Patents Examined by Stephen Jones
  • Patent number: 8779870
    Abstract: A low phase variation attenuator uses a combined attenuation path and a phase network to significantly reduce a phase error between a reference signal and an attenuated signal without degrading the insertion loss. A grounded parallel connection of a resistor and a capacitor is employed in series with an attenuation transistor, which is connected to a middle of a two resistor voltage divider. The two resistor voltage divider includes two resistors of equal resistance that are connected in a series connection. The two resistor voltage divider is connected in a parallel connection with a reference transistor, which functions as a main switch for the transmission or attenuation of a radio frequency (RF) signal.
    Type: Grant
    Filed: October 5, 2011
    Date of Patent: July 15, 2014
    Assignee: International Business Machines Corporation
    Inventors: Pinping Sun, Hanyi Ding, Wayne H. Woods, Jr.
  • Patent number: 8766740
    Abstract: An equalizer for compensating transmission losses of electronic communication signals includes a circuit board and a compensation module. The compensation module includes a pair of input pins, a pair of output pins, and at least two resistors. When a signal transmitted by the circuit board is received by the input pins, a first portion of the signal is directly output from the output pins, a second portion of the signal is reflected by the first resistor and transmitted back to the output pins to output, and a third portion of the signal is reflected by the second resistor and transmitted back to the output pins to output, such that output of the equalizer applies two stages of compensation.
    Type: Grant
    Filed: November 27, 2012
    Date of Patent: July 1, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Po-Chuan Hsieh, Ying-Tso Lai, Cheng-Hsien Lee, En-Shuo Chang
  • Patent number: 8760238
    Abstract: An equalizer for compensating transmission losses of electronic communication signals includes a circuit board and a compensation module. The compensation module includes a pair of input pins, a pair of output pins, first and second resistors, first and second vias, and a pair of micro-strips. When a signal transmitted by the circuit board is received by the input pins, a first part of the signal is directly outputted from the output pins, a second part of the signal is reflected by the first resistor and transmitted back to the output pins to be outputted, and a third part of the signal is reflected by the second resistor and transmitted back to the output pins to be outputted, such that the output of the equalizer applies two stages of compensation.
    Type: Grant
    Filed: December 24, 2012
    Date of Patent: June 24, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Chien-Hsun Chen, Po-Chuan Hsieh
  • Patent number: 8760239
    Abstract: A circuit includes a signal path having a node between a signal path input and a signal path output. A first inductive element is connected between the signal path input and the node and a first capacitive element whose capacitance is variably adjustable is connected between the node and the signal path output. A second variable-capacitance capacitive element is connected between the signal path input and ground. A second inductive element is connected between the node and ground, and a third inductive element is connected between the signal path output and ground.
    Type: Grant
    Filed: October 6, 2009
    Date of Patent: June 24, 2014
    Assignee: Qualcomm Technologies, Inc.
    Inventor: Edgar Schmidhammer
  • Patent number: 8760237
    Abstract: A high-voltage wideband pulse load is provided. The high-voltage wideband pulse load includes an internal line, a dielectric substance, and an external housing. The internal line includes input terminal, connection electrode and a rod resistor. The resistance of the internal line linearly increases along the moving direction of an incoming pulse by the rod resistor. The dielectric substance is coupled to the internal line in a coaxial structure which covers the exterior of the internal line, and is configured to have a shape of a non-linearly decreasing external diameter along the moving direction so that impedance linearly decreases along the moving direction in contrast with the resistance of the internal line. The external housing is coupled to the dielectric substance in a coaxial structure which covers the exterior of the dielectric substance, and is formed of metal.
    Type: Grant
    Filed: December 15, 2011
    Date of Patent: June 24, 2014
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Seung-Kab Ryu, Kyung-Hoon Lee
  • Patent number: 8742868
    Abstract: The invention is related to a microstrip line structure, which comprises: a first microstrip line and a second microstrip line, paralleled with the first mircostrip line for transferring a transmission signal, and a plurality of grooves periodically arranged on both sides of the second microstrip line by using subwavelength, and each period length in the plurality of grooves is smaller than the wavelength of the transmission signal.
    Type: Grant
    Filed: April 29, 2011
    Date of Patent: June 3, 2014
    Assignee: Chung Hua University
    Inventors: Chia-Ho Wu, Tzong-Jer Yang
  • Patent number: 8729981
    Abstract: Precision delay line instruments according to this disclosure may include a plurality of controller activatable delay loops of different delay length design values, and a controller configured to apply a selected delay setting by activating delay loops corresponding to the selected delay setting. The delay length design values may comprise a first set of delay lengths according to a first set of binary step values, and a second set of delay lengths according to a second set of binary step values that is offset from the first set of binary step values. Delay loops corresponding to selected delay settings may be identified in an operating data structure comprising best-fit matched combinations of delay loops that produce more accurate signal delays than one or more other combinations of delay loops.
    Type: Grant
    Filed: May 12, 2011
    Date of Patent: May 20, 2014
    Assignee: Colby Instruments, Inc.
    Inventor: Victor K. Chinn
  • Patent number: 8723615
    Abstract: A non-reciprocal circuit device includes a magnetic core, a permanent magnet that applies a DC field to the magnetic core, a plurality of central conductors that are insulated from each other and cross each other at a specified angle, and at least one subsidiary conductor that is arranged on the magnetic core adjacent to at least one of the central conductors. The subsidiary conductor is magnetically coupled with the central conductor adjacent thereto via the magnetic core.
    Type: Grant
    Filed: August 8, 2013
    Date of Patent: May 13, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hiroshi Nishida, Noboru Kato
  • Patent number: 8717118
    Abstract: Methods for transformer signal coupling and impedance matching for flip-chip circuit assemblies are presented. In one embodiment, a method for providing an inductive coupling between dies may include fabricating a first inductor on a first die using a passive process, fabricating a second inductor on a second die using a semiconductor process, and assembling each die so the first and second inductor are configured as a transformer. In another embodiment, a method for matching impedance in an RF circuit fabricated using flip-chip techniques may include passing an RF input signal through a first inductor formed using a passive process, inducing a time varying magnetic flux in proximity to a second inductor formed using an active process, and passing an RF signal induced by the time varying magnetic flux through the second inductor.
    Type: Grant
    Filed: December 5, 2012
    Date of Patent: May 6, 2014
    Assignee: QUALCOMM Incorporated
    Inventors: Jonghae Kim, Feng Wang, Matthew M. Nowak
  • Patent number: 8704608
    Abstract: A circulator/isolator assembly is disclosed. The assembly includes a first magnetic substrate having first surface and a second surface and a first ground plane formed on the first surface. A dielectric layer is disposed adjacent first magnetic substrate. The dielectric layer includes a multi-port junction circuit coupled to transmission traces. One of the traces forms an input port and another forms an output port. A first magnet is disposed proximate the multi-port junction circuit of the dielectric layer. The first magnet excites a circular, unidirectional magnetic flux field in the first magnetic substrate that limits electromagnetic wave propagation to a single direction.
    Type: Grant
    Filed: December 28, 2012
    Date of Patent: April 22, 2014
    Assignee: The Boeing Company
    Inventors: Ming Chen, Jimmy S. Takeuchi
  • Patent number: 8698573
    Abstract: Provided is an impedance stabilization device having a configuration in which a circuit including a series matching impedance element (11a and 12a (11b and 12b)) and a high-frequency blocking element connected in parallel is inserted in series into at least one of lines (10a (10b)) constituting a power line, and the lines (10a and 10b) are connected via another circuit including a parallel matching impedance element (13) and a low-frequency matching element (14) connected in series. A high-frequency signal passes through the series matching impedance element, a power current passes through the high-frequency blocking element, and the parallel matching impedance element functions as a termination resistor when a terminal on an equipment side is an open end.
    Type: Grant
    Filed: April 12, 2011
    Date of Patent: April 15, 2014
    Assignee: Panasonic Corporation
    Inventor: Yoshio Urabe
  • Patent number: 8692628
    Abstract: In a high-frequency module, an input terminal, an output terminal and a ground terminal, which are arranged so as to be capable of being visually checked, and wiring line electrodes located on a mounting surface are electrically connected to each other by wires and therefore the connection state of a non-reciprocal circuit element to the wiring line electrodes on the mounting surface of the substrate can be easily visually checked and an impedance adjustment between the non-reciprocal circuit element and the wiring line electrodes located on the mounting surface of the substrate on which the non-reciprocal circuit element is mounted or electronic components mounted on the mounting surface can be easily performed by adjusting the lengths of the wires.
    Type: Grant
    Filed: September 17, 2013
    Date of Patent: April 8, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Yoshiyuki Ishiyama
  • Patent number: 8680939
    Abstract: Differential equalizers and systems, methods, and computer products thereof configured and operative to dynamically compensate for signal losses over a wide frequency range by maintaining a relatively constant or consistent differential potential over the frequency range are disclosed. Received signals can be dynamically scaled down based on their frequency content such that all of the signals are outputted at or around a relatively constant amplitude.
    Type: Grant
    Filed: October 20, 2011
    Date of Patent: March 25, 2014
    Assignee: Lockheed Martin Corporation
    Inventors: Robert Trautman, Boris Yost
  • Patent number: 8680941
    Abstract: A microwave harmonic processing circuit includes (n?1) parallel open ended stubs differing in length, connected in parallel to an output terminal of a serial transmission line at a single point, and having predetermined electrical lengths corresponding to second to higher n-th (n is any integer) harmonics, respectively, the serial transmission line having an input terminal connected to an output terminal of a transistor and having a predetermined electrical length; a first strip conductor connecting the serial transmission line to two parallel open ended stubs of the (n?1) parallel open ended stubs at a single connecting point; a second strip conductor connecting the (n?3) parallel open ended stubs to each other at a single connecting point; a ground layer disposed between first strip conductor and second strip conductor; and a via electrically connecting a connecting portion of first strip conductor and a connecting portion of second strip conductor.
    Type: Grant
    Filed: September 7, 2010
    Date of Patent: March 25, 2014
    Assignee: The University of Electro-Communications
    Inventors: Kenta Kuroda, Kazuhiko Honjo
  • Patent number: 8680940
    Abstract: Methods and devices for modifying a tunable matching network are disclosed. In one aspect, a method of modifying a tunable matching network can include connecting one or more shunt inductors to a tunable matching network exhibiting parasitic capacitance to ground, whereby high-frequency performance of the tunable matching network is improved.
    Type: Grant
    Filed: January 14, 2011
    Date of Patent: March 25, 2014
    Assignee: Wispry, Inc.
    Inventor: Arthur S. Morris, III
  • Patent number: 8674783
    Abstract: Methods for generating a look-up table relating a plurality of complex reflection coefficients to a plurality of matched states for a tunable matching network. Typical steps include measuring a plurality of complex reflection coefficients resulting from a plurality of impedance loads while the tunable matching network is in a predetermined state, determining a plurality of matched states for the plurality of impedance loads, with a matched state determined for each of the plurality of impedance loads and providing the determined matched states as a look-up table. A further step is interpolating the measured complex reflection coefficients and the determined matching states into a set of complex reflection coefficients with predetermined step sizes.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: March 18, 2014
    Assignee: BlackBerry Limited
    Inventors: John Hanford Spears, Wayne Eric Smith, Yongfei Zhu, Chenggang Sui
  • Patent number: 8674782
    Abstract: An adaptive impedance matching module having an adjustable impedance matching network with an input for receiving an RF power source and an output to be connected to an antenna, and first and second voltage measurement device configured to sense a voltage at respective first and second nodes on the impedance matching network. A network adjuster circuit is provided to switch the impedance matching network between a first state where first and second voltages are sensed on the respective first and second nodes and a second state where third and fourth voltages are sensed on the respective first and second nodes. Processing circuitry is provided which determines the matched load impedance based upon the first, second, third and fourth sensed voltages and including matching adjustment circuitry configured to adjust the matching impedance in the event the matched load impedance differs from a target load impedance by more that a predetermined amount.
    Type: Grant
    Filed: March 31, 2011
    Date of Patent: March 18, 2014
    Assignee: Texas Instruments Incorporated
    Inventors: William O. Keese, Sa{hacek over (s)}a Radovanović, Daniel L. Simon
  • Patent number: 8669830
    Abstract: Embodiments of the present invention are directed to providing an increased trace width when traversing a void in another layer in a printed circuit board or package design. By increasing the trace width or alternatively increasing the capacitance, the degradation due to the void can be reduced. This approach works for microstrip, stripline as well as other transmission lines that use a reference plane. The void can be the result of an antipad associated with a via, or any other disruption in an otherwise uniform reference plane.
    Type: Grant
    Filed: January 14, 2011
    Date of Patent: March 11, 2014
    Assignee: Broadcom Corporation
    Inventor: Shengli Lin
  • Patent number: 8669827
    Abstract: The present invention is directed to a circuit assembly that includes an integrated circulator assembly. The circuit assembly has a first substrate, which contains a continuous circuit trace that includes a circulator component from the circulator assembly and at least one electrical component from the circuit assembly. A second substrate is disposed beneath the first substrate and includes a cladding on one surface. The second substrate contains an aperture that accepts a ferrite element, which is axially aligned with the circulator component of the circuit trace. A conductive material is placed across the ferrite element so that it forms a continuous ground plane with the cladding, which is common to the entire circuit trace. The circulator assembly also contains a magnet bonded to the ferrite element. The circulator assembly may also include a yoke disposed below the magnet to shield the circulator from external magnetic fields.
    Type: Grant
    Filed: July 19, 2013
    Date of Patent: March 11, 2014
    Assignee: EMS Technologies, Inc.
    Inventors: David J. Popelka, Joseph Todd Vaughn, John D. Voss
  • Patent number: 8659370
    Abstract: An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack.
    Type: Grant
    Filed: July 19, 2013
    Date of Patent: February 25, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Noboru Kato, Shigeru Tago, Jun Sasaki, Junichi Kurita, Satoshi Sasaki