Abstract: A method of coating a game ball with a rapidly curing polyurethane coating system is described herein. The coating system comprises a mixture of a polyol, an isocyanate, a solvent and a high level of catalyst which accelerates the curing process. The coating is a two-part polyurethane system which is preferably applied by spraying. The coating is particularly well-suited for use on golf balls, and also can be applied to other game balls such as softballs, baseballs, cricket balls.

Abstract: Thermosetting powder compositions comprising as binder a mixture of polyesters containing carboxyl groups and of a crosslinking agent having functional groups capable of reacting with the carboxyl groups.

Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one silicone epoxy resin, (B) at least one hydroxyl-containing compound, (C) at least one anhydride curing agent, (D) at least one ancillary curing catalyst, and optionally at least one of thermal stabilizers, UV stabilizers, cure modifiers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

Abstract: A process for coating a solid surface comprises 1) applying onto a solid surface a primer coating prepared from an amine curing agent, a polysulfide toughening agent, an epoxy resin, a rubber toughening agent, a fire retardant, a glass fiber thixotrope, and a pigment; and 2) applying onto the primer coating a topcoat prepared from an amine curing agent, a polysulfide toughening agent, an epoxy resin, a rubber toughening agent, a fire retardant, a glass fiber thixotrope, a pigment and an abrasive aggregate.

Abstract: The present invention provides a toughened thermosetting resin composition useful as an underfilling sealant composition which fills the underfill space in a semiconductor device, and includes a semiconductor chip mounted on a carrier substrate, enabling the semiconductor device to be securely connected to a circuit board by short-time heat curing. The thermosetting resin composition which is used as an underfilling sealant between such a semiconductor device and a circuit board to which the semiconductor device is electrically connected, includes an epoxy resin component, a latent hardener component, and a polysulfide-based toughening component. The latent hardener component includes a cyanate ester component and an imidazole component.

Abstract: An encapsulating epoxy resin composition comprising an epoxy resin which is liquid at normal temperature, a curing agent containing an aromatic amine which is liquid at normal temperature, an inorganic filler, and rubber particles; an encapsulant comprising this composition; and an electronic device having an encapsulating member comprising a cured product of this encapsulant.

Abstract: Mixtures containing at least one functionalized low-molecular rubber A, at least one cross-linking agent B having groups which are reactive with respect to the functional groups of the rubber A, accelerators/catalysts C for the cross-linking reaction between A and B, possibly reactive diluents D, vulcanization chemicals E, and also fillers F and auxiliary substances G, with at least one of the average functionalities of the constituents A and B being at least 2, and their use as anti-corrosive coating agents.

Abstract: A powdered coating composition comprises a thermosetting resin which consists of two components. The first component includes an acid reactive material comprising a polyepoxide or &bgr;-hydroxyalkylamide compound. The second component is an acid terminated resin which reacts with the first component. A curing agent including a polycarboxylic acid having a functionality of at least 3 and a source of tertiary or quanternary nitrogen is present to react with an excess of the first component, thereby curing thermosetting resin.

Abstract: A damage resistant and tolerant optical element is disclosed. Prior art solid or liquid host matrices are replaced by a soft crosslinked polymer or similar host material. The viscoelastic properties of the matrix host material are controlled during formation so that there are regions of different softness, of stiffness, within the matrix, to form a stiffness gradient. Preferably, the matrix will be softest at a preselected focal plane where maximum electromagnetic radiation or energy output may be expected. The host matrix is doped with a light altering dopant having a concentration distribution, preferably such that the concentration of light limiting dopant is highest in the region where the host matrix material is most soft. Two important disclosed example embodiments are an optical limiter and a solid state dye laser.

Abstract: Thermosetting resin compositions useful as underfill sealants for mounting semiconductor devices onto a circuit board are provided, which include epoxy resins, an adhesion promoter having at least two secondary amine groups, a curative based on the combination of nitrogen containing compounds and transition metal complexes, and a polysulfide toughening agent.

Abstract: A process of forming vias in a composition comprising (a) applying a layer of a composition containing (i) a cyanate ester, (ii) a bismaleimide, (iii) a co-curing agent having the structure R1—Ar—R2 wherein Ar is at least one aryl moiety, R1 is at least one unsaturated aliphatic moiety and R2 is at least one glycidyl moiety, (iv) an epoxy resin and, optionally, (v) a free-radical initiator; (b) covering the layer with a mask having windows through which radiation can be transmitted; (c) exposing part of the composition to radiation to at least partially cure it in the exposed areas; (d) removing the non-cured portions of the composition; and (e) completing the cure of the resin compositions.

Abstract: Provided are low temperature curing thermosetting epoxy powder coating compositions comprising at least one non-crystalline epoxy resin, at least one crystalline epoxy resin, a curing agent, and a cure catalyst. Coatings made from such powder compositions exhibit a substantial reduction in bubble entrapment, enough to prevent a visible haze from forming in the coating, when cured at low temperatures demanded by brass substrates.

Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) a curing agent comprising hexahydro-4-methylphthalic anhydride, (C) at least one a boron containing catalyst that is essentially free of halogen, and (D) at least one cure modifier. The encapsulant may also optionally comprise at least one of ancillary curing catalysts, thermal stabilizers, UV stabilizers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip, and an encapsulant comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) at least one anhydride curing agent, (C) at least one a boron containing catalyst that is essentially free of halogen, (D) at least one cure modifier, and, optionally (E) at least one ancillary curing catalyst. The encapsulant may also optionally comprise at least one of thermal stabilizers, UV stabilizers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip, and an encapsulant comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

Abstract: A hardener for an epoxy resin comprises a phenolic, thiophenolic, aminophenyl, tris-phenolic, tris-thiophenolic, tris-aminophenyl, tetrakis-phenolic, tetrakis-thiophenolic, or tetrakis-aminophenyl compounds; or phenol-formaldehyde or phenol-formaldehyde/melamine-formaldehyde resins wherein the phenyl rings are substituted with at least one of the structures wherein R1 and R2 independently are H, C1-C18 alkyl, C6-C18 aryl, C6-C18 substituted aryl, C6-C18 aryl methylene, or C6-C18 substituted aryl methylene; X is O, S or NH and Ar is wherein R is C1-C4 alkyl and n=0-5.

Abstract: An epoxy resin composition comprises a) a polyepoxide, b) a cure inhibitor of boric acid, a Lewis acid derivative of boron, an alkyl borane, a mineral acid having a nucleophilicity value “n” of greater than zero and less than 2.5, or an organic acid having a pKa value of 1 or more, a catalyst which can be complexed with the cure inhibitor, and c) more than 30 parts by weight per 100 parts by weight of polyepoxide of a cross-linker such as a polycarboxylic acid or anhydride including a copolymer of an ethylenically unsaturated anhydride and a vinyl compound, or a hydroxy-functional compound such as a copolymer of styrene and hydroxystyrene.

Abstract: The terminal glydidyl groups of a diglycidyl ether of a hydroxyaliphatic bisphenol is optionally reacted with (meth)acrylic acid to obtain a vinyl ester. The internal hydroxyaliphatic groups are reacted with (meth)acrylic acid or cyanoacrylic acid to prepare a diglycidyl and/or (meth)acrylate-terminated (meth)acrylate or urethane acrylate.

Abstract: Reactive diluents are formed by reaction of a compound having at least two glycidyl ester groups and a compound having at least one hydroxyl and/or carboxyl group. The diluents are useful in coating compositions together with crosslinking agents and optional other vehicle components.

Abstract: The invention is a reactive hot melt adhesive composition comprising a cationically polymerizable compound, on the average per molecule, having one or more cyclic ether groups such as epoxy groups, a phthalate diester compound expressed by the following formula (2) and a cationic photo-initiator: wherein in the formula (2), R5 indicates (ChH2hO)iH and R6 indicates (CkH2kO)lH or (CkH2kO)lCkH2k+1, provided that h, i, k and l each are an integer of 1 or more. The present invention provides a reactive hot melt adhesive, in which a curing reaction progresses under application of actinic radiation.

Abstract: A blend of a rubber and a rubber modifier, the rubber modifier comprising an ethylene/&agr;-olefin copolymer rubber (A) composed of one or more copolymers selected from the group consisting of a copolymer of ethylene and an &agr;-olefin having 3-20 carbon atoms and a copolymer of ethylene, an &agr;-olefin having 3-20 carbon atoms and a non-conjugated polyene, the copolymer rubber (A) having the parameters: an ethylene/&agr;-olefin mole ratio in the range of 51/49 to 87/13, an intrinsic viscosity [&eegr;] determined in decahydronaphthalene at 135° C. in the range of 0.8 to 2.5 dl/g and an iodine value in the range of 0 to 40.