Abstract: According to certain aspects of the present disclosure, a system includes a heat-generating component and a thermal wake suppressor positioned downstream from the heat-generating component. The heat-generating component produces a thermal wake in a downstream direction. The thermal wake suppressor includes a spacing grid and a plurality of twist plates extending from the spacing grid at an angle. The spacing grid is defined by a plurality of longitudinal ribs and a plurality of transverse ribs that form a plurality of intersections. The plurality of twist plates is periodically arranged on the plurality of longitudinal ribs and the plurality of transverse ribs, such that a subset of the plurality of twist plates is arranged to break apart the thermal wake into sub-vortexes in the downstream direction.

Abstract: A method and system controls cooling system leaks in a rack. The method includes monitoring leak detection sensors positioned at computer systems and below sections of a liquid conveyance system. In response to determining if a signal was received from one of the leak detection sensors that is indicative of a leak, the leak detection sensor and the corresponding one of the plurality of computer systems associated the received signal is determined. Power is disconnected to the corresponding one of the computer systems and a signal is transmitted to implement moving first and second valves from open to closed positions. The first valve is positioned within the liquid conveyance system between a hot rack manifold and a thermal contact structure associated with the computer system associated with the received signal. The second valve is positioned within the liquid conveyance system between a cool rack manifold and the thermal contact structure.

Abstract: The invention relates to a conducting track fuse (1) for an electrical or electronic device, comprising: a first and a second connection region (2a, 2b); a nonlinearly extending burn-out region (3), which is arranged between the first and second connection regions (2a, 2b); and a covering element (15), which has at least two side walls (9) and a covering face (8), which covering element is arranged over the first and second connection regions (2a, 2b) and over the burn-out region (3), the burn-out region (3) and the covering element (5) being arranged relative to each other in such a way that the area of the covering face (8) covers the burn-out region (3) and a cavity (7) is formed between the burn-out region (3) and the covering face (8) as a result of the height of the side walls (9).

Abstract: Example implementations relate to a fluid cooling assembly for a computing system, and a tool-less method of installing the fluid cooling assembly to the computing system. The fluid cooling assembly includes a plurality of cooling components, and a fluid chamber having a plurality of first fluid connectors. Further, each cooling component includes a plurality of second fluid connectors. Each first fluid connector or each second fluid connector includes a first end to protrude beyond a first surface of a circuit board of the computing system, and a second end to protrude beyond a second surface of the circuit board. Further, the first end of each first fluid connector is connected to the first end of a respective second fluid connector via the circuit board, to establish a parallel fluid flow path between the fluid chamber and each of the plurality of cooling components.

Abstract: Provided are approaches for integrating solenoids and fuses within a compact housing. In one approach, a fuse apparatus (100) may include a housing (102) including a main body (104), a cover (106) coupled to a first side (110) of the main body (104), and a base (112) coupled to a second side (116) of the main body (104), wherein the cover (106) and the main body (104) define a fuse cavity (120), and wherein the base (112) and the main body (104) define a main cavity. (122) The fuse apparatus (100) may further include a plurality of fuses (124) disposed within the fuse cavity (120), and a plurality of solenoids (130) electrically connected to a printed circuit board (PCB) (132), wherein the plurality of fuses (124) is disposed above the PCB (132), and wherein the PCB (132) is positioned within the main cavity (122).

Abstract: A miniature circuit breaker, which includes a circuit breaker housing, a button mechanism, and an indicating apparatus. The circuit breaker housing includes an indicating hole arranged in one side thereof, the button mechanism is in sliding fit with the circuit breaker housing, the indicating apparatus is in driving fit with the button mechanism, and when the button mechanism is pressed to switch on the miniature circuit breaker, the button mechanism drives the indicating apparatus to shield the indicating hole. The indicating apparatus thereof may indicate a switching-on state of the circuit breaker when the circuit breaker is switched on, thus improving a safety of electricity consumption.

Abstract: A computing rack apparatus which reduces the manufacturing cost by simplifying the structure thereof and in which the temperature of the internal air is utilized in the cooling unit is disclosed. The apparatus comprises: a rack housing which houses a server, a rack frame which is disposed inside the rack housing and on which the server is fastened and mounted; and a cooling unit which has a discharge port which is disposed inside the rack housing and discharges cooling air and a suction port which sucks the internal air through a cooling zone, wherein the discharge port is located in a first region with respect to a boundary portion defined by a front surface of the server, and the suction port is located in a second region with respect to the boundary portion, and the first and second regions form the cooling zone.

Abstract: Field serviceable display assemblies are provided. Multiple side assemblies are mounted to a structural framework in a moveable manner, each including a channel located between a transparent layer and an electronic display, which is located behind the transparent layer. A fixed structure is positioned within a cavity located within the structural framework and between the side assemblies. The fixed structure remains stationary when the side assemblies are moved between a closed position where the cavity is enclosed, and an opened position where the fixed structure is exposed to facilitate direct access to electronic components located thereon.

Abstract: A circuit breaker device includes a bimetallic overcurrent protection element which is configured to be placed in series with an integrated replaceable fuse. The replaceable fuse may be faster-acting than the bimetallic overcurrent protection element, and may be higher-rated than the bimetallic overcurrent protection element. The circuit breaker device may include an electrically isolated terminal stud having a height sufficient to retain the replaceable fuse thereon, the electrically isolated terminal stud not directly connected to the bimetallic overcurrent protection element, so that current can only flow through the bimetallic overcurrent protection element when a replaceable fuse comprising an intact fuse element is supported on the electrically isolated terminal stud.

Abstract: An apparatus for dissipating heat from a photonic transceiver module. The apparatus includes a top-plate member disposed in a length direction of a package for the photonic transceiver module. The apparatus further includes multiple fins formed on the top-plate member along the length direction from a backend position to a frontend position except at least one fin with a shorter length, forming an elongated void from the backend position to one backend of the at least one fin. Additionally, the apparatus includes a cover member disposed over the multiple fins with a horizontal sheet, two vertical side sheets, and a flange bent vertically from a middle portion of backend of the horizontal sheet. Furthermore, the apparatus includes a spring loaded in the elongated void between the flange and the one backend of the at least one fin to minimize an air gap at the backend of the horizontal sheet.

Abstract: The present disclosure provides a multifunctional fuse. The multifunctional fuse includes a fuse element, a pre-charging resistor, and an inner housing. The inner housing is provided with a receiving cavity, the fuse element is received in the receiving cavity, and the pre-charging resistor is wound around an outer side of the inner housing and is in contact with the inner housing. The multifunctional fuse of the present disclosure resolves problems of large volumes and high costs of a pre-charging resistor and a fuse in a high voltage circuit in the related art.

Abstract: Provided are a protecting device capable of safely and quickly interrupting a current path by restricting heat absorption to a lower case, and a battery pack using the same. A protecting device includes: a meltable conductor 3; and a housing 6 including a lower case 4 and an upper case 5, the housing being formed by joining the lower case 4 and the upper case 5, and the lower case 4 is provided with a recessed portion 23 having support portions 21 provided at opposing side edges of the recessed portion 23 and hollow portions 22 provided on the side edges substantially orthogonal to the side edges of the recessed portion 23 on which the support portions 21 are provided.

Abstract: An electronic device includes a heat emitting element disposed on a circuit board and a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1 degrees Celsius per Watt (° C./W).

Abstract: A cooling system for use with a liquid to cool a computing device. The cooling system includes a first internal heat exchanger positioned within an enclosure of the computing device. The first internal heat exchanger is configured to receive a first portion of the liquid, flow the first portion through the first internal heat exchanger to dissipate heat from air flowing over the first internal heat exchanger, and discharge the first portion. The cooling system further includes a first fan operable to recirculate air through the enclosure to absorb heat produced by a plurality of components of the computing device and flow the heated air over the first internal heat exchanger to dissipate the heat.

Abstract: Methods, systems, and devices for designing and implementing cooling fluid distribution in a computing environment such as a data center as disclosed. The disclosed design may reduce the impact cooling fluid leaks may have on the computing environment and other rack based systems. The disclosed methods and systems may include structures for containing cooling fluid leaks and detecting cooling fluid leaks. The structures may be movable between positions in which connectors for forming fluid connections are exposed and positions in which the connectors are contained. Containing and detecting cooling fluid leaks may allow for proactive action prior to significant damage to the computing environment.

Abstract: A display assembly with integrated electric vehicle charging equipment includes a first and second side assembly connected to a structural frame, each including an electronic display subassembly located behind a cover. The electric vehicle charging equipment is connected to the structural frame between said first and second side assemblies in an at least partially recessed manner. Open or closed loops of air may be provided for cooling the first and second side assemblies and the electric vehicle charging equipment, which may all be connected to a common power source.

Abstract: The invention provides a holder for snap-fitting a thermal fuse to an electronic component, wherein the holder comprises: a bottom surface for mounting the holder to a carrier comprising the electronic component, wherein the bottom surface comprises an opening for accommodating the electronic component; a first wall parallel to a second wall, wherein the first wall and the second wall each comprise a protrusion for snap-fitting the thermal fuse to the electronic component; a third wall, wherein the third wall comprises an edge for bending around at least one lead of the thermal fuse, wherein a shortest distance between the bottom surface and said edge is larger than a shortest distance between the bottom surface and one of said protrusion.

Abstract: Electronic rack and data center thermal management systems are disclosed. An electronic rack system includes a heat exchange system and the electronic rack having a plurality of servers containing heat-generating components. The heat exchange system includes a filter and a pump to circulate filtered cooling fluid to the electronic rack, via an internal cooling loop. An external cooling loop provides a backup cooling fluid supply to the electronic rack to function as a redundant system for the heat exchange system. The external cooling loop includes an external cooling fluid pump and filter, and is coupled to the internal cooling fluid supply via a valve. The cooling fluid in the internal cooling fluid loop, and its associated filter, are of a higher quality than the cooling fluid and filter of the external cooling fluid loop. In one embodiment, the external cooling loop filter is a high quality filtration system.

Abstract: A chip on film package includes: a flexible base film having a first surface and a second surface opposite to each other, and having a chip mounting region on the first surface; a plurality of wirings extending in a first direction toward the chip mounting region; a semiconductor chip mounted in the chip mounting region on the first surface of the base film and electrically connected to the wirings; a pair of first heat dissipation members on the first surface of the base film and spaced apart from the semiconductor chip, and extending in a second direction perpendicular to the first direction; and a second heat dissipation member on the first surface of the base film and covering the semiconductor chip and the pair of first heat dissipation members.

Abstract: A liquid cooling arrangement for peripheral board incorporates cooling plates on one side and resilient cushion on the opposite side and enclosing the peripheral board between the cooling plates and the cushion. The cushion exerts pressure on the backside of the peripheral board to ensure physical contact of the microchips and the cooling plates for good thermal conductance. Cooling hoses are connected to the cooling plates to circulate cooling liquid. An electrically insulating layer may be included between the backside of the peripheral board and the cushion. An extension frame may optionally be added onto the cooling frame to house the cooling houses and increase the variability of deployments.