Abstract: A card cage for holding a plurality of printed circuit boards has aerodynamically designed card guides and air deflectors that are configured to direct air flow across components mounted on the printed circuit boards. The card cage has a substantially rectangular frame formed by a pair of side panels, a pair of upper cross members and a pair of lower cross members. A pair of upper card guides are mounted between the upper cross members and a pair of lower card guides are mounted between the lower cross members, the card guides being captively held in parallel relationship to the side panels. The inner facing surface of each card guide is provided with a U-shaped channel that is sized and shaped to slidably receive a printed circuit card. The sidewalls of each card guide taper inwardly from the inner facing surface to the outer facing surface to form a streamlined structure with a narrow head at the outer surface that provides minimum resistance to air flow through the card cage.

Abstract: A mounting system for mounting an expansion card inside a computer chassis includes a mounting bracket having a combination board mounting clip and chassis mounting tab formed as an integral unit in which the bracket releasebly fastens to a corner of the expansion card. The expansion card has a bottom edge connector for plugging into an expansion card socket at the base of the computer chassis inside the expansion slot. The computer chassis also has a removeable cover plate on a panel of the chassis for shielding the expansion slot. The board mounting clip releasably fastens to the expansion card by engaging the opposite faces of the board in a continuous frictional means of attachment without the use of external fastening means.

Abstract: A protective carrier (2) has a flexible circuit (6) attached thereto, the protective carrier (2) protecting the circuit (6) during transportation and handling thereof. The flexible circuit (6) is attached to the protective carrier (2) in such a manner as to ensure proper registration and to maintain the center of all components in coincidence as dimensional change occurs due to the different temperature coefficient of expansion of each component. The protective carrier (2) can be used to orient, position, and install an integrated circuit chip carrier (8) and lead frame (4) on an interposer socket (30). As the lead frame (4) has a large number of contact zones positioned thereon, contact force is required between the interposer socket (30) and the lead frame (4).

Abstract: A printed wiring board comprising a main printed wiring board provided with a first wiring pattern, and an auxiliary flexible printed wiring board, provided with a second wiring pattern for modifying the first wiring pattern and bonded to the main printed wiring board so as to electrically connect the second wiring pattern to a desired part of the first wiring pattern. The auxiliary board may be affixed to the main board with a pressure-sensitive adhesive or thermosetting adhesive. The auxiliary board may be provided with marks for facilitating alignment, holes to provide access to the main board, a dummy pattern for preventing tears of the flexible auxiliary board, and a second dummy pattern to prevent warping from uneven stresses applied to the flexible auxiliary board by differences in thermal expansion of the auxiliary board and the pattern printed thereon. A method of making the board is also disclosed and claimed.

Abstract: An input card (7) is put in communication with apparatuses (16) the operation of which is to be monitored in order to initiate certain operations. A terminal-box (13) is interposed between the card (7), which possesses detector circuits (17), and the members (16).The two ends of each circuit (17) are associated with a respective inner terminal (12) of the terminal-box (13), and the two ends of each member (16) are associated with a respective outer terminal (14) of the terminal-box (13). Shunts (19,21) mounted in the terminal-box and connected to supply terminals (14a,14b) put one of the ends of each circuit (17) or member (16) at a common potential. The other terminal of each member (16) is connected to the other terminal of a circuit (17) by means of a connection (18).The invention is used to avoid the need for auxiliary terminal-boxes and cards with a common potential point.

Abstract: There is disclosed a method of fabricating a folded printed circuit board. The method includes the steps of forming first and second apertures in a rigid board along a common line which line is parallel to a side edge of a board then scoring the line to form a break area for said board. The next step includes the formation of terminal areas on each side of the apertures on opposite sides of the line and forming component terminal areas for said board. Automatically inserting said components into said rigid board, while automatically inserting larger diameter wire conductors into said terminal areas to bridge said apertures, breaking the board along the scored line and folding the board with said wires across the apertures forming hinge assemblies for said board.

Abstract: A connection system for connecting a flexible circuit having a row of printed contact areas to a PC board having a corresponding row of terminal posts employs a connector having a housing with a bottm wall and a pair of side walls at least one of which is movable with respect to the other. A row of post-receiving passages are present in the bottom wall which passages are arranged to receive the posts of the PC board. An edge margin of the flexible circuit is clamped between the housing side walls so that the contact areas thereon are aligned with the passages in the housing bottom wall and a set of springs positioned inside the housing flexes the circuit edge margin so that when the movable housing side wall is in its closed position, the row of contact areas overhang the passages in the housing bottom wall.

Abstract: A semiconductor device module includes a package and a holder, the package includes, for example, a central processing unit, and the holder accommodates a removable leadless chip carrier. The holder comprising contact leads connected to electrode pads of the package. The leadless chip carrier also includes, for example, an erasable programmable read only memory, whereby the leadless chip carrier can be easily removed from the holder, resulting in easily writing into the erasable programmable read only memory or easy replacement of the leadless chip carrier.

Abstract: Disclosed are air seals adapted to be so engaged in a receiving card rack slot as to thrust out against the opposed slot bases and thus establish "base-engaging" retention forces, this effected in some embodiments by forming a base-engaging flexure strip along each tongue of the seal to that, despite dimensional and other variations, each flexure strip will be thrust-away somewhat from its slot-forming channel, when the seal is firmly seated in a slot.

Abstract: A circuit pattern on the surface of a printed circuit board is used as a guide and connection circuit for closely spaced contacts of a connector to be connected to the circuit board. The contacts of the connector are closely spaced and possibly would not contact the connection pads or might be located between connection pads because of the close spacing of the contacts. The guides formed from circuit patterns accurately guide the connector to the connector pads on the circuit board and place each contact over its respective circuit connection pad.

Abstract: A high density connector for connecting to the edge of a printed circuit board uses two different contact terminals, one of which is reversible, and a spacing block to guide the contact terminals into the connector and to maintain close spacing of the contacts on each side of the printed circuit board. The connector housing has openings in the center of the housing to allow for expansion of the housing material and to provide for an optional grounding bus.

Abstract: A heat sink device assembly providing a radially finned heat sink with a tapered base is provided for application to surface-encumbered integrated circuit packages for heat dissipation purposes. The device involves a patterned set of radial fin elements, through which cooling air flow may pass, mounted on a baseplate. A taper or reduction in cross sectional area of the baseplate is provided in order to maximize the surface area for heat dissipation while constraining the area of attachment, thus avoiding physical or electrical contact with peripheral objects or areas placed on the surface edges of the integrated circuit package.

Abstract: A flexible electrical connection, and method for making such a connection, for mounting an electronic device, such as a semiconductor chip made primarily of silicon, on an organic substrate, such as a printed circuit board made of a glass material impregnated with epoxy resin, are disclosed. The flexible electrical connection comprises a circuit line attached to the surface of the organic substrate and having a floating terminus in a relatively low adhesive area of the organic substrate where it is desired to mount the electronic device on the organic substrate. The floating terminus includes a stress relief bend, and the flexible electrical connection relieves stresses, such as thermal stresses, which may otherwise damage the physical and/or electrical connection between the electronic device and the floating terminus of the flexible electrical connection when the electronic device is mounted on the surface of the organic substrate.

Abstract: A flux-cored, gas shielded welding electrode is disclosed having a generally tubular sheath and a core defined within the sheath, wherein the core includes a slag forming system consisting essentially from about 3 to 12 percent titanium dioxide, less than about 2 percent calcium fluoride, and from about 0.1 to 1.0 percent sodium oxide, potassium oxide or other arc stabilizer, based on the total electrode weight. The electrode of the present invention further includes from about 0.003 to 0.08 percent boron based on the total electrode weight.

Abstract: A universal wafer scale assembly substrate includes an orthogonal multilayer matrix of conductive paths that, inter alia, define a plurality of chip sites. The paths defining the chip sites are provided with termination pads at the ends thereof proximate the site.

Abstract: A capacitor built-in integrated circuit packaged unit comprising an electrically conductive support member, first and second lead elements associated with the conductive support member, a stack of a plurality of layers comprising a first insulating layer of a highly dielectric material formed on the conductive support member, an electrically conductive layer on the first insulating layer, and a second insulating layer on the conductive layer, the conductive layer having a portion exposed by the second insulating layer, a semiconductor integrated circuit chip having first and second electrodes which are electrically isolated from each other, the second insulating layer intervening between the conductive layer and the semiconductor integrated circuit chip, a bonding wire electrically connecting the first electrode to the first lead element, and a bonding wire electrically connecting the second electrode to the exposed portion of the conductive layer and to the second lead element.

Abstract: In an acid alkylation process wherein a fresh isobutane stream is combined with an olefin stream to form a combined isobutane olefin feed stream, a control system maintains a desired ratio of isobutane to olefin in the combined feed stream by manipulating the flow rate of the fresh isobutane stream. In addition, the controller automatically compensates for the effect of changes in the fresh isobutane feed stream by making equal changes in the flow rate of reactor effluent. Thus, the liquid level in the alkylation reactor is unaffected by changes made in the fresh isobutane stream to maintain the desired isobutane to olefin ratio.

Abstract: A multilayer wiring board structure includes a plurality of conductor layers and insulation layers interleaved between each ones of the conductor layers. The conductor layers includes power (or ground) line layers and signal line layers, and one type of insulation layer having lower relative permittivity and another type of insulation layer having higher relative permittivity is used between power (ground) line layers interposed by signal line layer(s).

Abstract: An expandable moulded cabinet for housing printed circuit boards, which is modular and uses only two kinds of parts. Instead of printed circuit board retainers and a backplane being fastened to a cabinet frame, which would require careful attention to tolerances, the retainers are held by the cabinet in approximately correct positions, and the backplane is supported by and is fixed directly to the retainers alone, and not the cabinet. Thus the only precision tolerances required are to the locations on the backplane where the printed circuit board retainers are supported. An inexpensive and versatile cabinet results.

Abstract: In a multilayer circuit board wherein a plurality of electronic parts are provided on a first principal plane, a plurality of brazing pads for pins are respectively arranged on a second principal plane and a plurality of wiring layers having wiring nets for connecting said electrical parts are formed between these principal planes. The EC pads for I/O leads for connecting discrete wires is provided to said first principal plane. EC pads are provided on said second principal plane and are connected to the brazing pads for pins in such a manner as to be electrically separable as required. The EC pads for I/O leads and the brazing pads for pins are connected through the interior of the multilayer circuit board and the EC pads are connected to the wiring net through the interior of the multilayer circuit board.