Abstract: An inductor device includes a first trace, a second trace, a first capacitor, and at least one connection element. The first trace includes at least two sub-traces. One terminal of the at least two sub-traces is coupled to a first node. The second trace includes at least two sub-traces. One terminal of the at least two sub-traces is coupled to a second node. The first capacitor is coupled between the first node and the second node. The at least one connection element is coupled to another terminal of the at least two sub-traces of the first trace and another terminal of the at least two sub-traces of the second trace, such that the first trace and the second trace form a closed loop.

Abstract: Methods of making packaged surface acoustic wave devices are provided. The method may include forming a photosensitive resin coat over a cavity-defining structure encapsulating a surface acoustic wave device. The photosensitive resin coat may be formed using a spin-coating process, and then patterned to form a desired shape. Portions of the photosensitive resin may be removed from areas near the edge of the die, to facilitate separation of a wafer into individual dies. The method may also include forming a conductive structure using a plating process, where the conductive structure is located between the resin coat and the cavity defining structure. The photosensitive resin can include a phenol resin. The packaged surface acoustic wave devices made using a photosensitive resin coat may be relatively thin, and may have a height of less than 220 micrometers.

Abstract: An apparatus and method for a frequency based integrated circuit that selectively filters out unwanted bands or regions of interfering frequencies utilizing one or more tunable notch or bandpass filters or tunable low or high pass filters capable of operating across multiple frequencies and multiple bands in noisy RF environments. The tunable filters are fabricated within the same integrated circuit package as the associated frequency based circuitry, thus minimizing R, L, and C parasitic values, and also allowing residual and other parasitic impedance in the associated circuitry and IC package to be absorbed and compensated.

Abstract: A tunable filter with wide tuning range and high out-of-band rejection is achieved with a tunable bandpass filter and a number of cascaded, fixed frequency Lame-Mode Resonators (LMRs) notch filters or other resonators. In some embodiments, the filter can be implemented with all of the elements on an integrated circuit, saving space for use in applications such as mobile phones or other mobile communication devices.

Abstract: Acoustic resonators and filter devices, and methods for making acoustic resonators and filter devices. An acoustic resonator includes a substrate having a surface and a single-crystal piezoelectric plate having front and back surfaces. The back surface is attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. A conductor pattern formed is formed on the front surface of the piezoelectric plate, including an interdigital transducer (IDT) with interleaved fingers of the IDT on the diaphragm. An insulating layer is formed between the piezoelectric plate and portions of the conductor pattern other than the interleaved fingers.

Abstract: Band N77 bandpass filters include a first plurality of transversely-excited film bulk acoustic resonators (XBARs) on a first chip comprising a first rotated YX-cut lithium niobate piezoelectric plate having a thickness less than or equal to 535 nm, and a second plurality of XBARs on a second chip comprising a second rotated YX-cut lithium niobate piezoelectric plate having a thickness greater than or equal to 556 nm. A circuit card is coupled to the first chip and the second chip. The circuit card includes conductors for making electrical connections between the first chip and the second chip.

Abstract: Aspects of this disclosure relate to a band pass filter that includes LC resonant circuits coupled to each other by a capacitor. A bridge capacitor can be in parallel with series capacitors, in which the series capacitors include the capacitor coupled between the LC resonant circuits. The bridge capacitor can create a transmission zero at a frequency below the passband of the band pass filter. The LC resonant circuits can each include a surface mount capacitor and a conductive trace of the substrate, and an integrated passive device die can include the capacitor. Band pass filters disclosed herein can be relatively compact, provide relatively good out-of-band rejection, and relatively low loss.

Abstract: An acoustic wave device includes a support substrate, a piezoelectric layer provided over the support substrate, comb-shaped electrodes disposed on the piezoelectric layer, each of the comb-shaped electrodes including electrode fingers exciting an acoustic wave, a temperature compensation film interposed between the support substrate and the piezoelectric layer and having a temperature coefficient of an elastic constant opposite in sign to that of the piezoelectric layer, a boundary layer interposed between the support substrate and the temperature compensation film, an acoustic velocity of a bulk wave propagating through the boundary layer being higher than an acoustic velocity of a bulk wave propagating through the temperature compensation film and being lower than an acoustic velocity of a bulk wave propagating through the support substrate, and an intermediate layer interposed between the support substrate and the boundary layer and having a Q factor less than a Q factor of the boundary layer.

Abstract: An electromagnetic field band-stop filter includes a plurality of unit structures that have reflection characteristics on an electromagnetic wave of a predetermined frequency. Each of the plurality of unit structures includes: a plurality of electrode parts each of which is disposed along a side of a polygon in a non-contact manner with another electrode part; and a plurality of conductor parts which are provided for the plurality of electrode parts on a one-to-one basis and each of which has at least one bent portion between one end and other end, the one ends of the plurality of conductor parts being connected to the electrode parts on a one-to-one basis and the other ends of the plurality of conductor parts being connected at one point on an inner side of the electrode parts in the individual unit structure.

Abstract: Certain aspects of the present disclosure provide a filter circuit and techniques for filtering using the filter circuit. The filter circuit generally includes a first filter stage having a first acoustic wave resonator coupled in a series path between a first port of the filter circuit and a second port of the filter circuit, a first inductor-capacitor (LC) tank circuit, a first capacitor coupled between a first terminal of the first acoustic wave resonator and the first LC tank circuit, the first LC tank circuit being coupled between the first capacitor and a reference potential node, and a second capacitor coupled between a second terminal of the first acoustic wave resonator and the first LC tank circuit. In some aspects, the filter circuit includes one or more other filter stages coupled to the first filter stage.

Abstract: Devices and methods related to film bulk acoustic resonators. In some embodiments, a film bulk acoustic resonator can be manufactured by a method that includes forming a first electrode having a first lateral shape and providing a piezoelectric layer on the first electrode. The method can further include forming a second electrode having a second lateral shape on the piezoelectric layer such that the piezoelectric layer is between the first and second electrodes. The forming of the first electrode and the forming of the second electrode can include selecting and arranging the first and second lateral shapes to provide a resonator shape defined by an outline of an overlap of the first and second electrodes, such that the resonator shape includes N curved sections joined by N vertices of an N-sided polygon, and such that the resonator shape has no axis of symmetry.

Abstract: Surface acoustic wave devices and related methods. In some embodiments, a surface acoustic wave device for providing resonance of a surface acoustic wave having a wavelength ? can include a quartz substrate and a piezoelectric plate formed from LiTaO3 or LiNbO3 disposed over the quartz substrate. The piezoelectric plate can have a thickness greater than 2?. The surface acoustic wave device can further include an interdigital transducer electrode formed over the piezoelectric plate. The interdigital transducer electrode can have a mass density ? in a range 1.50 g/cm3<??6.00 g/cm3, 6.00 g/cm3<??12.0 g/cm3, or 12.0 g/cm3<??23.0 g/cm3, and a thickness greater than 0.148?, greater than 0.079?, or greater than 0.036?, respectively.

Abstract: Acoustic resonators are disclosed. An acoustic resonator includes a substrate having a surface and a single-crystal piezoelectric plate having front and back surfaces. The back surface is attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. An interdigital transducer (IDT) is formed on the front surface of the piezoelectric plate. The IDT includes: a first busbar and a second busbar disposed on respective portions of the piezoelectric plate other than the diaphragm; a first set of elongate fingers extending from the first bus bar onto the diaphragm; and a second set of elongate fingers extending from the second bus bar onto the diaphragm, the second set of elongate fingers interleaved with the first set of elongate fingers.

Abstract: An EMI filter arrangement includes a noise source, an input filter connected to the input of the noise source, and an output filter connected to the output of the noise source, the noise source, input filter and output filter provided in an electrically conductive electronics box, and an input filter capacitor electrically connecting the input filter to the electrically conductive electronics box and an output filter capacitor electrically connecting the output filter to the electrically conductive electronics box; the arrangement characterised by further comprising an intermediate reference plane provided in the electrically conductive electronics box, and an intermediate capacitor provided in the electrically conductive electronics box electrically connected between the intermediate reference plane and the electrically conductive electronics box, the input filter capacitor and the output filter capacitor being electrically connected to the box via the intermediate reference plane and the intermediate capaci

Abstract: The present invention includes a method of a low cost, reliable novel broadband inductor that can be used with a capacitor to form a broadband filter.

Abstract: The present disclosure relates to a broadband filter for confining or attenuating electromagnetic interference noise from one or more electrical signal sources, In an embodiment, the broadband filter comprises one or more filter stages electrically coupled by galvanic or by electromagnetic means to the one or more electrical signal sources for confining or attenuating conducted electromagnetic interference noise; one or more conductive shields electrically coupled by galvanic or by electromagnetic means to the electrical signal sources wherein the shields encapsulate the filter stages for confining or attenuating conducted and/or radiated electromagnetic interference noise; and one or more conductive partition layers to encapsulate the one or more filter stages such that the partition layers electromagnetically couple adjacent filter stages for a selected frequency range of the electromagnetic interference noise. The thickness of the conductive partition layers is chosen to control the degree of coupling.

Abstract: An electronic device may include wireless circuitry having an LC filter. The LC filter may include first and second series inductors coupled between the input and output of the LC filter. An input capacitor can be coupled at the input of the LC filter, and an output capacitor can be coupled at the output of the LC filter. Feedforward capacitors can be cross-coupled with the first and second series inductors to at least partially or fully cancel out any parasitic capacitance associated with the first and second series inductors to mitigate any undesired self-resonant effects associated with the series inductors.

Abstract: A coupled-line rat-race coupler includes four ports and four coupled-lines each composed of two metal lines. Two of the ports are respectively connected with the front ends of the two lines of the first coupled-line, and the other two ports are respectively connected with the front ends of the two lines of the second coupled-line. The two lines of the third coupled-line are short circuited and respectively connected with the back end of one line of the first coupled-line on one side and with the back end of one line of the second coupled-line on the other side. In the fourth coupled-line, one line is open at one end and short circuited at the other end with the other line, which is connected with one line of the first coupled-line and one line of the second coupled-line. The coupled-line rat-race coupler is characterized with smooth and stable output phase.

Abstract: An RF diplexer circuit device using modified lattice, lattice, and ladder circuit topologies. The diplexer can include a pair of filter circuits, each with a plurality of series resonator devices and shunt resonator devices. In the ladder topology, the series resonator devices are connected in series while shunt resonator devices are coupled in parallel to the nodes between the resonator devices. In the lattice topology, a top and a bottom serial configurations each includes a plurality of series resonator devices, and a pair of shunt resonators is cross-coupled between each pair of a top serial configuration resonator and a bottom serial configuration resonator. The modified lattice topology adds baluns or inductor devices between top and bottom nodes of the top and bottom serial configurations of the lattice configuration. A multiplexing device or inductor device can be configured to select between the signals coming through the first and second filter circuits.

Abstract: This disclosure is directed to filtering in a transceiver of an electronic device. In some instances, active analog filters may be deployed in the transceiver of the electronic device to achieve greater linearity and/or reduce noise in the transceiver. However, as signal bandwidth grows increasingly larger, an active analog filter may consume excessive power. To remedy the excessive power consumption, a passive ladder LC filter may be used. Some LC ladder filters may include a limited quality factor (Q), which may lead to undesirable effects in the transceiver (e.g., voltage droop). To address these undesirable effects, certain components in the LC ladder filter may be relocated from an input port to a feedback chain of an amplifier coupled to the LC ladder filter. The new structure may enable components in the LC ladder filter to be tuned without causing additional voltage droop across the LC ladder filter.