Abstract: A substrate processing apparatus includes a vessel providing a processing space for processing a substrate, a substrate support supporting the substrate loaded in the processing space, and a barrier between a side wall of the vessel and the substrate support and surrounding an edge of the substrate supported by the substrate support.

Abstract: First and second concentration measurements are provided in lines for first and second supply liquid lines. A dissolved concentration of gas in the second supply liquid is lower than that in the first supply liquid. In the first and second lines, first ends of branch lines are connected upstream of the concentration measurements. The second ends of the branch lines are connected to a mixing part. By mixing the first and second supply liquids, a processing liquid is generated. Respective flow rates in the branch lines are based on the first and second concentration measurements to set the dissolved concentration of the gas in the processing liquid. Thus, particles or the like can be removed from the processing liquid to be supplied to a substrate, and the dissolved concentration of the gas in the processing liquid can be set with high accuracy.

Abstract: A conveyor system is configured to transport the electronic substrates through cleaning modules of a cleaning apparatus. The conveyor system includes a first outer frame member, a second outer frame member, a bottom belt assembly disposed between the first outer frame member and the second outer frame member, and a top belt assembly spaced from the bottom belt assembly. The bottom belt assembly and the top belt assembly are configured to an electronic substrate therebetween to transport the electronic substrate along the conveyor system and through the at least one cleaning module. The bottom belt assembly or the top belt assembly includes a mesh material belt fabricated from heat resistant synthetic fibers. The conveyor system further includes a plurality of pins secured to the bottom belt assembly or the top belt assembly to create at least one lane along a length of the conveyor system.

Abstract: A substrate treatment method according to an embodiment of the present disclosure includes a temperature raising step of raising a temperature of a concentrated sulfuric acid, and a liquid supply step of supplying the concentrated sulfuric acid having the raised temperature to a substrate placed on a substrate processing part.

Abstract: The invention relates to a method for cleaning a synthetic surface, in particular to remove metal dirt and/or particles therefrom, said method being characterized by the following steps: a) the synthetic surface is rinsed with deionized water; b) the synthetic surface is rinsed with electrolyzed water; and c) the synthetic surface is rinsed with deionized water.

Abstract: A dishwasher thermometer captures temperature data of temperature sensed within a dishwasher during a wash cycle. The dishwasher thermometer includes a wireless communication interface that transmits the captured temperature data to one or more of a server and a monitor device. When the captured temperature data indicates that the wash cycle did not achieve defined temperature threshold(s), an alert is generated at the server and/or the monitor device indicating that the wash cycle did not meet appropriate washing conditions. In embodiments, the temperature data may be accessible to a third party for certification of the dishwasher wash cycle.

Abstract: A cleaning device and a method therefor are provided. The cleaning device includes a vacuum cleaner including a dust collecting container and a docking station to which the dust collecting container is coupled. The docking station includes a suction device configured to move air from the dust collecting container to inside of the docking station, a collector configured to collect a foreign substance that is moved together with the air by driving of the suction device, a suction flow path along which air moves inside the docking station, a flow adjusting device configured to open or close the suction flow path, and at least one processor configured to control the suction device to operate based on the dust collecting container being coupled to the docking station, and control the flow adjusting device to periodically open and close the suction flow path in a state in which the suction device operates.

Abstract: A method for controlling a laundry management apparatus comprising a washing unit and a drying unit that are operated by a single operation unit and remotely controlled to manage hygiene of the drying unit, is provided.

Abstract: A nozzle cleaner includes: a cleaning tank which stores a cleaning solution; a first conductive member that is disposed to be immersed into the cleaning solution stored in the cleaning tank when the nozzle is cleaned; an ultrasonic wave generating mechanism which is disposed so that at least a part of a second conductive member is immersed into the cleaning solution stored in the cleaning tank when the nozzle is cleaned and generates an ultrasonic vibration in the cleaning solution stored in the cleaning tank; a first voltage control unit which controls a potential applied to the first conductive member; and a second voltage control unit which controls a potential applied to the second conductive member, wherein the first voltage control unit applies a second potential V2 higher than a first potential V1 applied to the nozzle when the nozzle is cleaned to the first conductive member.

Abstract: Dishwashing appliances and methods, as provided herein, may include features or steps such as performing a drain cycle; detecting a pressure (P1) during an activation period of the drain cycle; comparing the pressure to a first predetermined pressure limit; comparing the pressure to a second predetermined pressure limit; determining a target fill value based on a difference between a normal fill volume and a fluid volume corresponding to P1; and initiating a fill cycle based on the target fill value.

Abstract: There is provided a technique of cleaning an interior of a supply part by performing a cycle a predetermined number of times, the cycle including: (a) supplying a first gas, which is one of a cleaning gas and an additive gas that reacts with the cleaning gas, from the supply part toward an interior of a process container in which a substrate has been processed by supplying a processing gas from the supply part to the substrate; and (b) supplying a second gas, which is the other one of the cleaning gas and the additive gas and is different from the first gas, from the supply part toward the interior of the process container in a state in which a part of the first gas remains in the supply part after supply of the first gas is stopped.

Abstract: A dishwasher thermometer captures temperature data of temperature sensed within a dishwasher during a wash cycle. The dishwasher thermometer includes a wireless communication interface that transmits the captured temperature data to one or more of a server and a monitor device. When the captured temperature data indicates that the wash cycle did not achieve defined temperature threshold(s), an alert is generated at the server and/or the monitor device indicating that the wash cycle did not meet appropriate washing conditions. In embodiments, the temperature data may be accessible to a third party for certification of the dishwasher wash cycle.

Abstract: Passive brushes formed from plastics, rubbers or other suitable materials may be inserted into openings of aerial vehicles or other machines and subjected to excitation at natural frequencies of vibration of the passive brushes. Where surfaces of the passive brushes are in contact with surfaces of components that are fouled by dust, dirt, grime, or other substances, the vibration of the passive brushes resulting from the excitation causes the dust, dirt, grime or other substances to be released from such surfaces. The passive brushes may have dimensions or shapes that are selected to correspond to internal dimensions of the aerial vehicles or specific components, and may be formed by 3D printing, nanolithography, or in any other suitable manner.

Abstract: A substrate processing apparatus includes a substrate holder configured to horizontally hold and rotate a substrate which has a recess and a base metal layer exposed from a bottom surface of the recess; and a pre-cleaning liquid supply configured to supply a pre-cleaning liquid such as dicarboxylic acid or tricarboxylic acid onto the substrate being held and rotated by the substrate holder, to thereby pre-clean the base metal layer. A temperature of the pre-cleaning liquid on the substrate is equal to or higher than 40° C.

Abstract: A substrate processing method includes a first cleaning process and a second cleaning process. In the first cleaning process, a substrate is cleaned with a first cleaning solution. In the second cleaning process, the substrate is cleaned with a second cleaning solution having a lower cleanliness than the first cleaning solution after the first cleaning process.

Abstract: The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.

Abstract: A spray nozzle, systems and methods for cleaning at least one optical fiber end face of an optical fiber connector. The nozzle includes a housing body with a first end portion and a second end portion. A discharge passage carries an atomized mixture of cleaning fluid and positively pressurized air from the first end portion to a discharge opening at the second end portion. A vacuum return passage communicates with the discharge passage proximate the second end portion. The return passage receives the atomized mixture of cleaning fluid and positively pressurized air as well as contaminants removed from the optical fiber end face. A portion of the atomized mixture of cleaning fluid and positively pressurized air is diverted from the discharge passage to control the amount of the atomized mixture being directed at the optical fiber end face.

Abstract: In a chemical mechanical polishing system, a platen shield cleaning assembly is installed on a rotatable platen in a gap between the rotatable platen and a platen shield. The assembly includes a sponge holder attached to the platen and a sponge. The sponge is held by the sponge holder such that an outer surface of the sponge is pressed against an inner surface of the platen shield.

Abstract: A base station for connecting a cleaning device and a method for operating a cleaning system with a cleaning device and such a base station are proposed, wherein the room air is conditioned by means of the base station and/or the quality of the room air is measured by means of the base station.

Abstract: In an aseptic filling apparatus, a CIP of the content filling station is performed after rotation of a wheel in the content filling station is stopped, a COP or SOP of the content filling station is performed while the wheel in the content filling station is rotating immediately after the CIP is completed, an SIP of the content filling station is performed with rotation of the wheel in the content filling station being stopped immediately after the COP or SOP is completed, and one or both of the COP and SOP of the other stations is performed in a predetermined order while wheels in the other stations are rotating in a period from the start of the CIP to the end of the SIP.