Abstract: A seismic shim for electronic equipment comprises a base comprising at least a first hole through the base, wherein the first hole is configured to receive a first fastener, and an extension portion extending from the base. The extension portion is perpendicular to the base and comprises at least a second hole through the extension portion, wherein the second hole is configured to receive a second fastener. The seismic shim also comprises a first gusset and a second gusset disposed between the base and the extension portion. The second gusset is spaced apart from the first gusset. The seismic shim is configured for anchoring to an underlying floor structure via the first fastener inserted through the first hole, and is configured for attachment to a surface of the electronic equipment via the second fastener inserted through the second hole.

Abstract: Embodiments relate to a system, an apparatus, and a method that involve a plurality of stackable enclosure units that include inter-unit or inter-module passages for facilitating cooling of interior compartments of the units, especially server units.

Abstract: Several transportable datacenters are described. The transportable datacenters include transport systems allowing them to be transported between an assembly location and an operating location. The transportable datacenters also include a ventilation system for cooling processors positioned in racks in the datacenters. The ventilation system draws cold air from the environment, through processor bays containing the processors and then exhausts the air back to the environment.

Abstract: Provided are a housing and an electronic device. The housing comprises a middle frame, a heat-conducting element and a protective member. The middle frame is provided with a first receiving area configured to receive an electronic component of an electronic device. The middle frame is further provided with an accommodating groove. The accommodating groove penetrates the middle frame and is communicated with the first receiving area. The heat-conducting element is accommodated in the accommodating groove. The protective member is at least partially accommodated in the accommodating groove, and is arranged at a side of the heat-conducting element that faces towards the first receiving area. In the embodiments, the protective member is opposite to or in contact with the electronic component arranged in the first receiving area, and separates the heat-conducting element accommodated in the accommodating groove from the electronic component arranged in the first receiving area.

Abstract: A fan tray, for a fan module of a network device chassis, may include an inner assembly that includes an inner cassette, one or more fans connected to the inner cassette, a first latch connected to the inner cassette and configured to removably connect to an outer assembly of the fan tray, and a fan controller connected to the inner cassette and configured to control operation of the one or more fans. The outer assembly may be configured to receive and retain the inner assembly, and may include an outer cassette with one or more openings configured to communicate with the one or more fans, a second latch connected to the outer cassette and configured to removably connect to a rear portion of the network device chassis, and an adaptor connected to the outer cassette and configured to connect and provide power to the fan controller.

Abstract: Embodiments of this application disclose a housing structure and a terminal device. The housing structure includes a bottom shell and a lifting shell. A first end of the bottom shell is connected to a first end of the lifting shell, a second end of the bottom shell and a second end of the lifting shell are spaced by a first distance, and space between the bottom shell and the lifting shell forms a heat dissipation channel. A heat dissipation panel is disposed on the bottom shell, a first surface of the heat dissipation panel is in contact with a heat emitting component, and a second surface of the heat dissipation panel is located in the heat dissipation channel. Therefore, the housing structure provided in the embodiments of this application can better dissipate heat for the heat emitting component in the bottom shell.

Abstract: The disclosure relates to a wireless charging device including a cooling fan, and the wireless charging device according to an embodiment of the disclosure includes: a housing including a holding portion configured to hold an external electronic device; a first bracket positioned in the holding portion; a conductive coil disposed in the first bracket; a second bracket positioned in the holding portion and including a penetrating hole; a first cooling fan positioned in the penetrating hole; a second cooling fan positioned in the penetrating hole and spaced apart from the first cooling fan; and a partition formed in the penetrating hole to isolate the first cooling fan and the second cooling fan from each other, the penetrating hole being divided into a first area having the first cooling fan disposed therein and a second area having the second cooling fan positioned therein, at least one protrusion having a volute shape formed on at least a portion of the second bracket or at least a portion of the partition,

Abstract: An assembly is provided for an electronic system. This electronic system includes a base and an electronic component. The base includes a base connector, a bay and a first guide. The first guide is arranged along a first side of the bay. The electronic component is configured to mate with the first guide and to move along the first guide within the bay to an installed position. The electronic component includes a component connector and a brake. The component connector is configured to couple with the base connector when the electronic component is at the installed position. The brake is engageable as the electronic component moves along the first guide to the installed position.

Abstract: A heat dissipation module includes: a heat dissipation base material layer, provided with a first accommodating slot for accommodating a fingerprint sensor and a second accommodating slot for accommodating a flexible printed circuit, the fingerprint sensor being electrically connected to the flexible printed circuit, the first accommodating slot penetrating through the heat dissipation base material layer; and a light shielding buffer layer, on a side of the heat dissipation base material layer away from an opening of the second accommodating slot and provided with a hollowed-out area, an orthographic projection of the hollowed-out area on the heat dissipation base material layer being in the first accommodating slot, the hollowed-out area being configured to expose a photosensitive area of the fingerprint sensor, and the impedance of a surface of a side of the light shielding buffer layer away from the heat dissipation base material layer being 106?-1010?.

Abstract: An outdoor, hardened telecommunications clamshell platform includes a base half and a top cover half. The platform also includes a Printed Circuit Board (PCB) disposed between two cooling plates within the platform, and a heat distributing mechanism surrounding the PCB within the platform and configured to distribute heat substantially evenly between the base half and the top cover half.

Abstract: A fan carrier includes a fan mounting section, a connector mounting section, and a connecting section. The fan mounting section is placed in physical communication with a fan of an information handling system. The fan mounting section has both structural rigidity and vibration rigidity. The connector mounting section is placed in physical communication with a fan-side connector of the information handling system. The connector mounting section has structural rigidity to properly align the fan-side connector with a motherboard-side connector of the information handling system. The connecting section is in physical communication with and located in between the fan mounting section and the connector mounting section. The connecting section has structural rigidity and vibration flexibility, and the vibration flexibility reduces vibrations from the fan before the vibrations are transmitted to the fan-side connector.

Abstract: A leak detection system for a server rack can include a detection channel that has a top region and a bottom region. The detection channel includes one or more openings at the top region. Each opening is to receive an outlet port of a server chassis installed in the IT rack. A cover for each of the one or more openings is arranged over the one or more openings when the outlet port is not present in the one or more openings and moves to allow entrance of the outlet port when the outlet port is inserted into the one or more openings. A fluid sensor for each of the one or more openings is arranged within the detection channel to detect a fluid that is deposited from the outlet port. Each fluid sensor is positioned within the detection channel to optimally detect presence of the fluid.

Abstract: A thermal module with a heat pipe configured with a first portion configured for contact with an edge of a plurality of fins in a fin stack, a second portion configured for contact with a side of one fin in the fin stack and a sharp angled bend is formed between the first portion and the second portion to fluidly isolate the first portion from the second portion. The first portion comprises a usable length of the heat pipe that efficiently transfers heat based on phase transitioning by the fluid. The second portion is formed from at least some of the unusable length of the heat pipe. By configuring the heat pipe such that more fins contact the usable length of the heat pipe, heat transfer from the heat pipe to the fin stack is increased.

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a printed circuit board, a heat source located on the printed circuit board, a cold plate over the heat source, and a pair of cold plate attachments with stabilizing arms. Each of the pair of cold plate attachments with stabilizing arms include a printed circuit board attachment portion secured to the printed circuit board using only a single through hole, a load portion that extends from the printed circuit board attachment portion towards the cold plate, a cold plate attachment portion that secures the cold plate attachment with stabilizing arm to the cold plate, and a stabilizing portion that extends from the cold plate attachment portion to the printed circuit board.

Abstract: Example implementations relate to a dual-sided fan tray assembly of an electronic system. The fan tray assembly includes a housing having a front panel, a back panel, and a pair of side walls coupled to the front and back panels. The fan tray assembly further includes a handle assembly pivotably connected to the pair of side walls such that the handle assembly is at least rotatable around the housing to at least first and second positions spaced apart from each other. When the handle assembly is rotated to the first position, the fan tray assembly is slidably insertable into a chassis of an electronic system with the front panel facing the chassis to install the fan tray assembly to the electronic system. When the handle assembly is rotated to the second position, the fan tray assembly is slidably insertable into the chassis with the back panel facing the chassis.

Abstract: A high-power Voltage Regulator Module (VRM) includes a housing having side walls, an upper opening, and a lower opening, a VRM circuit board oriented within the housing, a plane of the VRM circuit board oriented in a parallel to at least one of the side walls of the housing, an upper Printed Circuit Board (PCB) coupled to the upper opening of the housing, a lower panel coupled to the lower opening of the housing, a coolant inlet port formed in the lower panel, and a coolant outlet port formed in the lower panel. The high power VRM may include a coolant inlet adapter coupled to the coolant inlet port and a coolant outlet adapter coupled to the coolant outlet port. The coolant inlet adapted and the coolant outlet adapter may provide support for the VRM.

Abstract: The disclosed IC package may include (1) an IC die carrying electronic circuitry, (2) an encapsulation material that at least partially covers the IC die, where the encapsulation material defines a plurality of cavities in a top surface of the encapsulation material, (3) a plurality of microfans located in the plurality of cavities, and (4) a plurality of sensors embedded in the encapsulation material, where each sensor of the plurality of sensors produces a signal indicating a temperature at a location of the sensor. Various other IC packages, as well as associated cooling systems and methods, are also disclosed.

Abstract: Systems, devices, and methods that ensures that an ultrasonic fingerprint detection process is not interfered with by using a screen protector. An example screen protector for a mobile device is disclosed that is capable of an in-screen fingerprint detection. The screen protector includes a first layer made of a clear rigid material and configured to be touched by a user. The screen protector also includes a second layer beneath the first layer and made of a film. Additionally, the screen protector includes a third layer beneath the second layer and configured to contact the mobile device. The third layer includes a fingerprint conduit configured to facilitate the in-screen fingerprint detection.

Abstract: A fan control circuit for controlling at least one fan of a power supply device includes a load sensing unit, a temperature sensing unit, a control unit connected to the load sensing unit, the temperature sensing unit and the fan, and a mode switching unit. The load sensing unit generates a load signal according to an output condition of the power supply device. The temperature sensing unit senses the temperature in the power supply device and generates a temperature signal. The control unit comprises a low-speed operating mode for controlling the fan according to the load signal, a mute mode for controlling the fan according to the temperature signal, and a full-speed operating mode for controlling the fan to run in a rated rotational speed. The mode switching unit controls the control unit to adjust the rotational speed of the fan by one of the three modes.

Abstract: A temperature control system (300) for a variable frequency drive (10, 100) includes a sealed enclosure (310), a power electronic component (330) and/or a power magnetic component (320) positioned inside the sealed enclosure (310), and a controller (400) configured to control a temperature of the power electronic component (330) and/or the power magnetic component (320) relative to an internal air temperature (Tair) inside the sealed enclosure (310) prior to an electrical energy application and operation of the power electronic component (320) and/or power magnetic component (320) to prevent condensation induced electrical failure of the power electronic component (330) and/or power magnetic component (320) utilizing a cooling system (340) and/or a heating system (350).