Abstract: Described herein are DC-DC converters having various immersion-cooling features enabling high-power applications, such as cross-charging electric vehicles. For example, the inductor of a DC-DC converter may be formed using metal and insulator sheets stacked and wound into an inductor coil assembly. The metal sheet comprises grooves, extending parallel to the coil axis and forming coil fluid pathways through this assembly thereby providing immersion cooling to the inductor. An inductor-cooling liquid may be pumped through these fluid pathways while being in direct contact with the metal sheet, at least around the grooves. In some examples, these grooves are distributed along the entire length of the metal sheet. Multiple inductors may be used to enable operations of multiple converter units, e.g., operating out of phase. These inductors may be fluidically interconnectors and have the same cooling features.

Abstract: A fan cage, a fan module, and an electronic device are provided, where the fan cage includes a cage body having two surfaces and at least two ventilation ports and a latching mechanism arranged at the cage body, the two surfaces are located opposite to each other, the two ventilation ports are respectively located at the two surfaces, the latching mechanism is arranged at the cage body and comprises at least one latch movably protruding outwardly from one of the two surfaces.

Abstract: A cooling apparatus including a heat sink to which a heat generating body is joined, a main flow generation device configured to generate a main flow for cooling the heat sink, and an induced flow generation device configured to electrically generate an induced flow. The induced flow generation device is provided to a support member facing the heat sink.

Abstract: A fan structure automatically mountable on a system circuit board includes a fan. The fan includes a fan frame main body. A connector connection section is disposed on the fan frame main body for connecting with a fan end connector, whereby the fan end connector can be assembled with the fan frame main body. Accordingly, when the fan is mounted on the system circuit board, the fan end connector can be directly pressed down by means of an automated device to plug into the circuit board end connector. Therefore, the manufacturing process can be automated.

Abstract: An apparatus for encapsulating at least one electronic component disposed on a printed circuit board may include a liquid-tight enclosure that surrounds the electronic component and that is fixed with respect to the electronic component and the circuit board, and an encapsulating material disposed inside the enclosure and encapsulating the electronic component. The enclosure may include at least one sidewall and a top. The at least one sidewall may include a rigid material, a lower edge that is proximal to the printed circuit board, an upper edge that is distal from the circuit board, and a height above the circuit board that is no more than 0.003 inches greater than a height of the electronic component above the circuit board. The top may include a solid surface disposed on the upper edge of the at least one sidewall, where the at least one sidewall and the top form the enclosure.

Abstract: The present disclosure discloses a control device, which comprises: a circuit board; a heat dissipation cover comprising a heat dissipation cover plate and a plurality of heat dissipation fins arranged on the heat dissipation cover plate, wherein the heat dissipation cover plate covers the circuit board, and a groove is formed between the plurality of heat dissipation fins; a thermally conductive strip disposed between the circuit board and the heat dissipation cover plate; and a fan arranged in the groove. The heat dissipation cover disclosed herein covers the circuit board as a holistic upper cover, the heat of the circuit board is conducted to the heat dissipation cover through the thermally conductive strip, and the fan in the through groove generate an airflow to dissipate heat, thereby realizing sealing, dustproof and heat dissipation of the circuit board simultaneously.

Abstract: An electronic device comprises: a hinge structure which is arranged in an internal space of a hinge cover and includes a first hinge plate having a first opening and a second hinge plate having a second opening; a first housing connected to the first hinge plate; a second housing connected to the second hinge plate; a flexible display arranged to be supported by the first housing and the second housing; and a wiring member which electrically connects a first electrical structure of the first housing to a second electrical structure of the second housing through the internal space of the hinge cover, wherein the wiring member comprises: a bendable portion; a first fixing portion which is disposed on the first opening of the first hinge plate from the bendable portion so as to be exposable; a second fixing portion which is disposed on the second opening of the second hinge plate from the bendable portion so as to be exposable; at least one first reinforcing member which is fixed on the first fixing portion and

Abstract: An electronic device system, a manufacturing method, and a method for controlling the electronic device system, in field of heat dissipation technologies. The electronic device system includes a heat source, a plurality of fans, and a plurality of air guiding apparatuses. The heat source is located on air inlet sides of the plurality of fans, and the plurality of air guiding apparatuses are located on air outlet sides of the plurality of fans. The plurality of air guiding apparatuses are configured such that, when there is a faulty fan, an air guiding direction of an air guiding apparatus corresponding to the faulty fan and an air guiding direction of an air guiding apparatus corresponding to a neighboring fan deviate from each other.

Abstract: This document describes a passive thermal-control system that is integrated into a mesh network device. The passive thermal-control system, which may include a heat sink and multiple heat spreaders, is such that heat originating with integrated circuit devices of the mesh network device and a speaker module of the mesh network device may be transferred to other components of the mesh network device, such as a housing component of the mesh network device. The heat may then be dissipated to an external environment to maintain a desired thermal profile of the mesh network device.

Abstract: A cooling structure includes: a main body including a base, and heat dissipation fins and a protrusion that protrude from a heat dissipation surface; a lid member disposed to cover the protrusion and the fins and form a flow path; and a fan mechanism. The fan mechanism includes a vane portion, a driving portion that rotates the vane portion, and a conductive wire for supplying electric power to the driving portion. The protrusion includes a first through hole, and the base includes a second through hole communicating with the first through hole. The conductive wire includes a first portion connected to the driving portion and disposed between the lid member and the main body, and a second portion continuing from the first portion and inserted in the first through hole and the second through hole. The cooling structure enables enhancement of the heat dissipation and shielding performance.

Abstract: The description relates to passive two-phase immersion cooling of computers, such as servers. One example can include multiple liquid immersion tanks configured to contain servers immersed in a liquid-phase of a coolant having a boiling point below a maximum operating temperature of the servers such that operation of the servers generates heat that is transferred to the liquid phase of the coolant and causes a portion of the coolant to boil to a gas phase of the coolant. The example can include a single phase separator tank and a single heat exchanger coupled to the multiple liquid immersion tanks as a sealed cooling system and configured to receive the gas phase of the coolant and configured to transition the gas phase of the coolant back to the liquid phase of the coolant and to automatically deliver liquid phase of the coolant to an individual liquid immersion tank responsive to further boiling producing additional gas phase of the coolant that evacuates the individual liquid immersion tank.

Abstract: An apparatus includes a housing, at least one heat-generating electrical module, and at least one fan. The housing includes a floor and at least one sidewall extending around the floor's perimeter. A first sidewall end section defines an air intake port and a second sidewall end section defines a first air exhaust port. The floor includes two noncoplanar floor portions and a transition portion interconnecting them. The transition portion defines a second air exhaust port. The heat-generating module(s) are positioned over the floor portions. Inside surfaces of the floor portions together with external surfaces of the heat-generating module(s) define at least one air flow channel therebetween. The fan or fans are positioned proximate the air intake port and operable to draw air into the housing through the intake port. The fan or fans force the indrawn air through the air flow channel(s) and out the air exhaust ports.

Abstract: An image display device includes a circuit board disposed at a position corresponding to a portion of a back surface of a display panel at a side of a back surface of an inner plate at a side of the back surface of the display panel; and a heat insulating member provided between the circuit board and the inner plate.

Abstract: A server drawer comprising a plurality of Printed Circuit Boards (PCBs) respectively containing heat-generating electronic devices. The server drawer further comprises a plurality of fans configured to convectively dissipate heat from the heat-generating electronic devices. The server drawer further comprises internal partitions isolating airflow between respective PCBs of the plurality of PCBs.

Abstract: A cooling system for a capacitor may include a housing for the capacitor, the housing comprising of a bottom surface, a top surface, and at least one side surface connecting the bottom surface and the top surface, the housing further including: a bottom inlet manifold and a bottom outlet manifold extending along the bottom surface; an inlet side channel extending along the side surface, the inlet side channel being in fluid communication with the bottom inlet manifold; an outlet side channel extending along the side surface, the outlet side channel being in fluid communication with the bottom outlet manifold; a top inlet manifold extending along the top surface, the top inlet manifold being in fluid communication with the inlet side channel; and a top outlet manifold extending along the top surface, the top outlet manifold being in fluid communication with the outlet side channel.

Abstract: A fan tray for an enclosure containing devices to be cooled is provided. The fan tray includes a top cover having a top surface and a bottom surface facing opposite the top surface, wherein, when the fan tray is mated to the enclosure, (i) the top surface is exposed relative to outside the enclosure and (ii) the bottom surface is contained within the enclosure, a fan-receiving portion extending from the bottom surface of the top cover and configured to receive one or more fans, and one or more electrical connectors configured to provide electrical power to the one or more fans.

Abstract: Presented herein is a cold plate assembly including a sub-plate and a vapor chamber for use as part of a remote fin cooling system for an electronic device. The sub-plate includes a first surface, a second surface, and a plurality of pipes. The vapor chamber includes a first wall and a second wall opposite the first wall. The first wall and the second wall define an interior cavity having a first depth for one or more first portions of the vapor chamber and a second depth for one or more second portions of the vapor chamber. The second surface of the sub-plate is attached to the first wall of the vapor chamber.

Abstract: The invention relates to a switch cabinet arrangement with at least one IT rack or switch cabinet housing and with at least one cooling device, which has an air-liquid heat exchanger for cooling components accommodated in the IT rack or switch cabinet housing with cooled air, wherein the air-liquid heat exchanger comprises a first flow for cooled liquid and a first return for heated liquid, wherein the cooling device comprises a liquid-liquid heat exchanger, to the second flow of which the first return of the air-liquid heat exchanger is connected. A corresponding method is further described.

Abstract: A liquid cooling static synchronous series compensator (SSSC) system has inverter valve modules, inverter valve units and liquid cooling blocks. Liquid cooling blocks may be configured to provide a jetted flow, a parallel flow or an individualized flow, within an enclosed fluid chamber, for cooling inverter valve units. Liquid cooling blocks may have voltage isolation.

Abstract: According to an embodiment, an electronic apparatus includes a printed circuit board including a plurality of devices that include a nonvolatile memory package and a controller package configured to control the nonvolatile memory package, and a housing accommodating the printed circuit board. The housing includes an opening on a surface constituting the housing. An encryption device among the plurality of devices is present in a first region. The first region is a region on the printed circuit board that is not irradiated with light emitted from a light source placed at the opening. The encryption device is a device used for an encryption process of data to be stored into the nonvolatile memory package.