Abstract: The erosion-prone sections of the tubes in a circulating fluidized bed boiler are provided with a locally thickened sidewall without forming discontinuities on the outer surface of the tubes. This can be accomplished, for example, by replacing the erosion prone portion of the tube with a section having a smaller inside diameter, but the same outside diameter, or by replacing the erosion prone portion of the tube with a section having a thicker sidewall, but the same inside diameter, and smoothing over the outside discontinuity with an alloy coating. A useful alloy coating is also disclosed which can be used for this and other applications.
Abstract: The invention relates to a method for applying an image of an electrically conductive material onto a recording medium. In the method, the recording medium is heated and the electrically conductive material is jetted onto the recording medium. The invention further relates to a device for ejecting droplets of an electrically conductive fluid onto a recording medium.
Abstract: A method is provided for metallization of substrates providing a high adhesion of the deposited metal to the substrate material and thereby forming a durable bond. The method applies novel adhesion promoting agents comprising nanometer-sized particles prior to metallization. The particles have at least one attachment group bearing a functional chemical group suitable for binding to the substrate.
Type:
Grant
Filed:
December 5, 2012
Date of Patent:
March 20, 2018
Assignee:
Atotech Deutschland GmbH
Inventors:
Thomas Thomas, Lutz Brandt, Lutz Stamp, Hans-Jürgen Schreier
Abstract: The invention concerns a method for producing a chromatography-enrichment column, the method comprising the following steps: (a) depositing at least one layer of desired particles, which may be identical or different, and are intended to constitute the stationary phase, in a compact assembly, on the flat surface of a substrate; (b) crosslinking the layer in at least the regions corresponding to the desired shape of the enrichment column to be obtained; (c) impregnating the layer with a light radiation-sensitive material; (d) insolating the layer obtained in step (c) so as to form insolated regions of which the shape corresponds to the desired internal shape of the enrichment column, if the light radiation-sensitive material behaves like a positive resin or to form non-insolated regions of which the shape corresponds to the desired internal shape of the enrichment column if the light radiation-sensitive material behaves like negative resin; and (e) eliminating the light radiation-sensitive material in the zone
Type:
Grant
Filed:
July 2, 2013
Date of Patent:
February 6, 2018
Assignee:
COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
Inventors:
Olivier Dellea, Pascal Fugier, Helene Marie, Severine Vignoud
Abstract: A method for forming a polymerized film on a surface of a non-conductive material and subsequently forming an electroless metal plating film on the surface is described. The method includes the step of contacting the surface of the material with a solution including (A) an amine compound having at least two functional groups, where at least one of the functional groups is an amino group, and (B) an aromatic compound having at least one hydroxyl group on the aromatic ring.
Type:
Grant
Filed:
September 30, 2013
Date of Patent:
January 9, 2018
Assignee:
Rohm and Haas Electronic Materials LLC
Inventors:
Maria Anna Rzeznik, Philip D. Knudsen, Xuesong Wang, Martin W. Bayes, Yuhsin Tsai
Abstract: This disclosure provides systems, methods, and apparatus related to simulated soiling and weathering of materials. In one aspect, a soiling mixture may include an aqueous suspension of various amounts of salt, soot, dust, and humic acid. In another aspect, a method may include weathering a sample of material in a first exposure of the sample to ultraviolet light, water vapor, and elevated temperatures, depositing a soiling mixture on the sample, and weathering the sample in a second exposure of the sample to ultraviolet light, water vapor, and elevated temperatures.
Type:
Grant
Filed:
March 14, 2013
Date of Patent:
January 2, 2018
Assignee:
The Regents of the University of California
Inventors:
Mohamad Sleiman, Thomas Kirchstetter, Hugo Destaillats, Ronnen Levinson, Paul Berdahl, Hashem Akbari
Abstract: The present invention discloses a method for electroless plating of a metal or metal alloy onto a metal or a metal alloy structure comprising a metal such as molybdenum or titanium and alloys containing such metals. The method comprises the steps of activation, treatment in an aqueous solution comprising at least one nitrogen-containing compound or a hydroxy carboxylic acid and electroless plating of a metal or metal alloy.
Type:
Grant
Filed:
April 17, 2012
Date of Patent:
November 21, 2017
Assignee:
Atotech Deutschland GmbH
Inventors:
Frank Brüning, Birgit Beck, Bexy Dosse, Johannes Etzkorn
Abstract: A method for electroless deposition of aluminum on a substrate includes: activating the substrate; providing an aluminum ionic liquid; adding a reducing agent and an additive to the aluminum ionic liquid to form an electroless plating composition, wherein the additive may include a catalyst, an alloying element, or a combination thereof; and immersing the substrate in the electroless plating composition to have an aluminum layer deposited on the substrate. An article includes the electroless deposited aluminum layer.
Type:
Grant
Filed:
January 29, 2014
Date of Patent:
October 31, 2017
Assignee:
HRL Laboratories, LLC
Inventors:
John H. Martin, Joanna A. Kolodziejska, John J. Vajo, Jason A. Graetz, Christopher S. Roper
Abstract: A process of pretreatment for selective application of electroless metallization to a surface of a non-conductive material and a solution useful for the pretreatment are provided. The process achieves good coverage in areas to be plated on the surface of non-conductive materials without skip plating or over plating.
Type:
Grant
Filed:
October 26, 2012
Date of Patent:
October 10, 2017
Assignee:
ROHM AND HAAS ELECTRONIC MATERIALS LLC
Inventors:
Dennis Kwok-Wai Yee, Michael Chi-Yung Tang, Martin W. Bayes, Ka-Ming Yip, Chun-Man Chan, Hung-Tat Chan, Tsui-Kiu Li, Lok-Lok Liu
Abstract: A plating apparatus can perform a plating process on an entire surface of a substrate uniformly. A plating apparatus 20 includes a substrate holding/rotating device 110 configured to hold and rotate a substrate 2; a discharging device 21 configured to discharge a plating liquid toward the substrate 2 held on the substrate holding/rotating device 110; and a controller 160 configured to control the substrate holding/rotating device 110 and the discharging device 21. Further, the discharging device 21 includes a first nozzle 40 having a multiple number of discharge openings 41 arranged in a radial direction of the substrate 2 or having a discharge opening 42 extended in the radial direction of the substrate 2; and a second nozzle 45 having a discharge opening 46 configured to be positioned closer to a central portion of the substrate 2 than the discharge opening of the first nozzle 40.
Abstract: Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic substrate having a plurality of accelerators dispersed in the plastic substrate. The accelerators have a formula selected from the group consisting of: CuFe2O4??, Ca0.25Cu0.75TiO3??, and TiO2??, wherein ?, ?, ? denotes oxygen vacancies in corresponding accelerators and 0.05???0.8, 0.05???0.5, and 0.05???1.0. The method further includes removing at least a portion of a surface of the plastic substrate to expose at least a first accelerator. The method further includes plating the exposed surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.
Abstract: A solution of metal ink is mixed and then printed or dispensed onto the substrate using the dispenser. The film then is dried to eliminate water or solvents. In some cases, a thermal curing step can be introduced subsequent to dispensing the film and prior to the photo-curing step. The substrate and deposited film can be cured using an oven or by placing the substrate on the surface of a heater, such as a hot plate. Following the drying and/or thermal curing step, a laser beam or focused light from the light source is directed onto the surface of the film in a process known as direct writing. The light serves to photo-cure the film such that it has low resistivity.
Type:
Grant
Filed:
May 14, 2009
Date of Patent:
August 8, 2017
Assignees:
Applied Nanotech Holdings, Inc., Ishihara Chemical Co., Ltd.
Inventors:
Yunjun Li, David Max Roundhill, Mohshi Yang, Igor Pavlovsky, Richard Lee Fink, Zvi Yaniv
Abstract: The present invention relates to a photoalignment composition comprising a) 0.001 to 20%, by weight, preferably, 1 to 10% by weight, more preferably 1 to 9% by weight of at least one photoreactive compound (I) that comprises a photoalignment group and b) 80 to 99.999% by weight, preferably, 90 to 99% by weight, more preferably 91 to 99% by weight of at least one compound (II) that does not comprise a photoalignment group, and c) optionally at least one reactive or non reactive additives, and d) optionally at least one solvent. Further the present invention relates to the use of this photoalignment composition for the alignment of liquid crystals or liquid crystal polymers, in electro—optical and optical elements, systems and devices.
Type:
Grant
Filed:
December 17, 2008
Date of Patent:
July 25, 2017
Assignee:
ROLIC AG
Inventors:
Izabela Bury, Fabien Xavier Delbaere, Olivier Muller, Joachim Reichardt, Hubert Seiberle, Peggy Studer, Satish Palika
Abstract: A method of creating a localized deposition on a sample in a vacuum chamber having an ion source generating a positively-charged beam of ions and a separate source of primary radiation generating a beam of radiation. An ion beam from the ion source is directed toward the sample, and the primary radiation beam is applied to the sample to generate emitted electrons from the sample. The ion beam and the primary radiation beam are positioned so that the paths of at least some of the ions in the ion beam and the paths of at least some of the emitted electrons from the sample substantially overlap in space near the sample surface. The energy of the ions in the ion beam and the electric potential of the sample are adjusted to substantially prevent deposition of ions on the sample.
Abstract: Fabrication of a touch sensor panel using laser ablation is disclosed. The fabricated touch sensor panel can have its touch sensors formed from conductive layers disposed on a surface such as an undersurface of the panel's cover substrate. A fabrication method can include ablating a first conductive layer to define the first part of the touch sensors and then ablating a second conductive layer proximate to the first conductive layer to define the second part of the touch sensors. The touch sensor panel can be incorporated into a mobile telephone, a digital media player, or a personal computer.
Abstract: Disclosed is a formed article comprising a layer obtained by implanting ions of a hydrocarbon compound into a polyorganosiloxane compound-containing layer. Also disclosed are: a method of producing the formed article, the method comprising implanting ions of a hydrocarbon compound into a surface of a polyorganosiloxane compound-containing layer of a formed body that includes the polyorganosiloxane compound-containing layer in its surface; an electronic device member that includes the formed article; and an electronic device that includes the electronic device member. The present invention provides; a formed article which exhibits an excellent gas barrier capability, transparency, bendability, antistatic performance, and surface flatness; a method of producing the formed article, an electronic device member, and an electronic device.
Type:
Grant
Filed:
March 24, 2010
Date of Patent:
April 4, 2017
Assignee:
LINTEC CORPORATION
Inventors:
Shinichi Hoshi, Takeshi Kondo, Kazue Uemura, Yuta Suzuki
Abstract: A method of annealing a thin film deposited on a substrate. According to the method, the thin film deposited on the substrate is provided. The provided thin film is irradiated with electromagnetic radiation until a predetermined crystal quality of the thin film is achieved. The spectral band of the electromagnetic radiation is selected such that the thin film is substantially absorptive to the electromagnetic radiation and the substrate is substantially transparent to the electromagnetic radiation.
Abstract: A method of making a multilayer environmental barrier coating for a ceramic matrix composite is provided, comprising the steps of: plasma spray coating an oxide-based bond coat over top of the ceramic matrix composite and depositing a columnar top coat over the oxide-based bond coat.
Abstract: A method for forming a friction coating construction which utilizes the providing of a mixture of molten metal material with abrasive particles dispersed therethroughout in particulant form which is sprayed onto a flexible substrate which is of a metallic material being preferably ductile which is then allowed to harden and cool to allow the molten metal to affix the flexible support layer with respect to the metal material and with respect to the abrasive particles dispersed therethroughout thereby providing an enhanced friction control surface which can optionally include an adhesive layer on the surface of the flexible substrate positioned oppositely from the abrasive particles to allow this layer to be affixed to any subsurface surface which needs enhanced control of the coefficient of friction thereto.
Abstract: A method of making a gas separation membrane by providing a plating vessel with a volume of plating solution of gas-selective metal ions into which is placed a porous support. The plating solution is circulated over a surface of the porous support while maintaining conditions within the plating vessel so as to promote the electroless deposition. The circulation rate of the plating solution is such as to enhance the metal deposition onto the surface of the porous support in the formation of the gas separation membrane.