Abstract: An imaging optical system comprises adjusters for adjusting a shape of each of at least two reflecting surfaces by applying a force to a rear surface of each of the reflecting surfaces. Points obtained by projecting force acting points of the adjusters in an optical axis direction defined with respect to the reflecting surface are defined as correction points, the acting points are set such that, when first and second rays in a light flux emitted from one point on the object plane are reflected by first and second reflecting surfaces, the first ray strikes the correction point of the first reflecting surface but does not strike the correction point of the second reflecting surface, and the second ray does not strike the correction point of the first reflecting surface but strikes the correction point of the second reflecting surface.

Abstract: A method of processing a wafer is provided. The method includes providing a reference pattern for patterning a wafer. The reference pattern is independent of a working surface of the wafer. A placement of a first pattern on the working surface of the wafer is determined by identifying the reference pattern to align the first pattern. The first pattern is formed on the working surface of the wafer based on the placement.

Abstract: A pre-alignment system includes a common object lens group configured to collect diffracted beams from a patterning device, wherein the common object lens group is further configured to produce telecentricity in an object space of the pre-alignment system. The pre-alignment system also includes a multipath sensory array having at least one image lens system, wherein the at least one image lens system includes a telecentric converter lens configured to produce telecentricity in an image space of the pre-alignment system.

Abstract: In a method of cleaning a lithography system, during idle mode, a stream of air is directed, through a first opening, into a chamber of a wafer table of an EUV lithography system. One or more particles is extracted by the directed stream of air from surfaces of one or more wafer chucks in the chamber of the wafer table. The stream of air and the extracted one or more particle are drawn, through a second opening, out of the chamber of the wafer table.

Abstract: A measuring apparatus for measuring a planar relative motion between a tool attacher and a work attacher of a machine tool includes at least one image capturing element capable of performing image capturing at a first position, a second position, and a third position, which are not located on the same line. The image capturing elements at the first position, the second position, and the third position are caused to capture a first point, a second point, and a third point, respectively, arranged on at least one plane of an XY-plane, an XZ-plane, and a YZ-plane. The image capturing element at the second position and the image capturing element at the third position are caused to capture the first point, the image capturing element at the first position and the image capturing element at the third position are caused to capture the second point, and the image capturing element at the first position and the image capturing element at the second position are caused to capture the third point.

Abstract: A method for calibrating a mirror of an interferometer system configured to measure a position of an object using two interferometers of the interferometer system that are arranged at opposite sides of the object and configured to measure the position of the object in the same X-direction, wherein two sets of measurements are obtained for different rotational orientations about an axis perpendicular to the X-direction to determine a shape of the mirror. There is also provided a position measuring method in which the obtained shape of the mirror is used to adjust measurements in the X-direction, a lithographic apparatus and a device manufacturing method making use of such a lithographic apparatus.

Abstract: The present disclosure provides an automatic berthing image ranging system for vessels and operation method thereof, the method comprising: obtaining a reference image around a position in which a vessel is located, the reference image comprises a first pattern and at least two second patterns; the reference image is projected to a reference plane to generate projection coordinates corresponding to the first pattern and the at least two patterns; determining a positional relationship between the vessel and a port by a predetermined distance, and the positional relationship is represented by an angle value.

Abstract: A calibrated lithographic model may be used to generate a lithographic model output based on an integrated circuit (IC) design layout. Next, at least a chemical parameter may be extracted from the lithographic model output. A calibrated defect rate model may then be used to predict a defect rate for the IC design layout based on the chemical parameter.

Abstract: A light source apparatus includes a first light source that emits first light belonging to a first wavelength band, a second light source that emits second light belonging to a second wavelength band, a wavelength converter that contains a phosphor and converts the first light into third light belonging to a third wavelength band different from the first, a first heat dissipation member that includes a plurality of first fins and dissipates heat generated by the first light source, a second heat dissipation member that includes a plurality of second fins and dissipates heat generated by the second light source, and a first direction wherein first channels, specified by the gaps between the first fins and along which a refrigerant is supplied, extend coincides with a second direction wherein second channels, specified by the gaps between the second fins and along which the refrigerant is supplied, extend.

Abstract: A method for forming alignment marks leverages pad density and critical dimensions (CDs). In some embodiments, the method includes forming first and second alignment marks on a first substrate and a second substrate where the alignment marks have a width within 5% of the associated CD of copper pads on the respective substrates and forming a first and second dummy patterns around the first and second alignment marks. The first and second dummy patterns have dummy pattern densities within 5% of the respective copper pad density of the first and second substrates and CDs within 5% of the respective copper pad CDs. In some embodiments, alignment marks with physical dielectric material protrusions and recesses on opposite substrate surfaces may further enhance bonding.

Abstract: A stud attachment device for attaching a plurality of studs to a photomask constituting a reticle. The stud attachment device including a body; a plurality of holders extending from the body, the holders allowing the studs to be laid thereon, respectively; and a pressure regulator for independently controlling pressures of the holders when the studs are attached to the photomask.

Abstract: The present application relates to contact immersion lithography exposure units and methods of their use. An example contact exposure unit includes a container configured to contain a fluid material and a substrate disposed within the container. The substrate has a first surface and a second surface, and the substrate includes a photoresist material on at least the first surface. The contact exposure unit includes a photomask disposed within the container. The photomask is optically coupled to the photoresist material by way of a gap comprising the fluid material. The contact exposure unit also includes an inflatable balloon configured to be controllably inflated so as to apply a desired force to the second surface of the substrate to controllably adjust the gap between the photomask and the photoresist material.

Abstract: A system for hand detection on a steering wheel. The system includes: at least one light source adapted to emit an emitted signal of light so that the emitted signal is directed from inside the steering wheel to at least one detection area of a surface of the steering wheel, the detection area being at least partially transparent for the emitted signal; at least one light sensor adapted to detect a reflected signal, which is a part of the emitted signal that is reflected from the detection area into the inside of the steering wheel; and a detection unit coupled to the at least one light sensor and adapted to detect a hand of a user on the steering wheel based on a detection of the reflected signal.

Abstract: A method to improve a lithographic process for imaging a portion of a patterning device pattern onto a substrate using a lithographic projection having an illumination system and projection optics, the method including: (1) obtaining a simulation model that models projection of radiation by the projection optics, wherein the simulation model models an effect of an obscuration in the projection optics, and configuring, based on the model, the portion of the patterning device pattern, and/or (2) obtaining a simulation model that models projection of radiation by the projection optics, wherein the simulation model models an anamorphic demagnification of radiation by the projection optics, and configuring, based on the model, the portion of the patterning device pattern taking into account an anamorphic manufacturing rule or anamorphic manufacturing rule ratio.

Abstract: The present disclosure relates to systems and methods relating to the fabrication of light guide elements. An example system includes an optical component configured to direct light emitted by a light source to illuminate a photoresist material at one or more desired angles so as to expose an angled structure in the photoresist material. The photoresist material overlays at least a portion of a first surface of a substrate. The optical component includes a container containing a light-coupling material that is selected based in part on the one or more desired angles. The system also includes a reflective surface arranged to reflect at least a first portion of the emitted light to illuminate the photoresist material at the one or more desired angles.

Abstract: A focusing optical part, including a plastic body, suitable for being delivered on a tape and reel and mounted on a PCB by an automated mounting machine, the plastic body including a concave mirror including a center aperture input surface through which light enters the plastic body, a convex mirror opposite the center aperture, wherein the concave mirror and the convex mirror form a reflective objective that reflects and focuses the light inside the plastic body, and an exit surface surrounding the convex mirror, through which focused light exits the plastic body.

Abstract: An alignment mark count acquiring method includes: acquiring a first time at which an exposure machine performs exposure of a first wafer, and acquiring a second time at which the exposure machine performs alignment of a second wafer; acquiring a first buffer time between the second time and the first time when the first time is less than the second time; determining a target alignment mark count of the second wafer according to the exposure parameters of the first wafer and the corresponding relationship when the first buffer time is greater than a preset value, wherein the corresponding relationship is the relationship between the exposure parameters and the alignment mark counts, and the corresponding relationship is used to make the first buffer time to be less than or equal to the preset value; and outputting the target alignment mark count.

Abstract: Some implementations described herein provide an exposure tool. The exposure tool includes a reticle deformation detector and one or more processors configured to obtain, via the reticle deformation detector, reticle deformation information associated with a reticle during a scanning process for scanning multiple fields of a wafer. The one or more processors determine, based on the reticle deformation information, a deformation of the reticle at multiple times during the scanning process, and perform, based on the deformation of the reticle at the multiple times, one or more adjustments of one or more components of the exposure tool during the scanning process.

Abstract: An overlay error measurement method includes disposing a lower-layer pattern over a substrate that includes disposing a first pattern having a first plurality of first sub-patterns extending in a first interval along a first direction and being arranged with a first pitch in a second direction crossing the first direction. The method includes disposing a second pattern having a second plurality of second sub-patterns extending in a second interval along the first direction and being arranged with a second pitch, smaller than the first pitch, in the second direction crossing the first direction. The second sub-patterns are disposed interleaved between the first sub-patterns. The method includes disposing an upper-layer pattern including a third pattern having the first pitch and at least partially overlapping with the lower-layer pattern over the lower-layer pattern and determining an overlay error between the lower-layer pattern and the upper-layer pattern.

Abstract: An apparatus for and method of sensing multiple alignment marks in which the optical axis of a detector is divided into multiple axes each of which can essentially simultaneously detect a separate alignment mark to generate a signal which can then be multiplexed and presented to a single detector or multiple detectors thus permitting more rapid detection of multiple marks.