Abstract: A modular high density communications chassis including a chassis, pull-out cable management system (POCMS), and at least two or more slidable carrier modules (carrier module(s)) is provided. The carrier modules are slidably mounted to the chassis and POCMS vertically, respectively. The POCMS is assembled to the chassis. In an operational position, ends of the carrier modules of the chassis extend outward from an access mounting opening of the chassis and ends of the carrier modules of the POCMS, alternately neighboring, lie flush with a plane of the access mounting opening. A handle of the POCMS is configured to move the POCMS from the operational position to a cable management position, whereby, the ends of the carrier modules of the POCMS extend past the ends of the carrier modules of the chassis, providing staged access to the carrier modules and staged management of connector cables extending to and therefrom.

Abstract: An electrical control panel including an enclosure box being sealed other than at an inlet opening and an outlet opening, a primary electrical component inside the enclosure box and having a first heat exchanger that transfers heat from the primary electrical component, one or more secondary electrical components inside the enclosure box that generate less heat than the primary electrical component, a second heat exchanger attached to the enclosure box and having an internal air passageway that includes an inlet opening and an outlet opening in fluid communication with the respective outlet and inlet openings of the enclosure box and defining therewith a sealed compartment, and one or more diverter elements direct a majority of the heated air from the first heat exchanger to enter the internal air passageway of the second heat exchanger without flowing over at least one of the secondary electrical components.

Abstract: An arrangement for electromagnetic shielding of an electronic component attached to a substrate is described. The arrangement comprises an electrically conductive frame which is attached to the substrate in such a way that the frame frames the component. The arrangement further comprises an electrically conductive covering which is attached at least to a portion of a top side of the component, and which is electrically conductively attached at least to a portion of the frame. Furthermore, a method for electromagnetic shielding of the electronic component attached to the substrate and also a computer program product for carrying out the method are described.

Abstract: An electronic device is provided that balances the force applied to temperature control elements such that stress within components of the electronic device can be effectively managed. In one example, an electronic device is provided that includes a printed circuit board (PCB), a chip package, a thermal management system, a thermal spreader, and first and second biasing members. The chip package is mounted to the PCB. The thermal management system and spreader are disposed the opposite of the chip package relative to the PCB. The first biasing member is configured to control a first force sandwiching the chip package between the thermal spreader and the PCB. The second biasing member is configured to control a second force applied by the thermal management system against the thermal spreader. The first force can be adjusted separately from the second force so that total forces applied to the chip package and PCB may be effectively balanced.

Abstract: An electrical power distribution system that includes a hollow body with at least one seamless insulated bus bar on top of a non-energized metal mounting surface. A plurality of connection points are distributed along the bus bar for electrical device connections. The connection points are contained inside molded plastic louvers and are electrically connected to the main bus bar. Electrical device connections are accomplished via plugging directly onto the electrical connection points while the plastic louvers recede from around the bus bar. The attachment of electrical devices of various sizes and configurations may be accommodated though varying the pitch and size of the electrical connection points.

Abstract: A slide-in compartment for receiving a module includes: a receiving opening; a compartment base; and a roof. The compartment base and the roof are identical components. In an embodiment, at least one side wall is provided, which has two guide webs, and a lower guide web is assigned to or faces the compartment base and an upper guide web is assigned to or faces the roof.

Abstract: An arrangement includes: a module insertable into a housing or removable from a housing; and a slide-in compartment for receiving the module. The module is reversibly removable from the slide-in compartment. At least one side wall and/or a compartment rear wall and/or a compartment base of the slide-in compartment in an inserted state of the module forms or form a side wall and/or rear wall and/or a base wall and/or a roof of at least one module.

Abstract: Technologies for embedded and immersed heat pipes in automated driving system computers (ADSC) are described herein. In some examples, an ADSC can include one or more cold plates including one or more fluid channels, the one or more fluid channels being configured to circulate a first working fluid from a respective ingress point to a respective egress point; one or more processors coupled to the one or more cold plates; one or more heat pipes coupled to or embedded in the one or more cold plates and configured to collect heat from the one or more processors and transfer the heat away from the one or more processors via a second working fluid in the one or more heat pipes; and a chassis housing the one or more cold plates, the one or more processors, and the one or more heat pipes.

Abstract: The present invention generally relates to a microjet array for use as a thermal management system for a heat generating device, such as an RF device. The microjet array is formed in a jet plate, which is attached directly to the substrate containing the heat generating device. Additional enhancing features are used to further improve the heat transfer coefficient above that inherently achieved by the array. Some of these enhancements may also have other functions, such as adding mechanical structure, electrical connectivity or pathways for waveguides. This technology enables higher duty cycles, higher power levels, increased component lifetime, and/or improved SWaP for RF devices operating in airborne, naval (surface and undersea), ground, and space environments. This technology serves as a replacement for existing RF device thermal management solutions, such as high-SWaP finned heat sinks and cold plates.

Abstract: Technologies for embedded and immersed vapor chambers in automated driving system computers (ADSC) are described herein. In some examples, an ADSC can include one or more cold plates including one or more fluid channels, the one or more fluid channels being configured to circulate a first working fluid from a respective ingress point to a respective egress point; one or more processors coupled to the one or more cold plates; one or more vapor chambers coupled to or embedded in the one or more cold plates and configured to collect heat from the one or more processors and transfer the heat away from the one or more processors via a second working fluid in the one or more vapor chambers; and a chassis housing the one or more cold plates, the one or more processors, and the one or more vapor chambers.

Abstract: A portable information handling system housing has a handle to aid an end user in carrying of the system. A heat pipe loop passes through the handle and couples to a processing component heat sink to transfer excess thermal energy from within the housing to the handle for rejection to the ambient environment. Thermal wax disposed in the handle stores energy with a phase change from a solid to a liquid state. A color indicator disposed on the handle provides an end user with an indication of a temperature of the handle.

Abstract: An example apparatus is disclosed that includes a base and a wickless capillary driven constrained vapor bubble heat pipe carried by the base. The wickless capillary driven constrained vapor bubble heat pipe includes a capillary, and the capillary has a longitudinal axis and a cross-sectional shape orthogonal to the longitudinal axis. The cross-sectional shape includes a first curved wall, a second curved wall, a first corner between a first straight wall and a second straight wall, and a second corner between a third straight wall and a fourth straight wall.

Abstract: An electronic device includes a transparent member arranged on at least one of a front surface or a rear surface of the electronic device and including a first region facing a display module, a housing surrounding the transparent member, including a sidewall extending in a circumferential direction of the electronic device, and forming an exterior of the electronic device, and protruding portions protruding toward the transparent member from the sidewall and extending in the circumferential direction of the electronic device, wherein a distance between the protruding portions facing each other with the transparent member therebetween is less than a width of the transparent member arranged between the protruding portions.

Abstract: A cooling system can include an input channel from which a fluid enters the cooling system and an output channel from which the fluid exits the cooling system. The cooling system can include a vapor buffer and a liquid buffer, and the connections between the two buffers. Vapor buffer valves arranged in fluid channels of the cooling system can be controlled to, in a first mode, disconnect the vapor buffer from an input channel, and, in a second mode, connect the vapor buffer to the input channel and disconnect the vapor buffer from the input of the condenser or the port that is attachable to the input of the condenser.

Abstract: A solid state drive (SSD) apparatus includes a case including an air tunnel disposed between an inner plate and an upper wall and an accommodation space between the inner plate and a lower wall. The air tunnel extends in a first direction, and both end parts of the air tunnel are exposed to the outside. A substrate is disposed in the accommodation space. At least one semiconductor chip is disposed on the substrate.

Abstract: The application relates to a high-efficiency phase-change condenser for a supercomputer, including a condenser box body, a refrigerant input pipe, a refrigerant output pipe and a condensing coil; a liquid refrigerant accommodated in the condenser box body, and a gas-phase region existing between a liquid level of the liquid refrigerant and a top of the condenser box body; one portion of the condensing coil immersed into the liquid refrigerant, and the other portion of the condensing coil located in the gas-phase region above the liquid level of the liquid refrigerant; and in the gas-phase region, refrigerant vapor bubbles are liquified by the condensing coil. Liquid-phase and gas-phase saturated refrigerants can be completely condensed by the condensing coil in a limited condenser space, thereby improving heat exchange efficiency of the condenser.

Abstract: An electronic device according to various embodiments of the present invention can comprise: a housing including a first plate facing a first direction, a second plate facing a second direction opposite to the first direction, and a side member for encompassing a space between the first plate and the second plate; a circuit board arranged inside the housing and including at least one heating element; a first vapor chamber for receiving, through conduction, and dispersing, in at least a partial space between the first plate and the circuit board, heat released from the at least one heating element; a heat sink for receiving, through conduction, and absorbing, in at least a partial space between the circuit board and the second plate, heat released from the at least one heating element; and a fan for supplying air such that the heat absorbed by the heat sink is forcibly convected toward the outside of the electronic device. Additional various embodiments are possible.

Abstract: A device for preparing a high-voltage direct current transmission includes a first busbar which is connectable to a plurality of first energy generation or consumer units and a second busbar which is connectable to a plurality of second energy generation or consumer units. A transformer system includes a first primary coil which is connectable to the first busbar, a second primary coil which is connectable to the second busbar, and a secondary coil system which is inductively coupled to the first primary coil and the second primary coil to transform power routed on the first and second busbars to increased AC voltage. A converter system is connected to the secondary coil system to convert the increased AC voltage into DC voltage for the high-voltage direct current transmission. A converter station and an energy providing system are also provided.

Abstract: Disclosed is a server rack system within an enclosed building and a process for directing air through a server facility. Air is channeled from conduit to a server rack assembly and then through a closed loop back again into the server rack assembly from channeling exhaust air through conduit away from the server rack assembly.

Abstract: A bushing tank having power receiving lead-in bushings of three phases to which conductor portions extended rearward of a main body portion in which a switching device is housed are connected is included, and the power receiving lead-in bushings of the three phases are disposed at an upper surface portion of the bushing tank at equal intervals in a circumferential direction such that end portions thereof are inclined outward so as to be separated from each other, and one of the power receiving lead-in bushings of the three phases is disposed along a front-rear direction of the main body portion. Owing to this configuration, it is possible not only to ensure insulation distances between the end portions of the power receiving lead-in bushings but also to ensure insulation distances between lead-in wires regardless of a power receiving lead-in direction.