Patents Examined by Sang Y. Paik
  • Patent number: 11697175
    Abstract: The invention relates to an apparatus 100, 200, 300, 700 and a method 400 for machining a workpiece 101 with a laser beam 102. The apparatus 100, 200, 300, 700 comprises a machining unit 103 configured to provide a pressurized fluid jet 104 onto the workpiece 101 and to couple the laser beam 102 through at least one optical element 105 into the fluid jet 104 towards the workpiece 101. Further, it comprises a sensing unit 107 arranged to receive a laser-induced electromagnetic radiation 106 propagating away from the workpiece 101 through the fluid jet 104 and through at least one optical element, and configured to convert the received radiation 106 into a signal 108. The apparatus 100, 200, 300, 700 also comprises a signal processing unit 109 configured determine a state of machining the workpiece 101 based on the signal 108.
    Type: Grant
    Filed: October 4, 2018
    Date of Patent: July 11, 2023
    Assignee: SYNOVA S.A.
    Inventors: David Hippert, Grégoire Laporte, Maximilian Epple, Helgi Diehl, Bernold Richerzhagen
  • Patent number: 11699603
    Abstract: A thermal processing system is provided. The thermal processing system can include a processing chamber and a workpiece disposed within the processing chamber. The thermal processing system can include a heat source configured to emit light towards the workpiece. The thermal processing system can further include a tunable reflective array disposed between the workpiece and the heat source. The tunable reflective array can include a plurality of pixels. Each pixel of the plurality of pixels can include an electrochromatic material configurable in a translucent state or an opaque state. When the electrochromatic material of a pixel is configured in the translucent state, the light at least partially passes through the pixel. Conversely, transmission of light through a pixel is reduced when the electrochromatic material of the pixel is configured in the opaque state.
    Type: Grant
    Filed: March 9, 2020
    Date of Patent: July 11, 2023
    Assignees: BEIJING E-TOWN SEMICONDUCTOR TECHNOLOGY, CO., LTD, MATTSON TECHNOLOGY, INC.
    Inventors: Michael X. Yang, Chen-an Chen
  • Patent number: 11691225
    Abstract: Laser cutting on a plated steel sheet is executed by cutting the plated steel sheet by irradiating the plated steel sheet covered with a plate metal with laser light at a wavelength in a 1 micrometer band; and emitting assist gas onto a cut surface of the plated steel sheet, the cut surface being formed in the step of cutting, to make the plate metal fused by irradiation of the laser light flow to the cut surface so as to cover the cut surface with the plate metal.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: July 4, 2023
    Assignee: AMADA HOLDINGS CO., LTD.
    Inventors: Hideo Hara, Masanori Uehara
  • Patent number: 11679448
    Abstract: The disclosure relates to a beam-forming unit for forming a laser beam and focusing the laser beam onto a workpiece. The unit includes a movable component, an immovable component, and a cooling system configured for movement of a cooling medium to actively cool the movable component. The cooling system has-a cooling water circuit on the immovable component configured for water cooling of both the immovable component and the cooling medium.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: June 20, 2023
    Assignee: TRUMPF Werkzeugmaschinen SE + Co. KG
    Inventors: Jens Braun, Björn Luong
  • Patent number: 11673202
    Abstract: A three stage power source for an electric arc welding process comprising an input stage having an AC input and a first DC output signal; a second stage in the form of an unregulated DC to DC converter having an input connected to the first DC output signal and converts the first DC output signal to a second DC output signal of the second stage; and a third stage to convert the second DC output signal to a welding output for welding wherein the input stage and the second stage are assembled into a first module within a first housing structure and the third stage is assembled into a second module having a separate housing structure connectable to the first module with long power cables. The second module also includes wire feeding systems and electronics.
    Type: Grant
    Filed: July 14, 2020
    Date of Patent: June 13, 2023
    Assignee: Lincoln Global, Inc.
    Inventors: Todd E. Kooken, Lifeng Luo, Matthew J. Krueger
  • Patent number: 11666767
    Abstract: A method of forming a medical device lead connection element is described. The method includes positioning an end portion of a lead filar to overlap a lead end connection element such that the positioning creates mutual interference between the lead filar and the lead end connection element, and forming an interference configuration. Then melting the end portion of the lead filar to form a weld joint and allowint the end portion of the lead filar to move towards the end connection element.
    Type: Grant
    Filed: April 13, 2017
    Date of Patent: June 6, 2023
    Assignee: Medtronic, Inc.
    Inventors: Darren Janzig, Robert J. Davies, Seth M. Humphrys, Richard T. Stone
  • Patent number: 11666090
    Abstract: An aerosol-generating device is provided, including an elongate housing having a first end, a second end, and a longitudinal axis extending between the first and the second ends; a cavity configured for insertion of an aerosol-generating article into the cavity along a first direction that is substantially perpendicular to the longitudinal axis; first and second apertures at first and second ends of the cavity and being configured for insertion and removal of the aerosol-generating article; an electrical power supply positioned within the elongate housing; at least one electrical heater, and a controller disposed within the elongate housing and configured to control a supply of electrical power from the electrical power supply to the at least one electrical heater when the aerosol-generating article is received within the cavity.
    Type: Grant
    Filed: May 26, 2017
    Date of Patent: June 6, 2023
    Assignee: Philip Morris Products S.A.
    Inventor: Tony Reevell
  • Patent number: 11666988
    Abstract: An additive manufacturing machine includes a laser light source, a beam entry window, a recoater, a plurality of light sources attached to the recoater, a photosensor, and a controller. The laser light source emits laser light to selectively melt one or more portions of a working layer of a powder bed during additive manufacturing of a part. The beam entry window is positioned between the powder bed and the laser light source. The recoater moves across the powder bed to spread the working layer. The photo sensor senses intensity of light emitted by each of the plurality of light sources through the beam entry window. The controller correlates sensed intensity of the light emitted by each of the plurality of light sources through the beam entry window to corresponding positions on the beam entry window based on locations of each of the plurality of light sources.
    Type: Grant
    Filed: July 22, 2019
    Date of Patent: June 6, 2023
    Assignee: Hamilton Sundstrand Corporation
    Inventor: Joshua M. Norman
  • Patent number: 11664244
    Abstract: A ceramic heater includes a ceramic plate in which inner circumferential side and outer circumferential side resistance heating elements are built in; and a cylindrical shaft joined to a rear surface of the ceramic plate. The long hole extends from a start point of the ceramic plate to a terminal position of the outer circumferential portion of the ceramic plate. The entrance portion of the long hole is a long groove. The long groove is provided to extend from the start point to an extended area. Terminals are provided at positions other than the long groove and in a shaft inside area.
    Type: Grant
    Filed: July 15, 2020
    Date of Patent: May 30, 2023
    Assignee: NGK INSULATORS, LTD.
    Inventors: Tomohiro Takahashi, Ryohei Matsushita
  • Patent number: 11642738
    Abstract: An end assembly for use with a welding device having a chamber between the diffuser sleeve and the insert which allows for cooling the insert and for controlling the flow of gas through the end assembly. Some of the components of the end assembly such as the contact tip, insert and gooseneck are constructed of a conductive material which are securely held together in contact by a diffuser sleeve constructed of a dissimilar material. The end assembly provides better conductivity of the current through the end assembly for use of less energy during welding.
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: May 9, 2023
    Assignee: ELCo Enterprises, Inc.
    Inventors: Edward L Cooper, Steven J Hayes
  • Patent number: 11621180
    Abstract: A heating device is provided. The heating device includes a conveyance member, first and second support members, and a heat reflecting plate. The first support member is provided on the conveyance member and supports a substrate during movement of the conveyance member. The second support member includes a heater and supports the substrate during processing of the substrate. The heat reflecting plate travels with the conveyance member and reflects heat from the heater toward the substrate.
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: April 4, 2023
    Assignee: NISSIN ION EQUIPMENT CO., LTD.
    Inventor: Masakazu Adachi
  • Patent number: 11622419
    Abstract: Implementations described herein provide a method for processing a substrate on a substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a substrate. The method includes processing a first substrate using a first temperature profile on a substrate support assembly having primary heaters and spatially tunable heaters. A deviation profile is determined from a result of processing the first substrate. The spatially tunable heaters are controlled in response to the deviation profile to enable discrete lateral and azimuthal tuning of local hot or cold spots on the substrate support assembly in forming a second temperature profile. A second substrate is then processed using the second temperature profile.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: April 4, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Chunlei Zhang, Phillip Criminale, Steven E. Babayan, David Ullstrom
  • Patent number: 11622420
    Abstract: Provided is an apparatus and method for protecting against unsafe electric current conditions. A protections circuit may be used in a device, such as an electric grill, that has one or more electric loads, such as heating elements. The protection circuit may protect against various failure scenarios, including, without limitation, instances of ground fault, over current, driver failure, and failure of a microprocessor. In response to a failure, the protection circuit may trip a latch relay or disable a triac driver to stop current from flowing.
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: April 4, 2023
    Assignee: Weber-Stephen Products LLC
    Inventors: Eric Knappenberger, Julio C. Zuleta, Matthew Lerch, Jeffery C. Emmerich
  • Patent number: 11612269
    Abstract: A system for mixing and dispensing a beverage is provided including a disposable pod containing a solute therein, inflow puncturing cap defining a plurality of spikes extending therefrom, an outflow puncturing cap defining a plurality of puncturing spikes extending therefrom and a translation mechanism for receiving the pod, translating the inflow puncturing cap towards the pod to puncture the pod upper surface and seat the pod proximate the outflow cap spikes. Heated, pressurized solvent fluid is injected into the pod, wherein the solvent and solute mix, causing the pod lower surface to expand against, and be punctured by the outflow puncturing cap spikes. The pod material, and pod thickness may be selected to allow puncture of the pod lower surface after a preferred brewing period has occurred.
    Type: Grant
    Filed: January 30, 2020
    Date of Patent: March 28, 2023
    Inventor: Giancarlo Fantappié
  • Patent number: 11607755
    Abstract: A fixture assembly for supporting a plurality of blanks during a welding operation. The fixture assembly includes a frame. A plurality of electromagnets are positioned on the frame for supporting the blanks and for drawing the blanks toward the electromagnets to secure the blanks into a desired position. A plurality of intensifiers are moveably connected to the frame for selectively overlying the top face of one of the electromagnets for clamping the blank against the electromagnet to intensify a magnetic force provided by the electromagnet. A plurality of electromagnet adjusters are each coupled with the frame and with at least one of the electromagnets for moving the electromagnets relative to the frame. A plurality of adjusting pins are each connected to the frame and moveable relative to the frame for adjusting a position of the blanks.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: March 21, 2023
    Assignee: MAGNA INTERNATIONAL INC.
    Inventors: Andreas Stranz, Florian Hanschmann
  • Patent number: 11597037
    Abstract: A method for producing a component by brazing and a related component are disclosed. The component may include a first part, a second part and a third part, wherein the first part includes a first junction part, the second part includes a second junction part and a cross junction part, and the third part includes a third junction part, and wherein the third junction part has a part and a remaining part. In an embodiment the method includes coupling the first part and the second part to each other by performing a preceding weld in a state of overlapping a part of the first junction part and the second junction part and, after performing the preceding weld, coupling the first part, the second part, and the third part to each other by performing a following weld.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: March 7, 2023
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventor: Ki Eun Kim
  • Patent number: 11602012
    Abstract: A wafer placement table includes: a ceramic member having a wafer placement surface; a mesh electrode buried in the ceramic member; a conductive connection member in contact with the mesh electrode and exposed to outside from a surface of the ceramic member on the opposite side of the wafer placement surface; and an external current-carrying member joined to a surface of the connection member exposed to outside. The mesh electrode has a mesh opening in a region that faces the connection member, and the mesh opening is filled with a sintered conductor being a sintered body of a mixture containing a conductive powder and a ceramic raw material.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: March 7, 2023
    Assignee: NGK Insulators, Ltd.
    Inventors: Yutaka Unno, Shuichiro Motoyama
  • Patent number: 11597034
    Abstract: A joint body includes first and second metal members and a joint portion including a welded portion where the first and second metal members are joined together, the welded portion having a line shape. The joint portion includes first and second longitudinal portions and a plurality of connecting portions. The first longitudinal portion has first intersecting portions arranged in a first direction and extends in the first direction. The second longitudinal portion has second intersecting portions arranged in the first direction and extends in the first direction. The welded portion intersects itself at the first and second intersecting portions. The connecting portions are arranged in the first direction. The connecting portions extend in a first direction and connect the first and second longitudinal portions.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: March 7, 2023
    Assignee: KOBE STEEL, LTD.
    Inventors: Kenichi Watanabe, Kazuya Yasui, Dongyong Shi, Takayuki Kimura, Liang Chen, Masao Hadano, Reiichi Suzuki
  • Patent number: 11597035
    Abstract: Laser ablation processing method for debris-free and efficient removal of materials comprises the step of using a refrigeration device to condense the water vapor and form a thin frost layer on the materials at temperatures below the freezing point. The residual debris produced during the ablation process deposits on the frost layer that covers the material, which is easily removed when the frost layer melts. At the same time, the frost layer in the laser irradiation area melts to a liquid layer, which can effectively reduce the deposition of debris on the inner wall of the groove and thus improve the efficiency and quality of laser ablation. The method is applicable to debris-free laser processing on an arbitrary curved surface.
    Type: Grant
    Filed: September 18, 2020
    Date of Patent: March 7, 2023
    Assignee: Shanghai Institute of Optics And Fine Mechanics, Chinese Academy of Sciences
    Inventors: Yang Liao, Yan Yue, Xuan Wang, Junchi Chen, Yujie Peng, Yuxin Leng
  • Patent number: 11600491
    Abstract: A method of fiber laser processing of thin film deposited on a substrate includes providing a laser beam from at least one fiber laser which is guided through a beam-shaping unit onto the thin film. The beam-shaping optics is configured to shape the laser beam into a line beam which irradiates a first irradiated thin film area Ab on a surface of the thin film, with the irradiated thin film area Ab being a fraction of the thin film area Af. By continuously displacing the beam shaping optics and the film relative to one another in a first direction at a distance dy between sequential irradiations, a sequence of uniform irradiated thin film areas Ab are formed on the film surface defining thus a first elongated column. Thereafter the beam shaped optics and film are displaced relative to one another at a distance dx in a second direction transverse to the first direction with the distance dx being smaller than a length of the irradiated film area Ab.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: March 7, 2023
    Assignee: IPG PHOTONICS CORPORATION
    Inventors: Limanov Alexander, Michael Von Dadelszen, Joshua Schoenly, Manuel Leonardo