhibit a sharp reduction in peel strength when the temperature is raised above the switching temperature. The adhesive properties of these adhesives may be readily tuned by adjusting the ratio of the elastomer, tackifier, and the crystallizable oil, and by choosing different crystallizable oils. The temperature switchable adhesives have use in medical, consumer, and industrial applications.

Abstract: A resizable polymer-stabilized, thermotropic liquid crystal device formulation is used in passive or active light-regulating and temperature-regulating films, materials and devices, including construction materials. Implementations of the device may be composed of five basic elements: one or more transparent substrates, a transparent surface treatment, a liquid crystal mixture, a stabilizing polymer, and spacer beads. The polymer-stabilized liquid crystal is coated and cured on at least one substrate. The transparent surface treatment and the stabilizing polymer network are selected to provide phase separation, curing, and adhesion within the LC mixture. The substrate or substrates may be polarizing or nonpolarizing.

Abstract: A method of applying a surface-coating material to a substrate includes providing a flexible laminate with a carrier and at least one layer of surface-coating material applied to the carrier and comprising a surface-coating material containing a double-bond-containing, OH-functional component A, a double-bond-containing, NCO-functional component B, and, optionally, a double-bond-containing component C which is different from A and B; applying a layer of adhesive to the substrate, contacting the carrier side of the laminate with a surface of the substrate such that the layer of surface-coating material is at least partially cured before or when it contacts the surface of the substrate, and removing the carrier from the layer of surface-coating material.

Abstract: The present invention relates to a magnesium oxide-based (MgO) inorganic coating intended to electrically insulate semiconductive substrates such as silicon carbide (SiC), and to a method for producing such an insulating coating. The method of the invention comprises the steps of preparing a treatment solution of at least one hydrolysable organomagnesium compound and/or of at least one hydrolysable magnesium salt, capable of forming a homogeneous polymer layer of magnesium oxyhydroxide by hydrolysis/condensation reaction with water; depositing the treatment solution of the hydrolysable organomagnesium compound or of the hydrolysable magnesium salt, onto a surface to form a magnesium oxide-based layer; and densifying the layer formed at a temperature of less than or equal to 1000° C.

Abstract: Adherence between a sealing material and a glass substrate is assured, thereby improving airtightness of a hermetic container. A manufacturing method of the hermetic container has: an assembling step of sealing a first glass substrate and a second glass substrate through a circumferential sealing material having plural straight line portions and plural coupling portions which connect the plural straight line portions so as to define an internal space between the first glass substrate and the second glass substrate; and a sealing step of maintaining the internal space to a negative pressure to an outside after the assembling step, applying such local force as to compress the coupling portions of the circumferential sealing material in a thickness direction of the sealing material, and heating and melting the sealing material by irradiating local heating light to the sealing material, to seal the first glass substrate and the second glass substrate.

Abstract: Aspects of this disclosure relate to a method of manufacturing wallboard which includes providing a first layer of facing material, creasing the first layer facing material intermittently to create a series of creased portions, providing a gypsum slurry on the first layer of facing material and providing a second layer of facing material over the gypsum slurry. Further, creasing the first layer of facing material intermittently can include intermittently creasing the first layer of facing material in a substantially linear fashion extending in a first direction of the first layer of facing material so that the first layer of facing material exhibits a linear series of creased portions extending in the first direction of the first layer of facing material and a series of portions that are not creased extending in the first direction of the first layer of facing material.

Abstract: A method for forming a semiconductor bearing thin film material. The method includes providing a metal precursor and a chalcogene precursor. The method forms a mixture of material comprising the metal precursor, the chalcogene precursor and a solvent material. The mixture of material is deposited overlying a surface region of a substrate member. In a specific embodiment, the method maintains the substrate member including the mixture of material in an inert environment and subjects the mixture of material to a first thermal process to cause a reaction between the metal precursor and the chalcogene material to form a semiconductor metal chalcogenide bearing material overlying the substrate member. The method then performs a second thermal process to remove any residual solvent and forms a substantially pure semiconductor metal chalcogenide thin film material overlying the substrate member.

Abstract: The multilayer film serves as a laminate. In some embodiments, the film is a multilayered structure that, in its base form, encompasses an intermediate layer with first and second outer layer affixed to opposing sides of the intermediate layer. In some embodiments, the first outer layer is a semi-crystalline fluoropolymer. In some embodiments, the intermediate layer includes a polyester and the second outer layer is an olefinic polymer.

Abstract: The present invention provides a method for manufacturing a laminate, comprising the steps of laminating two or more layers of polycarbonate resin film and/or sheet using a (meth)acrylate-based adhesive composition containing a (A) (meth)acrylate monomer, a (B) meth(acrylate) olygomer, an (C) acrylamide derivative, and a (D) silane compound and/or an (E) organophosphorus compound to form a laminate having a thickness of 0.1 mm to 30 mm; heating the laminate at 130° C. to 185° C. so that a temperature difference between a top surface and a bottom surface of the laminate is within 20° C.; and bending the post-heating laminate into a curved shape having a radius of curvature of 10 mm or greater.

Abstract: A method of manufacturing absorbent articles (9) includes feeding a longitudinal web (1) of web material having openings (16) such that spaced apart, opposing margins (18) of web material are formed between the respective opening and opposing longitudinal edges of the web material; carrying out a folding action (20) of folding the web about itself along its longitudinal direction; carrying out a second (30) folding action of folding at least a portion of the web along its longitudinal direction; after the second folding action, forming a joint (46) in the web, the joint being formed at least in a part of the region in which the opposing margins have been brought together by the second folding action; finally separating (8) the web through the joint to separate an individual absorbent article from the end of the web.

Abstract: Adhesive compositions using modified diphenylmethane diisocyanate are disclosed along with methods and articles using the adhesive compositions. The adhesive compositions are especially suited for making flexible laminates for use in food packaging.

Abstract: An article is disclosed comprising a network-like pattern of conductive traces formed of at least partially-joined nanoparticles that define randomly-shaped cells that are generally transparent to light and contain a transparent filler material. In a preferred embodiment, the filler material is conductive such as a metal oxide or a conductive polymer. In another preferred embodiment, the filler material is an adhesive that is can be used to transfer the network from one substrate to another. A preferred method of forming the article is also disclosed wherein an emulsion containing the nanoparticles in the solvent phase and the filler material in the water phase is coated onto a substrate. The emulsion is dried and the nanoparticles self-assemble to form the traces and the filler material is deposited in the cells. An electroluminescent device is also disclosed wherein the article of the invention forms a transparent electrode in the device.

Abstract: An object is to provide a manufacturing method of a functional film where it is possible to stably manufacture a functional film which favorably exhibits the intended function and has excellent optical characteristics. The problem is solved by forming an uppermost organic layer of an organic layer with a thickness of 30 to 300 nm by using a coating material containing a surfactant where the content is 0.01 to 10 mass % when the uppermost organic layer is formed.

Abstract: The invention relates to a method for adhesively bonding a magnet onto the surface or into a slot of a rotor or stator of an electric motor or a generator, wherein i) the surface or surfaces to be glued of the magnet, rotor or stator are pre-coated with an adhesive that is not liquid at 22° C. and that does not cure without an activation step, iii) the magnet is brought into contact with the rotor or stator at the adhesive location, and iv) the adhesive is activated by heating or by high-energy radiation so that it cures, characterized in that the adhesive comprises a) at least one reactive epoxide prepolymer, b) at least one latent hardener for epoxies, and c) one or more elastomers. The adhesive preferably comprises a blowing agent. The invention further relates to a corresponding pre-coated magnet.

Abstract: This invention relates to a process for sealing an above-ground or underground structure. It involves in particular the use of non-reactive dispersion adhesive compounds. This process in particular has the advantage that good and long-lived adhesion can be achieved very quickly, and that in particular the non-reactive dispersion adhesives that are used have a small tendency to absorb the plasticizers present in the PVC sealing film, so that as a result this process is best suited to assure long-lasting adhesion of PVC films with various substrates.

Abstract: An anisotropic conductive adhesive for anisotropic conductive connection of an electronic component to a wiring board under no pressure or a low pressure is prepared by dispersing conductive particles in a binder resin composition. A metal flake powder having a major axis of 10 to 40 ?m, a thickness of 0.5 to 2 ?m, and an aspect ratio of 5 to 50, is used as the conductive particles. The amount of the conductive particles contained in the anisotropic conductive adhesive is 5 to 35 mass %. This anisotropic conductive adhesive is supplied to a connection terminal of a wiring board, and a connection terminal of an electronic component is preliminarily connected to a connection terminal of a substrate while arranging the anisotropic conductive adhesive therebetween. Then, the electronic component is heated without applying a pressure or while applying a low pressure to the electronic component to connect the substrate with the electronic component.