Abstract: An aqueous coating agent for forming lubricating films comprising a hydrophilic resin; a solid lubricating agent comprising MoS2 and at least one antimony sulfide selected from the group consisting of Sb2S3 and Sb2S5, where a weight ratio of MoS2 to antimony sulfides is from 1;0.05 to 1:12; and water and wherein the weight ratio of the solid lubricating agent to the hydrophilic resin is from 0.7:1 to 3:1.

Abstract: A process for manufacturing an &agr;-halohydrin intermediate and an epoxy resin prepared therefrom including epoxidizing an &agr;-halohydrin intermediate produced from an in situ halide substitution-deesterification of an &agr;-hydroxy ester derivative which has been obtained by the coupling reaction of a phenol or a mixture of phenols and a glycidyl ester optionally in the presence of a catalyst.

Abstract: The invention relates to Mannich bases prepared using alkyldipropylenetriamines and to addition compounds (adducts) of alkyldipropylenetriamines with acrylonitrile and ethylene oxide or propylene oxide, and to products obtained therefrom by the further addition of epoxy compounds having on average at least one epoxy group per molecule, and to the use of such products as hardeners for curable epoxy resin systems.

Abstract: A process for the preparation of a copolymer comprises reacting in an aqueous medium at a temperature of from 25° C. to 100° C. in the presence of from 1.0-25 weight percent based on the total weight of a), b) and c) of a free-radical initiator, a) at least one monomer selected from the group consisting of &agr;,&bgr;-unsaturated monocarboxylic acids and their salts, &agr;,&bgr;-unsaturated dicarboxylic acids, their half-esters free of polyoxyalkylene side chains and their salts, b) at least on olefinic monomer selected from the group consisting of aromatic vinyl compounds, vinyl ethers, vinyl esters, nitrogen-containing vinyl compounds and aliphatic olefins, and c) from 0.

Abstract: The use of crosslinked copolymers obtainable by precipitation polymerization of monomer mixtures comprising (a) monoethylenically unsaturated C3-C8-carboxylic acids, their anhydrides or mixtures of said carboxylic acids and anhydrides, (b) compounds with at least 2 non-conjugated ethylenic double bonds in the molecule as crosslinkers and, where appropriate, (c) other monoethylenically unsaturated monomers which are copolymerizable with monomers (a) and (b), in the presence of free-radical polymerization initiators and from 0.1 to 20% by weight, based on the monomers used, of saturated, nonionic surface-active compounds, as stabilizer in oil-in-water emulsions in amounts of from 0.01 to 5% of the weight of the emulsions, and cosmetic and pharmaceutical formulations based on oil-in-water emulsions which contain said precipitation polymers.

Abstract: A composition useful as a sealant, coating, a potting agent for a printed circuit board, a prepreg or an adhesive comprises a compound (A) wherein all or a part of the oxirane rings in an epoxy compound is replaced with thiirane rings represented by the following formula (1): or compound (A) and compound (B) which contains oxirane rings and no thiirane ring in the molecule, wherein the ratio of oxirane ring/thiirane ring is from 90/10 to 10/90.

Abstract: A process for producing a lens comprising polymerizing bis(&bgr;-epithiopropyl)ether to form a lens.

Abstract: Disclosed are compositions of ethylene and (meth)acrylic acid and ester elastomeric copolymers or of (meth)acrylic ester elastomeric copolymers with polylactones and certain polyethers.

Abstract: Autodeposition compositions for polymeric coatings of reduced gloss are prepared using resins having at least one hydroxy group and at least one epoxy group per molecule, a low temperature crosslinker and a high temperature crosslinker. The low temperature crosslinker forms a reactive prepolymer that may be subsequently mixed or emulsified with a high temperature crosslinker to form an autodeposition composition. Alternatively, a hybrid crosslinking agent may be utilized which contains both free isocyanate groups reactive at a relatively low temperature with the resin and at least one functional group capable of reacting with the resin only at a relatively elevated temperature. When deposited and cured, the resulting coating has a matte finish that is resistant to surface defects.

Abstract: This invention provides a latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a monovalent anion portion in which four specific groups are bonded to the boron atom, and a latent catalyst having a structure wherein the above phosphonium borate is the recurring unit and at least two of said recurring unit are connected through at least one of the four specific groups bonded to the boron atom. This invention also provides a thermosetting resin composition comprising such a latent catalyst and an epoxy resin molding material comprising such a latent catalyst and further provides a semiconductor device in which a semiconductor is encapsulated with said epoxy resin molding material.

Abstract: The present invention provides curable coating compositions including: (a) about 55 to about 99 weight percent of an epoxy-functional polymer containing at least two epoxide groups per molecule; (b) about 1 to about 45 weight percent of a thermoplastic polymer effective to reduce shrinkage of the curable composition upon curing and which is substantially insoluble in the epoxy-functional polymer; (c) about 1 to about 70 weight percent of ground vulcanized rubber particles having an average particle size ranging from about 1 to about 300 microns; (d) a curing agent adapted to cure the epoxy-functional polymer; and, optionally, vinyl chloride polymer.

Abstract: A curable melt blended composition and a method of making the composition by melt blending a thermoplastic polymer comprising polyphenylene ether (PPE) polymer and a polystyrene polymer, preferably high impact polystyrene (HIPS), and optionally a compatiblizer, with an uncured epoxy component, comprising a curable epoxy and an epoxy curing agent, at a temperature greater than 150° C. and without addition of solvent wherein the epoxy component of the resulting curable melt blended composition remains substantially uncured.

Abstract: A multilayer printed circuit board having resinous insulating layers and conductor layers alternately superposed on a circuit board with ample adhesive strength, a method for the production thereof, and a curable resin composition useful for the formation of resinous insulating layers are disclosed. The manufacture of the multilayer printed circuit board is accomplished by applying the curable resin composition to the surface of conductor layer of the circuit board, thermally curing the applied layer thereby forming resinous insulating layer, then boring a through-hole in the circuit board, treating the resinous insulating layer with a coarsening agent thereby imparting undulating coarsened surface thereto, subsequently coating the surface of resinous insulating layer and the inner surface of the through-hole with a conductor layer as by electroless plating, and thereafter forming a prescribed circuit pattern in the conductor layer.

Abstract: An epoxy resin composition used for semiconductor encapsulating, laminated boards or electrical insulation is prepared from a thermosetting resin composition containing: (A) an epoxy resin and (B) a phenol resin represented by the following general formula (1): wherein R1 and R2 are a hydrogen atom or alkyl group having 1 to 4 carbon atoms, and R3 is an amino group, alkyl group having 1 to 4 carbon atoms, phenyl group, vinyl group or the like, and wherein m is an integer of 1 or 2.

Abstract: A thermosetting resin composition for carbon fiber reinforced composite materials of the present invention chiefly comprises (A)2 thermosetting resin such as epoxy resin and a curing agent, and (B)2 compound containing one functional group which can react with thermosetting resin (A) or its curing agent, and a moiety selected from the following formulae (1) to (4) Furthermore, the present invention also relates to a prepreg formed by impregnating reinforcing fiber with the aforesaid resin composition and to carbon fiber reinforced composite materials comprising reinforcing fiber and a cured aforesaid thermosetting resin composition.

Abstract: An adhesive composition comprising (a) an epoxy resin having a substantially linear structure, (b) an amine hardener, and (c) a non-ionic surfactant, is suitable for adhering low energy (composite) surfaces to rigid metal or non-metal composite surfaces/parts and can be cleanly removed after use by application of heat.

Abstract: A multi-component coating composition having a hard, glossy, and tack-free finish is described. The coating composition comprises a fatty acid modified glycidyl-containing component and a hydroxy-functional polymer. The coating composition can be used to originally finish or to refinish such articles as farm, industrial, and construction equipment, automobiles, and trucks, and to paint structures such as bridges, buildings, appliances, metal furniture, and the like.

Abstract: An epoxy group-containing acrylic resin for a powder coating composition is a copolymer, having a weight-average molecular weight of 3000 to 20000, of a vinyl monomer mixture comprising 10 to 60% by weight of alkyl ester(s) of (meth)acrylic acid, 10 to 60% by weight of epoxy group-containing vinyl monomer(s) and other vinyl monomer(s), said epoxy group-containing acrylic resin having a mean particle diameter in the range of 80 to 800 &mgr;m, including 95% by weight or more of particles satisfying the relation of 1≦R/r≦1.2 wherein R is a long diameter and r is a short diameter of each particle, and including 1000 ppm or less of volatile components, the amount of the particles having long diameters R of less than 62 &mgr;m being 5% by weight or less, that of the particles having short diameters r of more than 1000 &mgr;m being 5% by weight or less.

Abstract: A composition useful as an impregnant for the making of laminates for printed wiring boards comprises a FR4 epoxy resin which is a bisphenol A epoxy resin advanced with tetrabromobisphenol A, a crosslinking agent of a strene-maleic anhydride copolymer and a co-crosslinking agent is an optionally brominated bisphenol A and/or an optionally brominated bisphenol A diglycidyl ether.

Abstract: A mixture of a self-curing epoxy resin having an equivalent weight of from about 100 to about 700, a melt viscosity of from about 200 to about 2000 centipoise at 150° C. and a low temperature curing agent is extruded as one component at a temperature below 220° F. and the extrudate is cooled and pulverized to form a low temperature curable coating powder. The powder cures at a temperature of from about 225 to about 300° F. and produces a coating having a smooth surface with either a low or high gloss. The powder is particulary useful for coating heat-sensitive substrates such as plastics, paper, cardboard and wood.