Abstract: A substation contains a switchgear or controlgear, in particular at least one low voltage switchgear or controlgear configured for unmanned operation and maintenance. An inner room, where the switchgear or controlgear are located in, is hermetically enclosed by an outer housing. The inner room is locked against the outer housing by an inner, automatically operated door. A robot system is implemented such that the robot system's acting area is extended from the inner room, partly in the area outside the inner room, but inside the outer housing, where spare parts are stored in a spare parts hand over area, for maintenance.

Abstract: A switch cabinet frame rack with multiple profile struts and a rectangular base frame, the underside of which is an outer side of the switch cabinet frame rack, which has at least one through-opening, wherein the through-opening is closed by a skid which is detachable mounted on the outer side.

Abstract: Disclosed is a display device. The display device of the present disclosure includes a flexible display panel, a source printed circuit board (S-PCB) located adjacent to a lower side of the flexible display panel and electrically coupled to the flexible display panel, a roller comprising a seating portion accommodating the S-PCB, wherein the seating portion is formed by removing a part of an outer circumferential surface of the roller, wherein the flexible display panel is wound around or unwound from the roller, and a cover extending in a longitudinal direction of the roller to cover the S-PCB.

Abstract: The present invention includes a lateral support member for a server computer constructed to permit advantageous airflow. The present invention can be operated to shunt organized airflow into multiple computer cases and/or organized airflow from multiple computer cases to a dedicated heat reservoir.

Abstract: A heat radiation structure (10) includes a casing (4) configured to accommodate a heating element (1), and a heat-sink type component (2) configured to directly or indirectly absorb heat from the heating element (1), contactlessly face the casing (4), and conduct the heat to the casing (4) via air existing in an internal space of the casing (4), wherein at least either the heat-sink type component (2) or the casing (4) is configured in such a way that, when heat is generated from the heating element (1), a distance between the heat-sink type component (2) and the casing (4) becomes nearer in a region of the internal space (3) in which temperature does not rise relatively easily than in a region of the internal space (3) in which temperature rises relatively easily.

Abstract: Provided is a display device including a lifting module; and a display panel connected to the lifting module. The lifting module includes a first lifter and a second lifter disposed at opposite edges of the display panel; and a groove disposed at an edge of each of the first lifter and the second lifter. The display panel includes a display unit; support portions and joint portions disposed on a rear surface of the display unit; and a fixing unit disposed at an edge of the display panel and connecting the display panel to the lifting module. The fixing unit is disposed within the groove disposed at the edge of each of the first lifter and the second lifter.

Abstract: An electronic module, such as a power module, may include a latch having two or more protrusions where a first protrusion can fix the electronic module into a shelf and the second protrusion can be a curved protrusion that activates the latch when an adjacent electronic module is inserted into or removed from the shelf. In some embodiments, a third protrusion may be included, where the first protrusion and the third protrusion both fix the electronic module to the shelf and are activated by the latch. Also, a shelf may include a partition between two electronic module receptacles that has a width that is less than a protrusion extending from a side wall of one of the electronic modules.

Abstract: A frame for a display tile made of a first material with a first coefficient of thermal expansion and fastened to a first substrate made of a second material with a second coefficient of thermal expansion. The frame is divided into three parts: a first part to be glued by the adhesive to a lateral side of the substrate, a third part to serve as fastening interface to another structure and a second part to isolate the third part from strain in the first part. Grooves are formed in the second part, the grooves being substantially straight and substantially parallel to the first substrate, the frame having at least one opening made in one of the grooves etched in the metal frame to locally adjust the bending stiffness of the metal frame.

Abstract: An apparatus for conducting heat, including a substrate for receiving one or more electric components and a thermal substance circulation system. The substrate includes a first interface for receiving a first part of the thermal substance circulation system and a second interface for receiving a second part of the thermal substance circulation system such that the substrate is, when in use, in contact with the thermal substance of the circulation system between the first and the second interface. The substrate is heat conductive for transferring heat between the one or more electric components and the thermal substance of the circulation system.

Abstract: Disclosed is a mounting device for an electronic device. The mounting device comprises a plate including a first surface and a second surface opposite to the first surface, the first surface configured to receive the electronic device; a hinge structure disposed on the second surface of the plate, the hinge structure including a rotary shaft extending from the second surface and a hinge shaft extending along the second surface; and a support member coupled to the hinge shaft, the support member including a first portion extending from the hinge shaft by a first length and a second portion extending from the hinge shaft by a second length smaller than the first length, wherein the hinge structure is configured to rotate about the rotary shaft, and wherein the support member is configured to rotated about the hinge shaft such that the first portion can make contact with the second surface of the plate and the second portion can make contact with the second surface of the plate.

Abstract: An electronic system includes a chassis, a liquid coolant supply line assembly, a first electronic subassembly, a second electronic subassembly, and a liquid coolant return line assembly. The liquid coolant supply line assembly includes a coolant supply line configured to receive and convey liquid coolant. The first electronic subassembly includes a first electronic component and a first cooling loop to transfer heat from the first electronic component into the liquid coolant. The second electronic subassembly includes a second electronic component and a second cooling loop to transfer heat from the second electronic component into the liquid coolant The liquid coolant return line assembly includes a coolant return line to receive liquid coolant from the first and second cooling loops.

Abstract: A fan module including a blade mechanism, a switch component, and a fan is provided. The blade mechanism includes a frame having a through hole, a positioning bracket movably connected to the frame, and blades movably connected to the positioning bracket and the frame. The switch component is connected to the positioning bracket and located on an assembly path. The fan is detachably disposed at one side of the through hole, and the positioning bracket and the blades are located at another side. In a first mode, any two adjacent blades are stacked to close the through hole. In a second mode, the fan pushes the switch component to drive the positioning bracket to drive the blades, such that the blades have a rotational degree of freedom relative to the positioning bracket or rotate relative to the frame to open the through hole. An electronic device is also provided.

Abstract: A cooler includes an evaporator and a condenser. The evaporator includes a housing, a wick, and a groove member having a plurality of vapor flow channels through which working fluid changed in phase from a liquid phase to a gas phase flows, the groove member being coupled to the wick. The housing includes a heat receiver to which the heat is transferred from a cooling target. The groove member includes a plurality of plate-like members, arranged side by side along a predetermined direction, and constituting the plurality of vapor flow channels. Each of the plate-like members includes a bent part formed by bending a part of the plate-like member, the bent part being coupled to the heat receiver.

Abstract: A display apparatus is provided. The display apparatus comprises an electronic display assembly, a heat exchanger, a fan, and a cleaning device. The heat exchanger comprises one or more internal heat dissipation pathways and one or more external heat dissipation pathways. The one or more internal heat dissipation pathways are thermally coupled to the electronic display assembly and the one or more internal heat dissipation pathways are thermally coupled to the one or more external heat dissipation pathways. The fan generates ambient air flow passing through the one or more external heat dissipation pathways. The cleaning device is connected to the one or more external heat dissipation pathways, and used for injecting a cleaning fluid into the one or more external heat dissipation pathways.

Abstract: A substation for medium or high voltage includes: switchgear or controlgear with unmanned operation and maintenance; an inner room in which the switchgear or controlgear is located, the inner room being hermetically enclosed by an outer housing, the inner room being locked against the outer housing by an inner, automatically operated door; and a robot system, the robot system being implemented such that an acting area of the robot system is extended from the inner room, partly in an area outside the inner room, but within the substation internal space, where spare parts are stored in a spare parts hand over area, for maintenance.

Abstract: A data center system includes a frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, the plurality of bays arranged in a plurality of stacked layers of bays, the plurality of stacked layers including at least a first layer of bays and a second layer of bays positioned vertically above the first layer of bays; a plurality of server racks positioned in the bays of the first layer of bays, each of the server racks configured to support a plurality of data center server devices that define a particular amount of computing power; and a plurality of network switches positioned in the bays of the second layer of bays, each of the network switches communicably coupled to at least one of the data center server devices in the first layer of bays.

Abstract: A thermal management system for a computing device includes an immersion tank with a cooling fluid therein, a computing device positioned in the cooling fluid in the immersion tank, and a thermal block positioned in the cooling fluid in the immersion tank. The computing device heats the cooling fluid, and the thermal block is configured to receive heat from the cooling fluid. The thermal block includes a fluid management feature to direct flow of the cooling fluid relative to the thermal block and computing device.

Abstract: An electronic device having a shielding structure disposed around electronic components and having high heat dissipation performance is provided. The electronic device includes a circuit board, at least one electronic component mounted on a surface of the circuit board, a shielding sheet attached to the surface of the circuit board to cover the at least one electronic component, a thermal interface material stacked on the shielding sheet to overlap the at least one electronic component, and a heat dissipation member disposed to face the surface of the circuit board, being in surface contact with the thermal interface material, and fastened to at least a portion of the circuit board by a fixing member. Various other embodiments may be possible.

Abstract: A power connector includes first and second power terminals having first and second contact stacks and first and second plates for termination to corresponding power element. The contact stacks have contacts separate and discrete from each other and from the plate. Each contact has a base and a mating beam. The bases are aligned and mechanically and electrically coupled to the plate. A housing has an end wall and a fastener that mechanically and electrically couples the bases to the plate. The power terminals are arranged such that the first and second mating beams oppose each other across a mating slot that receives a bus bar with the first mating beams mechanically and electrically engaging a first bus rail at a first side of the bus bar and the second mating beams mechanically and electrically engaging a second bus rail at a second side of the bus bar.

Abstract: A power panel of an electrical distribution system including a bus stack with a plurality of conductive bars spaced from one another and a plurality of insulators, an electrical accessory is coupled to the plurality of bus bars, and each insulator includes a main body and a safety feature that extends from the main body. The safety features from adjacent insulators extend towards one another to define a gap sized to prevent insertion of a foreign object therein. The gap is further sized to permit insertion there through of a conductive component to establish an electrical connection between multiple bus bars and the electrical accessory.