Abstract: The present invention provides an improved wedge connector removal tool for disconnecting a transmission or distribution line wedge tap connection and the methods of using such a tool. The tool may couple to a wedge connector around the transmission or distribution lines enabling a lineman's hands to be free from supporting the tool, and the wedge may be removed from the connection without the incorporation of powder charges.

Abstract: This bonding apparatus is provided with: a tape feeder module which takes out an electronic component from a carrier tape and transfers the electronic component thus taken out; a die supply module which has a die pick-up mechanism for picking up a semiconductor die from a semiconductor wafer bonded to a dicing sheet by pushing up the semiconductor die and which transfers the semiconductor die thus picked up; and a bonding module which arranges, on a circuit substrate, the semiconductor die supplied by the die supply module and/or the electronic component supplied by the tape feeder module.

Abstract: A manufacturing equipment, for manufacturing a molded circuit board assembly of a camera module, includes an upper mould, a lower mould, a mould fixing arrangement, and a temperature controlling arrangement, wherein the mould fixing arrangement controls opening and closing of the upper mould and the lower mound. When a substrate board is placed between the upper mould and the lower mound, a molding cavity is further formed between the upper mould and the lower mound, wherein in the molding cavity, a supporting frame forming groove is formed for forming the module support, and a light window forming element is used for forming a light window. The temperature controlling arrangement provides a molding temperature, the module supporting frame is integrally molded on the substrate board to form the molded circuit board assembly.

Abstract: Systems and methods for designing and assembling form boards with attached wire routing devices for use in wire bundle assembly. The assembly method comprises: (a) establishing a coordinate system of a form board having a multiplicity of holes; (b) using a computer system to determine locations of form board devices of different types with reference to the coordinate system of the form board based on engineering data specifying a wire bundle configuration; and (c) fastening the form board devices of different types to respective holes of the form board having centers closest to respective locations determined in step (b). The form board devices may be inserted robotically or manually.

Abstract: A method and apparatus for forming a rotor for an electric machine includes serially adding layers of material to form a rotor body having a radially-extending post configured to receive a set of electrically-conductive windings, and also having a radially-extending winding end turn support formed contiguously from the rotor body.

Abstract: The present disclosure provides a semiconductor structure with an antenna and a method making the same. The semiconductor structure has an antenna substrate with a first surface and a second surface opposite to the first surface; an antenna module disposed on the first surface of the antenna substrate; and a redistribution layer disposed on the second surface of the antenna substrate. The semiconductor structure with the antenna according to the present application provides the antenna module and the redistribution layer on two opposite surfaces of the antenna substrate, the material of the antenna substrate for supporting the antenna module can be selected according to actual needs, to provide more options. Signal loss can be reduced through the selection of the antenna substrate; the redistribution layer is provided on the surface of the antenna substrate for bonding the semiconductor chips.

Abstract: An efficient fabrication technique, including an optional design step, is used to create highly customizable wearable electronics. The method of fabrication utilizes rapid laser machining and adhesion-controlled soft materials. The method produces well-aligned, multi-layered materials created from 2D and 3D elements that stretch and bend while seamlessly integrating with rigid components such as microchip integrated circuits (IC), discrete electrical components, and interconnects. The design step can be used to create a 3D device that conforms to different-shaped body parts. These techniques are applied using commercially available materials. These methods enable custom wearable electronics while offering versatility in design and functionality for a variety of bio-monitoring applications.

Abstract: The present invention relates to a method for producing a compressed strand (F) from a wire, comprising at least the method steps of: a) shaping said wire (1) into at least one half-loop, ring, or coil in a shaping device (2); b) acting upon said at least one ring, half-loop or coil with adhesive (7); c) twisting said at least one half-loop, ring, or coil into a wire packet (1?) in a twisting device (4); d) compacting said wire packet (D) in a compacting device (5), as well as to a method for producing an electric motor, in particular a traction motor for a motor vehicle, comprising a stator (S), where the stator is equipped with at least one compressed strand (F), where the compressed strand (F) is produced according to the method of at least one of the preceding claims, as well as to the use of a compressed strand (F) in an electric motor, in particular in a traction motor for a motor vehicle, characterized in that it is a compressed strand (F) according to at least one of the preceding claims.

Abstract: A method for fabricating electrodes sized and dimensioned to record, measure, and/or stimulate very fine nerve structures (e.g., microscale or less) is described herein. The method can include securing a tip of an electrode, comprising a conductor substantially encased by an insulator, to a proximal portion of an inserter. The electrode can be wound around a proximal portion of the inserter and a portion of the electrode can be secured to a distal portion of the inserter. A tension in the electrode can be maintained during the winding to keep the electrode in place during the winding.

Abstract: A method to make a stator lamination of an axial flux motor for an automobile vehicle includes: constructing a stator having multiple stator stack members, including: providing a stator lamination with individual ones of the stator stack members; forming the stator lamination from a single lamination sheet of steel defining a sinuous-shaped assembly having multiple bends; compressing the stator lamination; and machining the stator lamination to create a first edge by removing a first portion of the multiple bends and to create a second edge opposite to the first edge by removing a second portion of the multiple bends.

Abstract: A method for manufacturing an electronic-component includes a step of forming a laminate substrate including a plurality of laminates disposed in a direction intersecting with a lamination direction via a division portion by laminating a plurality of insulator layers, and a step of singulating the plurality of laminates by removing the division portion. The step of forming the laminate substrate includes a step of forming an insulator resist layer containing an insulating material on a base material, the insulating material being a constituent material of each of the insulator layers and a step of forming the insulator layer by curing the insulator resist layer by exposure, except for at least an insulator resist portion corresponding to the division portion. The division portion including the insulator resist portion is removed by development in the step of singulating.

Abstract: A method for assembling a catheter is disclosed. The method includes printing conductive traces on at least one flexible substrate and encapsulating the at least one flexible substrate to provide for environmental protection. The at least one encapsulated flexible substrate is inserted into a shaft of a catheter. Then, connectors are attached to each end of the at least one encapsulated flexible substrate. One set of the connectors are further attached to sensors located at a distal end of the catheter and another set of the connectors are further attached to electronics in a handle of the catheter.

Abstract: A deposition method includes depositing an adhesive layer on a workpiece to be processed and depositing a magnetic/isolated unit, where the magnetic/isolation unit includes at least one pair of a magnetic film layer and an isolation layer that are alternately disposed. The deposition method of the magnetic thin film laminated structure, the magnetic thin film laminated structure and the micro-inductive device provided by the disclosure can increase a total thickness of the magnetic thin film laminated structure, thereby broadening the application frequency range of the inductive device fabricated thereby.

Abstract: A connector to easily and correctly join an electrical component to a printed circuit board is provided. The connector comprises a generally C-shaped electrically conductive element that provides for connection alternatively to the positive and negative terminals of a device depending on the orientation of the connector. As a result of the shapes of the ends of the connector, a device can only be plugged in one way. The connector can be made from a single sheet of electrically conductive material bent generally into a “C” shape, with specific tabs and cuts made therein. The connector includes a tab that allows for quick and automated connection to a printed circuit board, and an element to prevent connectors from interlocking while in a loose and unconnected state as, during manufacturing, plating, or storage, allowing them to be added to a board using automated procedures for quick, accurate and low cost construction.

Abstract: A system for assembling a generator, preferably a permanently excited generator of a wind turbine, comprising a rotor and a stator. A vertical assembly device connectable to the rotor and the stator is proposed, for guiding the rotor in parallel and coaxially aligned to the stator during assembly, the vertical assembly device comprising a first assembly element being connectable to the rotor, a second assembly element being connectable to the stator, and guiding means for guiding the first assembly element coaxially aligned to the second assembly element.

Abstract: A wire feeding and bonding tool and method for attaching wires to a component having first and second spaced-apart wire attach structures. Wire from a supply is fed through a capillary having at least a linear end portion with a feed opening. The capillary is positioned with respect to the component to locate a first portion of the wire extending from the feed opening adjacent to the first wire attach structure, and the wire is attached to the first attach structure. The capillary is moved with respect to the component along a wire feed path to feed the wire from the first wire attach structure to the second wire attach structure and to locate a second portion of the wire extending from the feed opening adjacent to the second attach structure. The wire is attached to the second wire attach structure, and cut from the supply.

Abstract: A method for making an adsorption device includes: providing and etching a substrate to form a plurality of receiving grooves spaced apart from each other; forming a magnetic film in each of the plurality of receiving grooves; and forming a magnet in each of the plurality of receiving grooves. Each receiving groove includes a bottom wall and a side wall coupling the bottom wall. The magnetic film covers the bottom wall and the side wall of each of receiving groove.

Abstract: A transferring method includes providing an adsorption device, using the adsorption device to attract and hold a plurality of light emitting diodes (LEDs), providing a target substrate with a plurality of spots of anisotropic conductive adhesive on a surface of the target substrate; moving the adsorption device or the target substrate wherein each of the plurality of LEDs adsorbed by the adsorption device becomes in contact with one of the plurality of spots of anisotropic conductive adhesive; and curing the plurality of spots of anisotropic conductive adhesive on the target substrate and moving away the adsorption device.

Abstract: An electronic component mounting device is provided for mounting a plurality of electronic components, the plurality of the electronic component being placed in a predetermined portion, on a plurality of attachments each arranged at a predetermined interval from one another. The electronic component mounting device includes a removal mechanism for removing some of the plurality of the electronic components having been placed in the predetermined portion, a transport mechanism for transporting the electronic components removed by the removal mechanism, moving the electronic components so that intervals between the electronic components adjacent to one another are, respectively, the predetermined interval before reaching the attachments, and transporting the electronic components to the attachments, and a mounting and transfer mechanism for mounting the electronic components, which have been transported by the transport mechanism, on predetermined positions of the attachments.

Abstract: A method is for making an electronic device that includes a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein. The multilayer circuit board may include at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The electronic may further include a compressible dielectric material filling the membrane switch recess. The electronic device may also include at least one spring member within the membrane switch recess.