Abstract: A method for determining adjustment to a patterning process. The method includes obtaining a probability density function of a parameter related to a feature of a substrate subject to the patterning process based on measurements of the parameter, determining an asymmetry of the probability density function, and determining an adjustment to the patterning process based on the asymmetry of the probability density function of the parameter so as to reduce a probability of the feature having a parameter value that falls outside a range between threshold values of the parameter.

Abstract: A method for designing a photomask includes calculating an open ratio of an initial photomask to determine whether the open ratio of the initial photomask is less than 25%, and then changing a design of the initial photomask in response to determining the open ratio is less than 25%, such that a changed photomask has a reverse tone to the design of the initial photomask, and an open ratio of the changed photomask is 75% or more. The method can solve the issue caused by thermal expansion of the photomask.

Abstract: A method to improve a lithographic process for imaging a portion of a patterning device pattern onto a substrate using a lithographic projection having an illumination system and projection optics, the method including: (1) obtaining a simulation model that models projection of radiation by the projection optics, wherein the simulation model models an effect of an obscuration in the projection optics, and configuring, based on the model, the portion of the patterning device pattern, and/or (2) obtaining a simulation model that models projection of radiation by the projection optics, wherein the simulation model models an anamorphic demagnification of radiation by the projection optics, and configuring, based on the model, the portion of the patterning device pattern taking into account an anamorphic manufacturing rule or anamorphic manufacturing rule ratio.

Abstract: The present disclosure relates to systems and methods relating to the fabrication of light guide elements. An example system includes an optical component configured to direct light emitted by a light source to illuminate a photoresist material at one or more desired angles so as to expose an angled structure in the photoresist material. The photoresist material overlays at least a portion of a first surface of a substrate. The optical component includes a container containing a light-coupling material that is selected based in part on the one or more desired angles. The system also includes a reflective surface arranged to reflect at least a first portion of the emitted light to illuminate the photoresist material at the one or more desired angles.

Abstract: A positioning device configured to displace an object is disclosed. The positioning device comprises a stage to support the object, an actuator to move the stage with respect to a reference in a direction of movement, a balance mass arranged between the actuator and the reference to reduce transfer of reaction forces from the actuator to the reference, a support device arranged between the reference and the balance mass to support the balance mass, and a gravity compensator acting between the reference and the balance mass to exert a lifting force on the balance mass to reduce a gravitational support force to be provided by the support device to support the balance mass.

Abstract: An extreme ultraviolet light generation device according to an aspect of the present disclosure includes: a chamber; a mirror configured to condense extreme ultraviolet light radiated from plasma generated by irradiating a target supplied into the chamber with a laser beam; an electromagnet disposed outside the chamber to form a magnetic field between a generation region of the plasma in the chamber and the mirror; a current inversion device configured to invert the direction of current flowing through the electromagnet; and a controller configured to control the current inversion device to invert the direction of the current when a set condition is satisfied.

Abstract: Disclosed is a lithography process on a sample including at least one structure and covered by at least a lower layer of resist and a upper layer of resist the process including: using an optical device to image or determine, in reference to the optical device, a position of the selected structure and positions of markers integral with the sample; using an electron-beam device, imaging or determining the position of each marker in reference to the electron-beam device; deducing the position of the selected structure in reference to the electron-beam device; exposing to an electron beam the upper layer of resist above the position of the selected structure to remove all the thickness of the upper layer of resist above the position of the selected structure but none or only part of the thickness of the lower layer of resist above the position of the selected structure.

Abstract: A system for indicating points equidistant from a line is provided, as well as devices and methods of doing the same. The system may include a housing; and a laser supported by the housing, the laser being configured to emit laser light from the housing in both a first direction and an opposing second direction; wherein the emitted light in the first direction is configured to include an indicator and the emitted light in the second direction is configured to include a corresponding indicator, and wherein the indicator and the corresponding indicator are configured to be projected onto the surface at about the same distances from the point on the surface.

Abstract: A method of calibrating a projection system heating model to predict an aberration in a projection system in a lithographic apparatus, the method comprising passing exposure radiation through a projection system to expose one or more exposure fields on a substrate provided on a substrate table, making measurements of the aberration in the projection system caused by the exposure radiation, wherein the time period between measurements is less than the time period that would be taken to expose all exposure fields on the substrate.

Abstract: A method for optimizing a sequence of processes for manufacturing of product units, includes: associating measurement results of performance parameters (e.g., fingerprints) with the recorded process characteristics (e.g., context); obtaining a characteristic (e.g., context) of a previous process (e.g. deposition) in the sequence already performed on a product unit; obtaining a characteristic (e.g., context) of a subsequent process (e.g., exposure) in the sequence to be performed on the product unit; determining a predicted performance parameter (e.g., fingerprint) of the product unit associated with the sequence of previous and subsequent processes by using the obtained characteristics to retrieve measurement results of the performance parameters (e.g., fingerprints) corresponding to the recorded characteristics; and determining corrections to be applied to future processes (e.g. exposure, etch) in the sequence to be performed on the product unit, based on the determined predicted performance parameter.

Abstract: A system and method for measuring. The system has at least one rail with a downstream end and an upstream end. There is a deflector at a downstream end which is used in conjunction with a measurement laser which is coupled to a shuttle. The shuttle is moveable relative to the rail. The shuttle also has a sight for zeroing in on the item to be measured.

Abstract: A mask fork, configured to transfer a mask from a standard mechanical interface pod. The standard mechanical interface pod includes a plurality of supports having a L-shaped cross section. Each of the plurality of supports includes a connecting section extending horizontally and a supporting section extending vertically, and the connecting section has a bottom to which a limiting section is fixed. The mask fork includes a fork body and two tines connected to the fork body in symmetry with each other. Each of the tines comprises a transfer member configured to support the mask during a transfer of the mask and anti-collision members including a first anti-collision member extending horizontally and a second anti-collision member extending vertically. The first anti-collision member is horizontally attached to a side of the transfer member facing away from the mask.

Abstract: A handheld wand comprises a probe at a distal end of the elongate handheld wand. The probe includes a light projector and a light field camera. The light projector includes a light source and a pattern generator configured to generate a light pattern. The light field camera includes a light field camera sensor, the light field camera sensor comprising an image sensor comprising an array of sensor pixels, and an array of micro-lenses disposed in front of the image sensor such that each micro-lens is disposed over a sub-array of the array of sensor pixels.

Abstract: A substrate holder, a method of manufacturing of the substrate holder and a lithographic apparatus having the substrate holder. In one arrangement, a substrate holder is for use in a lithographic apparatus. The substrate holder is configured to support a lower surface of a substrate. The substrate holder has a main body, a plurality of burls and a coating. The main body has a substrate-facing face. The plurality of burls protrudes from the substrate-facing face. Each burl has a distal end configured to engage with the substrate. The distal ends are configured for supporting the substrate. The coating is on the substrate-facing face between the burls. Between the burls the substrate-facing face has an arrangement of areas. Adjacent areas are separated by a step-change in distance below the support plane. Each step-change is greater than a thickness of the coating.

Abstract: A display device including: a substrate having display area and a non-display area; and an alignment mark disposed in the non-display area of the substrate. The alignment mark includes a quadrangular-shaped center portion and a plurality of measurement portions that surround the center portion, the plurality of measurement portions including four or more measurement portions, and each of the measurement portions including sides that are parallel with two sides of the quadrangular-shaped center portion.

Abstract: Disclosed are systems and methods for achieving sub-diffraction limit resolutions for fabrication of integrated circuits. In one embodiment, a photolithography system is disclosed. The system includes a light source, configured to emit laser beams; a reflector configured to receive the laser beams and focus the laser beams on a condensing lens; a scattering medium, configured to receive the laser beams and generate scattered laser beams; and a wave-front shaping module, configured to receive the scattered laser beams and generate a focused laser beam on a silicon wafer.

Abstract: A device manufacturing method includes: exposing a first substrate using a lithographic apparatus to form a patterned layer having first features; processing the first substrate to transfer the first features into the first substrate; determining displacements of the first features from their nominal positions in the first substrate; determining a correction to at least partly compensate for the displacements; and exposing a second substrate using a lithographic apparatus to form a patterned layer having the first features, wherein the correction is applied for or during the exposing the second substrate.

Abstract: An exposure apparatus that projects a pattern of an original onto a substrate via a projection optical system and exposes the substrate is provided. The apparatus comprises an aberration correction member arranged on an optical path of exposure light between the original and the substrate, and a driver which drives the aberration correction member. The aberration correction member includes a first optical element including a first surface having a three-fold rotational symmetric aspherical shape with respect to an optical axis of the exposure light, and a second optical element spaced apart from the first optical element along the optical axis and including a second surface facing the first surface and having an aspherical shape that complementarily corrects an aberration generated by the first optical element.

Abstract: A method for overlay monitoring including: obtaining a secondary electron image and a backscattered electron image of as area of the substrate in which an array of first structural elements are positioned at a surface of the substrate and a second array of second structural elements are positioned below the first array; determining locations of the first structural elements within the secondary electron image; defining regions of interest in the backscattered electron image, based on the locations of the first structural elements; processing pixels of the backscattered electron image that are located within the regions of interest to provide a backscattered electron representation of a second structural element; and calculating an overlay error based on location information regarding the second structural element within the backscattered electron representation of the second structural element and on location information regarding of at least one first structural element in the secondary electron image.

Abstract: A metrology system may include one or more casings that fit within an interior cavity of a sample transport device, an illumination source within one of the one or more casings, one or more illumination optics within one of the one or more casings for directing illumination from the illumination source to a sample located in the interior cavity of the sample transport device, one or more collection optics within one of the one or more casings for light from the sample in response to the illumination from the illumination source, and one or more detectors within one of the one or more casings for generating metrology data based on at least a portion of the light collected by the one or more collection optics.