Abstract: This wiring board includes a substrate having a first elastic modulus and including a first surface and a second surface positioned on the opposite side of the first surface; wiring positioned on the first surface side of the substrate and connected to an electrode of an electronic component mounted on the wiring board; and a reinforcing member having a second elastic modulus greater than the first elastic modulus and at least including a first reinforcing part that is positioned on the first surface side of the substrate or on the second surface side of the substrate and that at least partially overlaps the electronic component mounted on the wiring board when viewed along the normal direction of the first surface of the substrate.

Abstract: An apparatus for transferring a semiconductor die (“die”) from the first substrate to the second substrate. The apparatus includes a stage configured to hold a product substrate. A first bridge holds a transfer mechanism assembly. A second bridge holds a die substrate holder configured to hold the first substrate. A controller is configured to cause the first bridge and the second bridge to move to align the transfer mechanism assembly with the die on the first substrate with a transfer position on the second substrate where the die is to be transferred.

Abstract: Provided are a rolling apparatus and a processing device, which are used for rolling an electrode plate. The rolling apparatus includes a first roller and a second roller, where the first roller and the second roller are disposed at two sides of the electrode plate in a thickness direction of the electrode plate. The first roller is provided with a plurality of recessed portions, the electrode plate includes a plurality of insulation coating layer regions and a plurality of tabs, and in a projection of the electrode plate in the thickness direction, at least part of a projection of the insulation coating layer region and a projection of the tab are located within a projection of the recessed portion. The rollers deflect under a large rolling pressure.

Abstract: Disclosed is an unlocking device, battery replacing platform and movable battery replacing platform. The unlocking device comprises: a guide rail; a movable seat mounted on the guide rail; an unlocking ejector rod vertically mounted on the movable seat; and a driving member to drive the movable seat to move horizontally along a plane of the guide rail, the driving member is a driving push rod; the movable seat mounted on the guide rail includes a fixing cylinder fixed vertically mounted direct on the movable seat, and the unlocking ejector rod is movably mounted inside of the fixing cylinder, and a second spring is provided in the fixing cylinder, the second spring is configured to apply an upward thrust to the unlocking ejector rod. The unlocking ejector rod can be controlled to move on the predetermined rail, and the battery locking mechanism on the electric vehicle can be automatically unlocked.

Abstract: This rotor manufacturing method includes the steps of: pressing a rotor core in a central axis direction by using a core pressing member; and fixing a shaft to the rotor core by performing, with the rotor core pressed, hydroforming that involves pressure-welding the shaft to an inner peripheral surface of a shaft insertion hole.

Abstract: A fully-automated terminal crimping device for facilitating cable positioning includes an upper pressing die crimping mechanism, cable positioning mechanisms, an ejection mechanism, a terminal pushing slider mechanism, and a terminal clamping mechanism, where the terminal pushing slider mechanism is arranged directly below the upper pressing die crimping mechanism, a lower pressing die base is arranged on the terminal pushing slider mechanism, the terminal clamping mechanism and the ejection mechanism are arranged at the left and right sides of the lower pressing die base respectively, and the two cable positioning mechanisms are arranged at the front and rear ends of the lower pressing die base respectively.

Abstract: An electric machine includes a stator core defining slots and a first hairpin assembly installed in the stator core. The first hairpin assembly includes first and second same hairpins, each having first and second ends and separately coated to have first and second outer coating surfaces, respectively. The hairpin assembly is in first and second ones of the slots such that the first and second outer surfaces are touching. A weld material joins the first ends and another weld material joins the second ends.

Abstract: A component gripping tool including: a pair of claws configured to grip multiple pins or leads of an electronic component; a contact surface provided between the pair of claws and configured to contact a leading end of at least two of the multiple pins or leads being gripped by the pair of claws, wherein an escape section is formed in the contact surface such that the pair of claws and the contact surface do not interfere with each other when the pair of claws is gripping the two multiple pins or leads.

Abstract: A method of assembling a rotor including a cylindrical rotor core and a permanent magnet that is held in a hole portion provided in the rotor core such that a longitudinal direction of the permanent magnet is parallel to an axis of the rotor core. The method includes: a load measuring step of measuring a load applied to the permanent magnet or/and the rotor core when the permanent magnet is brought into contact with the rotor core; and a moving step of moving the permanent magnet or/and the rotor core so as to change a position of the permanent magnet relative to the rotor core, depending on data relating to the load measured at the load measuring step, such that a positional deviation between the permanent magnet and the hole portion is reduced. Also disclosed is a control device for a rotor assembly apparatus.

Abstract: In one aspect, axial flux rotor, for use in an axial flux motor prepared by a process, provided. The process includes the steps of stamping a plurality of laminations and overlying one of the external planar faces of one of the plurality of laminations over one of the external planar faces of another of the plurality of laminations. The process also includes the steps of providing a plurality of rotor poles, providing a plurality of magnetizable permanent magnets, and overmolding rotor poles with a moldable material.

Abstract: An apparatus for manufacturing a display device includes a plurality of working tables, a plurality of arm modules, and a rotator. The plurality of working tables are spaced apart from each other in a first direction and are configured to support a target board. The plurality of arm modules are arranged in the first direction and spaced apart from the plurality of working tables in a second direction intersecting the first direction. The rotator is connected to the plurality of arm modules and configured to rotate about a rotation axis extending in the first direction.

Abstract: A speaker grille for a vehicle includes a steel plate, an adhesive layer formed on the steel plate, and a metal sheet layer formed on the adhesive layer. The speaker grille is configured such that the steel plate, the adhesive layer, and the metal sheet layer are stacked in sequence. The speaker grille has a plurality of holes formed through the speaker grille, and the holes may be formed by punching. A method of method for manufacturing the speaker grille can include a step of manufacturing a stack by forming the adhesive layer on the steel plate and forming the metal sheet layer on the adhesive layer; and a step of forming the plurality of holes through the stack by perforating the stack.

Abstract: A method of making a slow wave inductive structure includes depositing a first dielectric layer over a first substrate. The method further includes forming a first conductive winding in the first dielectric layer. The method further includes bonding a second substrate to the first dielectric layer, wherein the second substrate is physically separated from the first conductive winding, and the second substrate has a thickness ranging from about 50 nanometers (nm) to about 150 nm. The method further includes depositing a second dielectric layer over the second substrate. The method further includes forming a second conductive winding in the second dielectric layer, wherein the second substrate is physically separated from the second conductive winding.

Abstract: A conveying unit for conveying a device chip onto a predetermined electrode of a board has a chip chuck that holds under suction one surface of the device chip, a support base to which the chip chuck is fixed in an inclinable manner, and a moving unit that moves the support base, in which a fixing mechanism that fixes the chip chuck to the support base has a plurality of leaf springs extending laterally radially from the chip chuck, the plurality of leaf springs are connected to the support base in the surroundings of the chip chuck, and the plurality of leaf springs are pulled one another, so that the chip chuck is supported in air in an inclinable manner.

Abstract: A method for repairing a light-emitting device, which comprises a plurality of light-emitting units disposed on a circuit substrate with at least one of the plurality of light-emitting units being damaged. The method for repairing a light-emitting device including the following steps is provided: removing the at least one damaged light-emitting unit from the circuit substrate to form an unoccupied position on the circuit substrate; providing a good light-emitting unit on a bottom of which a volatile adhesive material has been applied; using a pick and place module to place the good light-emitting unit at the unoccupied position on the circuit substrate; and melting and solidifying the volatile adhesive material so that the good light-emitting unit is affixed at the unoccupied position.

Abstract: A method for crimp mounting a high-frequency (HF) electrical crimp connecting device to an electrical cable includes the steps of crimping a ferrule into a mounting state wherein its maximum diameter is fixed, and arranging the ferrule in its mounting state over an exposed shielding conductor of the cable. A terminal is crimped onto an inner conductor of the cable, and a shielding contact sleeve is placed over the cable and crimped, at least in the area of the ferrule. A target impedance or impedance range of the resulting cable is set according to at least one of a dimension of at least one crimping tool used to perform the crimping steps, or at least one dimension of at least one of the resulting crimps performed by the at least one crimping tool.

Abstract: A method is provided that integrated a unique set of structural features for concealing self-powered sensor and communication devices in aesthetically neutral, or camouflaged, packages that include energy harvesting systems that provide autonomous electrical power to sensors, data processing and wireless communication components in the portable, self-contained packages. Color-matched, image-matched and/or texture-matched optical layers are formed over energy harvesting components, including photovoltaic energy collecting components. Optical layers are tuned to scatter selectable wavelengths of electromagnetic energy back in an incident direction while allowing remaining wavelengths of electromagnetic energy to pass through the layers to the energy collecting components below.

Abstract: The technology relates to a memory insertion machine for inserting memory modules into memory sockets on a circuit board. The memory insertion machine may include one or more insertion rods moveably mounted to one or more vertical guides and an insertion controller. The insertion controller may be configured to apply an insertion force to a memory module in a memory socket by controlling the movement of the one or more insertion rods on the one or more vertical guides. The movement of the one or more insertion rods may have a gradually decreasing deceleration as the insertion rods move towards the memory socket.

Abstract: A method for fabricating a substrate having an electrical interconnection structure is provided, which includes the steps of: providing a substrate body having a plurality of conductive pads and first and second passivation layers sequentially formed on the substrate body and exposing the conductive pads; forming a seed layer on the second passivation layer and the conductive pads; forming a first metal layer on each of the conductive pads, wherein the first metal layer is embedded in the first and second passivation layers without being protruded from the second passivation layer; and forming on the first metal layer a second metal layer protruded from the second passivation layer. As such, when the seed layer on the second passivation layer is removed by etching using an etchant, the etchant will not erode the first metal layer, thereby preventing an undercut structure from being formed underneath the second metal layer.

Abstract: The present disclosure is directed to methods for low-cost, high-volume production of strain gages having substantially uniform gage-to-gage resistances. Strain gages in accordance with the present disclosure are sculpted from a device layer of a semiconductor-on-insulator wafer using deep reactive ion etching, thereby enabling well-controlled electrical properties and physical dimensions of the strain gages. In some embodiments, groups of fully fabricated strain gages are physically connected to handling frames via sprues to facilitate handling, automated assembly, and/or tracing of individual gages from the beginning of fabrication through final packaging. In some embodiments, sprues are configured to mitigate accidental separation of the gages from their frames while simultaneously enabling their removal in response to specific forces applied by a handling tool.